A method includes cleaning a wafer with a brush element where the brush element collects particles from the wafer during the cleaning process. The brush element is immersed in a first cleaning liquid. An ultrasonic or megasonic vibration is applied to the first cleaning liquid. The ultrasonic or megasonic vibration causes the particles to dislodge from the brush element into the first cleaning liquid. The particles contaminate the first cleaning liquid.

A gas-assisted scraping tool includes a housing having a blade support with a cavity that is connectable to a source of a pressurized gas; a blade attached to and extending forwardly of the blade support; and a diffuser attached to the blade support and spacing the blade from the cavity, the diffuser shaped to direct a stream of the pressurized gas from within the cavity lengthwise along the blade and distribute the pressurized gas transversely across a width of the blade, whereby material loosened by the blade is blown away from an end of the blade by the stream of the pressurized gas.

A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.

A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base having a through hole. The semiconductor wafer cleaning apparatus further includes a spindle extending through the through hole. The semiconductor wafer cleaning apparatus also includes a clamping member. The clamping member covers the through hole and connected to the spindle. A gap that communicates with the through hole is formed between the spin base and the clamping member. In addition, the semiconductor wafer cleaning apparatus includes a sealing ring. The sealing ring is positioned adjacent to the gap and located farther away from the spindle than the gap.

The present invention relates to a contact cleaning apparatus (100) including an elastomeric roller (120), rotatably mounted within a contact cleaning apparatus such that an outer surface (123) of said elastomeric roller contactingly engages a substrate surface (112) during use. There is also provided an apparatus for evaluating said outer surface of said elastomeric roller, including an electromagnetic radiation source (140), configured to selectively emit electromagnetic radiation of a predetermined electromagnetic spectrum onto at least one predetermined region (125) of said outer surface, a detector (160), configured to receive at least a first reflection of said electromagnetic radiation from said at least one predetermined region, and a controller (270) operably coupled to said detector and adapted to determine at least one characteristic parameter of at least said first reflection. The present invention also relates to a method of evaluating a contact cleaning apparatus, including evaluating an elastomeric roller surface using electromagnetic radiation.

The present invention relates to a contact cleaning apparatus (100) including an elastomeric roller (120), rotatably mounted within a contact cleaning apparatus such that an outer surface (123) of said elastomeric roller contactingly engages a substrate surface (112) during use. There is also provided an apparatus for evaluating said outer surface of said elastomeric roller, including an electromagnetic radiation source (140), configured to selectively emit electromagnetic radiation of a predetermined electromagnetic spectrum onto at least one predetermined region (125) of said outer surface, a detector (160), configured to receive at least a first reflection of said electromagnetic radiation from said at least one predetermined region, and a controller (270) operably coupled to said detector and adapted to determine at least one characteristic parameter of at least said first reflection. The present invention also relates to a method of evaluating a contact cleaning apparatus, including evaluating an elastomeric roller surface using electromagnetic radiation.

A system and method for cleaning surfaces is disclosed. The system includes an elongated blade configured to remove at least one of dirt, dust, debris and film from a smooth surface. A drive system is provided for causing the blade to contact the entire smooth surface, thereby removing at least a portion of at least one of dirt, dust, debris, and film. A cleaning device automatically cleans the blade before and after the blade is cleaning the smooth surface. In one example, system is part of a heliostat system for use in a solar collection field as part of a concentrated solar power (CSP) plant.

Example embodiments relate to devices and methods for collecting and cleaning solid substances. An example device is provided for cleaning dirt particles from a solid body. The device includes a driving shaft configured to rotate along a rotational direction. The device also includes a container arrangement that includes a first slotted container. Further, the device includes a second slotted container attached to the first slotted container and to the driving shaft via a fitting arrangement. The fitting arrangement is configured to simultaneously rotate the second slotted container within the first slotted container in a direction opposite to the rotational direction of the driving shaft.

Example embodiments relate to devices and methods for collecting and cleaning solid substances. An example device is provided for cleaning dirt particles from a solid body. The device includes a driving shaft configured to rotate along a rotational direction. The device also includes a container arrangement that includes a first slotted container. Further, the device includes a second slotted container attached to the first slotted container and to the driving shaft via a fitting arrangement. The fitting arrangement is configured to simultaneously rotate the second slotted container within the first slotted container in a direction opposite to the rotational direction of the driving shaft.

A docking station includes a base and a cleaning member assembly. The cleaning member assembly includes at least one cleaning member, a first bracket, a second bracket, and a power source. Each of the at least one cleaning member is mounted on the first bracket and the second bracket. One of the first bracket and the second bracket is a fixed bracket, and the other is a movable bracket. The movable bracket is driven to reciprocate along a straight line, in order to drive each the cleaning member to swing relative to the first bracket around a central axis.