A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

A cleaning tool for cleaning an optical connector includes: a head that presses a cleaning unit against the optical connector; a supply reel that supplies the cleaning unit to the head; and a take-up reel that collects the cleaning unit from the head. The supply reel and the take-up reel are disposed rotatably about a common rotation shaft.

An exposure module includes a light source, a photomask situated optically downstream of the light source, and a wafer table situated optically downstream of the photomask. The wafer table includes a plurality of silicon carbide (SiC) crystalline structures separated from each other by trenches. The exposure module further includes a cleaning scrubber operative to clean the wafer table. The cleaning scrubber includes a circular surface and a plurality of microstructures extending from the circular surface. The microstructures are tapered from a first width to a second width in a direction away from the circular surface. The second width is less than a width of the plurality of trenches between the SiC crystalline structures of the wafer table.

A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.

Methods and apparatus for cleaning a central venous catheter port are disclosed. An apparatus includes a body, a coupling configured to connect the body to the hub, a cleaning cap coupled to the body, and an actuator disposed within the body for rotating and translating the cap relative to the hub. The cleaning cap includes a cap body defining a cavity and a cleaning member disposed within the cavity, the cleaning member having threads that engage with the threads on the hub.

A method and device for cleaning and pretreating solar panels is provided. The device comprises a brush having cleaning elements made from silicone foam rubber material. The cleaning elements can be flaps of silicone foam rubber material. A sheet of silicone foam rubber material having two free ends can be attached to a core member such that the two free ends extend away from the core member to form flaps. The solar panels can be cleaned by brushing the solar panel surfaces with the flaps of silicone foam rubber material. The solar panels can also be pretreated by brushing the solar panel surfaces with silicone foam rubber material.

Provided are a wiper for a machine tool and a method for manufacturing a wiper for a machine tool, which can simplify a manufacturing process. A wiper for a machine tool mountable on a machine tool includes: a wiper body fixable to the machine tool, and made of a first elastic material having hardness of 80 degrees or more; and a sliding part made of a second elastic material containing a particulate reinforcing material and having hardness in a range of 50 degrees or more and 90 degrees or less which is smaller than the hardness of the first elastic material, the sliding part being provided integrally with the wiper body, wherein the wiper body and the sliding part are integrally formed without an adhesive.

A windshield wiper system for an aircraft is provided and includes a motor, an output shaft, a wrap spring and crank rocker mechanism (WSCRM) to which the motor and the output shaft are coupled and a controller. By way of the WSCRM, first directional rotation input to the WSCRM from the motor via a two-stage gear reduction is converted such that the output shaft drives wiper blade oscillation through a first sweep angle and second directional rotation input to the WSCRM from the motor is converted such that the output shaft drives wiper blade oscillation through a second sweep angle. The controller is configured to control the motor such that the first directional rotation is continuously or non-continuously input during first or second flight conditions, respectively, and the second directional rotation is continuously input during third flight conditions.

The present disclosure provides a device and a system for cleaning glass substrates with different dimensions. The device includes a rack (1); conveying rollers (2) rotatably disposed on the rack (1); a limiting assembly (4) including a first roller (41) and a second roller (42), the first roller (41) being fixed on a first connecting rod (43), and the second roller (42) being fixed on a second connecting rod (44), and the first connecting rod (43) and the second connecting rod (44) being movable along an axial direction of the conveying roller (2); a driving device (5) for driving the conveying rollers (2), the first roller (41) and the second roller (42) to rotate; a cleaning assembly (6) including an upper cleaning box (61) and a lower cleaning box (62), and the upper cleaning box (61) and the lower cleaning box (62) being both provided with nozzles.

A self-cleaning device of the present disclosure includes: a cleaning member configured to clean a cleaning tool that cleans a substrate; and an injection unit configured to inject a liquid toward the cleaning member or the cleaning tool. The cleaning member has a cleaning surface that cleans the cleaning tool when the cleaning tool is pressed thereagainst, and the cleaning surface is inclined with respect to a horizontal plane.