A substrate treatment apparatus includes a brush moving mechanism which moves a shaft to which a cleaning brush is attached. The brush body includes a substrate contact portion of a pillar-shaped portion. The substrate treatment apparatus further includes a correcting member and a relatively-positioning mechanism. When the correcting member is placed in a target position, a contact portion of the correcting member overlaps an object portion which is a combination of a design contact portion and a belt-shaped annular portion in an outer surface of a design pillar-shaped portion of a design body of a design brush. The contact portion is formed to have an inverted shape of the object portion of the design brush, and a portion of the contact portion, which corresponds to the belt-shaped annular portion, is a center-axis facing surface which faces a center axis of the shaft.

A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

An assembly configured to clean one or more selected structures of a device may comprise an end effector assembly, a material disposed on a surface of the end effector assembly that, in operation of the device, faces the selected structure(s) of the device. The end effector assembly may be configured to selectively move the material towards and against the selected structure(s) such that the material remains on the facing surface of the end effector assembly and to retain, when the end effector assembly is moved away from the device, at least some particulates previously on the selected structure(s). The device may comprise a data storage assembly and the selected structures may comprise a spindle motor hub and a disk clamp to secure the clamp to the disk.

A method for cleaning the mop of a cleaning robot includes: obtaining mop usage information after the cleaning robot carries the mop to clean the floor, and selecting a target mop cleaning mode to clean the mop according to the mop usage information.

A method for cleaning the mop of a cleaning robot includes: obtaining mop usage information after the cleaning robot carries the mop to clean the floor, and selecting a target mop cleaning mode to clean the mop according to the mop usage information.

A rinsing device for boosting the quality of the rinsing of a cleaning device to facilitate and improve the cleanness of surface cleaning, the rinsing device comprising a first tank (41) provided to collect wastewater coming from the cleaning device, a second tank (42) provided to store clean water, and a mechanical pumping device (15, 50) configured to pump clean water coming from the second tank (42) to wet the cleaning device.

A system for cleaning a surface of a substrate includes a cleaning element including a resilient compressible material. A liquid source provides liquid directly to the cleaning element, and a squeezing roller engages the cleaning element and applies pressure thereto, to squeeze out excess liquid from said resilient compressible material. A counter element opposes said cleaning element such that the substrate is disposed between the counter element and the cleaning element. The substrate moves between the counter element and the cleaning element such that a surface of the cleaning element, having a suitable amount of liquid absorbed therein, engages and cleans the surface of the substrate without damaging the substrate.

A system for cleaning a surface of a substrate includes a cleaning element including a resilient compressible material. A liquid source provides liquid directly to the cleaning element, and a squeezing roller engages the cleaning element and applies pressure thereto, to squeeze out excess liquid from said resilient compressible material. A counter element opposes said cleaning element such that the substrate is disposed between the counter element and the cleaning element. The substrate moves between the counter element and the cleaning element such that a surface of the cleaning element, having a suitable amount of liquid absorbed therein, engages and cleans the surface of the substrate without damaging the substrate.