The present invention is a substrate for a display, the substrate having a film B including a polysiloxane resin on at least one surface of a film A including a polyimide resin, wherein the film B contains inorganic oxide particles therein, and the present invention has an object to provide a substrate for a display: being able to be applied to a color filter, an organic EL element, or the like without the need to carry out any complex operations; allowing high-definition displays to be manufactured; and being provided with a low CTE, a low birefringence, and flexibility.

The present invention is a substrate for a display, the substrate having a film B including a polysiloxane resin on at least one surface of a film A including a polyimide resin, wherein the film B contains inorganic oxide particles therein, and the present invention has an object to provide a substrate for a display: being able to be applied to a color filter, an organic EL element, or the like without the need to carry out any complex operations; allowing high-definition displays to be manufactured; and being provided with a low CTE, a low birefringence, and flexibility.

Methods and apparatus for vapor deposition of an organic film are configured to vaporize an organic reactant at a first temperature, transport the vapor to a reaction chamber housing a substrate, and maintain the substrate at a lower temperature than the vaporization temperature. Alternating contact of the substrate with the organic reactant and a second reactant in a sequential deposition sequence can result in bottom-up filling of voids and trenches with organic film in a manner otherwise difficult to achieve. Deposition reactors conducive to depositing organic films are provided.

A curing apparatus and a curing method are provided. The curing apparatus comprises: a chamber, configured for accommodating a substrate provided with a polyimide adhesive; an air extracting unit, configured for evacuating the chamber; and a heating unit, configured for performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber during a evacuating process of the air extracting unit so as to remove organic gases from the polyimide adhesive, and performing a second heating on the substrate after the first heating so as to cure the polyimide adhesive.

Disclosed is a method for producing a polyimide laminate, the method including the steps of applying a polyimide precursor solution onto a substrate and heating the polyimide precursor solution, to thereby form a polyimide film layer on the substrate. The substrate is any plate selected from a glass plate, a metal plate, and a ceramic plate. The heating step includes irradiation with far infrared rays using an infrared heater that generates a maximum radiant energy at an infrared wavelength of 3.5 to 6 m. The highest heating temperature is preferably 350 to 550 C. The time required to increase the temperature from 180 to 280 C. during a temperature-increasing process is preferably 2 minutes or longer.

Methods and apparatus for vapor deposition of an organic film are configured to vaporize an organic reactant at a first temperature, transport the vapor to a reaction chamber housing a substrate, and maintain the substrate at a lower temperature than the vaporization temperature. Alternating contact of the substrate with the organic reactant and a second reactant in a sequential deposition sequence can result in bottom-up filling of voids and trenches with organic film in a manner otherwise difficult to achieve. Deposition reactors conducive to depositing organic films are provided.

A method for producing a polyimide resin film, including: a coating step of forming a coated film by coating a polyimide resin composition containing a polyimide resin, an antioxidant, and a solvent on a substrate; and a drying step of drying the coated film in air at 180 C. or more, the antioxidant being a phenol-based antioxidant, and a content of the phenol-based antioxidant being 0.05 part by mass or more per 100 parts by mass of the polyimide resin.

Display substrates having a hard coat layer on a colorless polyimide substrate are formed from hard coat compositions having certain organic solvents that do not substantially impact the optical and mechanical properties of the colorless polyimide substrate.

This resin composite laminate includes a urethane resin layer containing a urethane resin which has a urethane bond and a siloxane bond, has a weight average molecular weight of 52,200 to 260,000, and is soluble in a solvent, and a polyimide resin layer containing a polyimide resin having an imide bond, and a peel strength between the urethane resin layer and the polyimide resin layer is 1.6 N or more per 10 mm in width.

A method of forming a functionalized device substrate is provided that includes the steps of: forming a conductive layer on a growth substrate; applying a polymeric layer to a device substrate, wherein a coupling agent couples the polymeric layer to the device substrate; coupling the polymeric layer to the conductive layer on the growth substrate; and peeling the growth substrate from the conductive layer.