There are provided a vibrator and an electronic device including the same. The vibrator includes: a housing having an internal space; an elastic member having both ends fixed to the housing so as to be disposed in the internal space in a state in which elastic deformation is possible; and a piezoelectric element mounted on one surface of the elastic member, wherein the piezoelectric element is fixed to the elastic member by soldering.

The invention relates to a cleaning device with a frame that can be driven on a ground surface and with a vibrating screen which is mounted on the frame such that it can be moved to a limited extent and which is connected to a contact element. A vibrating roller is attached to the frame such that it can be rotated about a rotary axis, and it has an outer surface, in which radial elevations are formed. A pre-tensioning element pre-tensions the vibrating screen such that the contact element lies against the vibrating roller.

An ultrasonic device includes an ultrasonic transducer that has a vibration film and transmits an ultrasonic wave from a first surface side of the vibration film, an acoustic matching layer that is provided on the first surface side of the vibration film, and an acoustic lens that is provided on the acoustic matching layer on an opposite side to the vibration film, in which the acoustic matching layer is formed of even-numbered layers including a first layer and a second layer having acoustic impedance lower than acoustic impedance of each of the first layer and the acoustic lens, and the first layer and the second layer are disposed in this order toward the acoustic lens from the vibration film, and in which each of the first layer and the second layer has a thickness corresponding to an odd-numbered multiple of λ/4 with a wavelength of the ultrasonic wave as λ.

An ultrasonic device includes an ultrasonic transducer that has a vibration film and transmits an ultrasonic wave from a first surface side of the vibration film, an acoustic matching layer that is provided on the first surface side of the vibration film, and an acoustic lens that is provided on the acoustic matching layer on an opposite side to the vibration film, in which the acoustic matching layer is formed of even-numbered layers including a first layer and a second layer having acoustic impedance lower than acoustic impedance of each of the first layer and the acoustic lens, and the first layer and the second layer are disposed in this order toward the acoustic lens from the vibration film, and in which each of the first layer and the second layer has a thickness corresponding to an odd-numbered multiple of λ/4 with a wavelength of the ultrasonic wave as λ.

A filtering apparatus formed by a plurality of channel systems. Each of the channel systems include an inlet port formed on an inlet side of the plate; no more than one outlet port formed on an outlet side of the plate; and a channel formed in the plate, the channel coupled to the inlet port and to the outlet port, wherein the ratio of the product of the capture area of the inlet ports of a channel system with the first transmissivity associated with the inlet ports to the product of the capture area of the outlet ports of a channel system with the second transmissivity associated with the outlet ports is greater than one. The channel system is configured to interact with objects of interest on a scale which is smaller than a value several orders of magnitude larger than the mean free path of an object of interest. Some plate embodiments are configured to interact with particles, such as air molecules, water molecules, or aerosols. Other plate embodiments are configured to interact with waves or wavelike particles, such as electrons, photons, phonons or acoustic waves.

A filtering apparatus formed by a plurality of channel systems. Each of the channel systems include an inlet port formed on an inlet side of the plate; no more than one outlet port formed on an outlet side of the plate; and a channel formed in the plate, the channel coupled to the inlet port and to the outlet port, wherein the ratio of the product of the capture area of the inlet ports of a channel system with the first transmissivity associated with the inlet ports to the product of the capture area of the outlet ports of a channel system with the second transmissivity associated with the outlet ports is greater than one. The channel system is configured to interact with objects of interest on a scale which is smaller than a value several orders of magnitude larger than the mean free path of an object of interest. Some plate embodiments are configured to interact with particles, such as air molecules, water molecules, or aerosols. Other plate embodiments are configured to interact with waves or wavelike particles, such as electrons, photons, phonons or acoustic waves.

A method for manufacturing a millimeter scale electromechanical device includes coupling a stainless steel ply to a polymer carrier ply, coating the stainless steel ply in a photo resist material, masking the photoresist material, exposing the photoresist material to cure a portion of the photoresist material, developing the photoresist material to remove uncured photoresist material from the stainless steel ply, chemically etching the stainless steel ply to remove a patterned portion of the stainless steel ply, dissolving the polymer carrier ply to release unwanted chips of the stainless steel ply, and adhering the patterned stainless steel ply to a flexible material ply to form a sub-laminate.

A method for manufacturing a millimeter scale electromechanical device includes coupling a stainless steel ply to a polymer carrier ply, coating the stainless steel ply in a photo resist material, masking the photoresist material, exposing the photoresist material to cure a portion of the photoresist material, developing the photoresist material to remove uncured photoresist material from the stainless steel ply, chemically etching the stainless steel ply to remove a patterned portion of the stainless steel ply, dissolving the polymer carrier ply to release unwanted chips of the stainless steel ply, and adhering the patterned stainless steel ply to a flexible material ply to form a sub-laminate.

A modular sonic vibration buffer system includes an adapter assembly that can be attached to a sonic vibration device. The adapter assembly includes a body with apertures and a plate with arms that are received in the apertures of the body to couple the plate to the body. A cleaning tool is secured between the body and the plate to couple the cleaning tool to the adapter assembly. The sonic vibration device is operable to vibrate the cleaning tool via the adapter assembly. The system also includes additional adapter assemblies and cleaning tools with different characteristics that are attachable to the sonic vibration device in a modular nature for different cleaning or buffering applications.

A modular sonic vibration buffer system includes an adapter assembly that can be attached to a sonic vibration device. The adapter assembly includes a body with apertures and a plate with arms that are received in the apertures of the body to couple the plate to the body. A cleaning tool is secured between the body and the plate to couple the cleaning tool to the adapter assembly. The sonic vibration device is operable to vibrate the cleaning tool via the adapter assembly. The system also includes additional adapter assemblies and cleaning tools with different characteristics that are attachable to the sonic vibration device in a modular nature for different cleaning or buffering applications.