A substrate cleaning apparatus includes a porous suction part having a polygonal pillar shape with a plurality of cleaning surfaces, a transfer unit to transfer a substrate with a plurality of semiconductor devices toward the porous suction part, and to contact the semiconductor devices with one of the plurality of cleaning surfaces, and a rotation driving part to rotate the porous suction part.

A roasting and glazing apparatus includes a housing having a top peripheral surface with an opening defined by an interior edge, a roaster bowl movable from within the housing, through the opening, to an elevated position above the housing, and a pour tray configured to detachably couple to the interior edge, and to receive and guide a fluid exiting the roaster bowl when the roaster bowl is in the elevated position. The pour tray has a bottom surface and a mounting bracket extending from the bottom surface. The mounting bracket is configured to detachably couple to the interior edge of the housing defining the opening. In an assembled configuration, the bottom surface of the pour tray is oriented at an angle relative to the top peripheral surface of the housing and supported by a shoulder or side peripheral surface of the housing.

Described herein is a method for removing deposits off a surface of a chamber component. The method includes receiving a chamber component, and fixing the chamber component in a fixture. A slurry is then applied to a surface of the chamber component, where the slurry has a pH of about 5 to about 9. The surface is then polished using a polish pad and the slurry. The surface roughness of the surface after polishing is within about 10% of the surface roughness before polishing, and wherein deposits on the surface of the chamber component are removed by polishing. An alternative method for removing deposits is also presented, wherein the chamber component is heated to a temperature of about 500 C. to about 1500 C.

A cleaning method includes controlling an unmanned aerial vehicle (UAV) to fly to a region of a wall body according to a path to be cleaned, and, in response to detecting a cleaning prohibition identifier associated with the region, recognizing the region as a cleaning prohibition region and controlling the UAV to fly over the cleaning prohibition region without cleaning the cleaning prohibition region.

A substrate cleaning apparatus for cleaning a substrate while rotating the substrate and placing a cleaning member in contact with the rotating substrate is disclosed. The substrate cleaning apparatus comprises: a self-cleaning member mounted to an arm supporting the cleaning member, the self-cleaning member being configured to come into contact with the cleaning member to perform self-cleaning of the cleaning member; and a moving mechanism mounted to the arm supporting the cleaning member, the moving mechanism being configured to move the self-cleaning member between a position where the self-cleaning member is in contact with the cleaning member and a position where the self-cleaning member is separated from the cleaning member.

The invention discloses a cleaning apparatus for a mouse pad, which comprises a machine body. The machine body is provided with a slot with an opening facing upwards. A clip block is inserted into the slot. The clip block is provided with a clip slot. The upper side of the clamping groove is provided with a sliding groove, and a slide plate is slidably arranged in the sliding groove. The left and right ends of the slide plate are fixed with resetting components for resetting the slide plate. The upper end surface of the slide plate is provided with a pull rod. The invention is easy to operate, and the mouse pad is cleaned by soaking, scrubbing, washing, and drying processes. In this process, the degree of automation is high, manpower is saved, and the cleaning time is shortened. The mouse pad after cleaning can be used directly, which is convenient and convenient. Efficient.

Disclosed herein is an apparatus for adjusting the installation location of a temperature sensor configured to measure the surface temperature of a wafer in a semiconductor wafer cleaning apparatus. The apparatus includes: a bracket which is disposed in the upper end of the side wall of each of multi-station processing chambers (MPCs); a first fastening member which fastens a cable; a second fastening member which fastens a temperature sensor; a location adjustment member which fastens and supports the temperature sensor; the temperature sensor which is fixedly coupled to an end of the location adjustment member; a jig which includes a location adjustment plate and a control substrate, and which adjusts the detection location of the temperature sensor; and a controller which is provided with a wafer surface monitoring system configured to separate the surface temperature into a plurality of channels and to display the surface temperature.

To provide a composition for rinsing or cleaning a surface to which ceria particles are attached and a surface treatment method for removing ceria particles from the surface using the same.

The composition according to the present invention contains an anionic surfactant, an organic amine compound, and a protic organic acid molecule and has a pH of less than 6.

A surface washing drone with a modular cleaning head unit. The surface washing drone may also include a safety failover mechanism. The surface washing drone communicates and works together with other surface washing drones in a group.

A system for removing debris from a surface of a substrate, the system including a cantilever arm and a tip supported by the cantilever arm. The tip has a proximal portion and a distal portion such that the tip is supported by the cantilever arm via the proximal portion. The system further includes at least one nanofibril attached to the distal portion of the tip, and the at least one nanofibril is configured to elastically deform against or around the debris or the surface of the substrate.