An automatic nozzle cleaning-inspection management system includes a nozzle plate on which target nozzles to be cleaned are arranged, a cleaning chamber including a cleaning portion which cleans the target nozzles, a drying chamber including a drying portion which dries the target nozzles, an inspection chamber including an inspection portion which checks cleaned states of the target nozzles, and a transferring portion which transfers the nozzle plate, wherein the cleaning chamber, the drying chamber, and the inspection chamber are sequentially arranged in a line.

A device for cleaning cords, cables, lines, strings, wires, ropes, and the like includes first and second angled sections. The angled sections can be substantially perpendicular to each other. The first section can include substantially parallel panels, and a substantially U-shaped opening can be formed in each panel. The openings are partially aligned with each other such that the cord, cable, line, string, wire or rope can be positioned therethrough. The device can be used to clean feeder/drinker lines in poultry houses.

Systems and methods are provided for cleaning a cloth or fabric that has been used for growing plants. The cloth or fabric may be separated from or mounted with respect to a tray or support during the cleaning operation. At least two opposed, rotating brushes engage the top and bottom surfaces of the cloth or fabric to abrade and clean those surfaces. In addition, spray units, e.g., high pressure fluid nozzles, may direct cleaning fluid against one or both surfaces of the cloth or fabric. Filtration and sterilization systems may also be associated with the cleaning operation.

The present disclosure discloses a method and an apparatus for removing a conductive film. The method includes: providing a display panel with the conductive film to be removed; treating the conductive film to be removed on the display panel by using a laser; and cleaning the display panel after the treating by using the laser.

A cleaner finger assembly for cleaning compactor teeth on a compactor wheel of a compactor machine includes at least one cleaner finger assembly. The cleaner finger assembly includes a cleaner finger stack and a plurality of fasteners for mounting the cleaner finger stack. The cleaner finger stack includes at least one cleaner finger with a longitudinal axis, a tip for engaging a compactor wheel surface, and a plurality of mounting apertures. The cleaner finger also includes a notch extending from an edge of the cleaner finger toward the longitudinal axis. The cleaner finger failing at the location of the notch when the cleaner finger tip is engaged by debris with a tension force greater than a tip anchor tension capacity of the finger tip anchoring mechanism.

Provided is a double-station cleaning system comprising a cleaning machine, wherein workpieces are placed into the feeding frames, the feeding frames are placed into trays, the bracket assembly is pushed to drive the trays to move along the guide rail assembly, the feeding frame in one of the trays is conveyed to a feeding inlet of the cleaning machine, the feeding frame is pushed to move along two rows of nylon wheels and linear guide rails inside the cleaning machine, and the feeding frame and the workpieces in the feeding frame are pushed into the cleaning machine so as to be cleaned. The double stations work alternately, so that the work time is saved, and the work efficiency is increased.

A peeling device includes a peeling member and a cover member. The peeling member peels a recording medium, to which an unfixed developer has been transferred from an image holding member, from the image holding member. The leading end of the peeling member contacts the image holding member. The cover member covers a surface of the peeling member with a gap interposed between the peeling member and the cover member. The surface of the peeling member includes at least the leading end of the peeling member, and includes at least a surface of the peeling member on the side opposite to the image holding member.

The present disclosure discloses a cleaning device and a clean method, the cleaning device includes a sweeping module and a washing module, the sweeping module includes a brush component and a steam generating component, the steam generating component and the brush component are arranged in sequence in the cleaning direction of the cleaning device; the washing module is configured to wash the parts to be cleaned, the washing module and the sweeping module are arranged in sequence in the cleaning direction of the cleaning device.

A post CMP cleaning apparatus is provided. The post CMP cleaning apparatus includes a cleaning stage. The post CMP cleaning apparatus also includes a rotating platen disposed in the cleaning stage, and the rotating platen is configured to hold and rotate a semiconductor wafer. The post CMP cleaning apparatus further includes a vibrating device disposed over the rotating platen. The post CMP cleaning apparatus further includes a solution delivery module disposed near the vibrating device and configured to deliver a cleaning fluid to the semiconductor wafer. The vibrating device is configured to provide the cleaning fluid with a specific frequency which is at least greater than 100 MHz while the rotating platen is rotating the semiconductor wafer, so that particles on the semiconductor wafer are removed by the cleaning fluid.

The present invention relates to a brush assembly for cleaning metal, the assembly comprising one or more brush heads, each brush head comprising a bundle of conductive filaments, having a working end adapted for contacting metal, and a terminal end, the brush head connectable to an electricity supply, and a housing connected to and retaining at least one sheath, each sheath at least partially surrounding at least one brush head, wherein each brush head and its respective sheath are movable in relation to each other by operating an adjustment mechanism and the working end of the brush head and the sheath are selectively fixable in relation to each other.