A method of cleaning a complex powder transfer system including providing a powder transfer system having a washing fluid source, a spray device valve in fluid communication with the washing fluid source, a backflush valve in fluid communication with the washing fluid source, a receiving device having an upper chamber, a lower chamber, and a membrane filter disposed between the upper and lower chambers. The method includes opening the backflush valve to initiate a backflush cycle, running the backflush cycle to wash the upper chamber with a fluid, and closing the backflush valve after the backflush cycle completes. The method includes opening the spray device valve to initiate a spray device cycle, running the spray device cycle to wash the lower chamber with fluid, and closing the spray device valve after the spray device cycle completes. The method includes opening a pressure valve to provide PCA to the receiving container.

A water spray wand comprises an internal water pipe, a spray handle, a compartment for a battery and a light. The spray handle is configured such that when the flow of water is permitted through the spray wand, the electronic communication between the battery compartment and the light is completed, and when the flow of water through the spray wand is interrupted, a timer is activated to interrupt the electronic communication between the battery compartment after a predetermined delay.

The invention relates to a module for chemically processing a substrate, a method for chemically processing a substrate and a use of a module for chemically processing a substrate and in particular a large substrate. The module for chemically processing a substrate comprises: an immersion chamber, a spray unit, and a motion unit (14). The immersion chamber is configured to receive a first liquid and the substrate, so that the substrate is immersed in the liquid. The spray unit comprises a plurality of spray nozzles, which are configured to spray a second liquid within the immersion chamber. The motion unit is configured to provide a relative motion between the substrate and the spray unit.

The invention relates to a module for chemically processing a substrate, a method for chemically processing a substrate and a use of a module for chemically processing a substrate and in particular a large substrate. The module for chemically processing a substrate comprises: an immersion chamber, a spray unit, and a motion unit (14). The immersion chamber is configured to receive a first liquid and the substrate, so that the substrate is immersed in the liquid. The spray unit comprises a plurality of spray nozzles, which are configured to spray a second liquid within the immersion chamber. The motion unit is configured to provide a relative motion between the substrate and the spray unit.

A heat exchange system includes a shell having an interior with an inlet and an outlet wherein a first fluid circuit is defined from the inlet, through a heat exchange volume within the interior of the shell, to the outlet. A tubesheet is mounted within the shell dividing between the heat exchange volume and a plenum of a second fluid circuit within the interior of the shell. A set of tubes extends through the heat exchange volume, a respective interior passage of each tube being in fluid communication with the plenum through a respective opening though the tubesheet. The second fluid circuit includes the plenum and interior passages of the tubes. A spray nozzle is mounted in the plenum of the second fluid circuit with a spray outlet directed toward the tubesheet for cleaning the tubesheet with a submerged impingement jet issued from the spray nozzle.

A heat exchange system includes a shell having an interior with an inlet and an outlet wherein a first fluid circuit is defined from the inlet, through a heat exchange volume within the interior of the shell, to the outlet. A tubesheet is mounted within the shell dividing between the heat exchange volume and a plenum of a second fluid circuit within the interior of the shell. A set of tubes extends through the heat exchange volume, a respective interior passage of each tube being in fluid communication with the plenum through a respective opening though the tubesheet. The second fluid circuit includes the plenum and interior passages of the tubes. A spray nozzle is mounted in the plenum of the second fluid circuit with a spray outlet directed toward the tubesheet for cleaning the tubesheet with a submerged impingement jet issued from the spray nozzle.

A method for cleaning a first electrospray emitter of a mass spectrometer comprises: changing an operating mode of the first electrospray emitter from a stable jet mode of operation to a dripping or pulsating mode of operation by lowering a magnitude of a voltage applied between a counter electrode and the first electrospray emitter, |V.sub.1|; moving the first electrospray emitter from a first emitter position from which electrospray ions are delivered to a mass spectrometer inlet to a second emitter position and, simultaneously, moving a second electrospray emitter from a third emitter position to a fourth emitter position; causing a cleaning solvent to flow through the first electrospray emitter at least until a droplet of the cleaning solvent forms on an exterior surface of the first electrospray emitter while operating the electrospray emitter in the dripping mode of operation; and causing the droplet to dislodge from the emitter exterior.

A method for cleaning a first electrospray emitter of a mass spectrometer comprises: changing an operating mode of the first electrospray emitter from a stable jet mode of operation to a dripping or pulsating mode of operation by lowering a magnitude of a voltage applied between a counter electrode and the first electrospray emitter, |V.sub.1|; moving the first electrospray emitter from a first emitter position from which electrospray ions are delivered to a mass spectrometer inlet to a second emitter position and, simultaneously, moving a second electrospray emitter from a third emitter position to a fourth emitter position; causing a cleaning solvent to flow through the first electrospray emitter at least until a droplet of the cleaning solvent forms on an exterior surface of the first electrospray emitter while operating the electrospray emitter in the dripping mode of operation; and causing the droplet to dislodge from the emitter exterior.

The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

A substrate processing apparatus of an embodiment includes a nozzle plate and a support configured to support a substrate at a predetermined distance from the nozzle plate with a first surface of the substrate facing the nozzle plate. A processing liquid supply unit is configured to supply a processing liquid to a second surface of the substrate that is opposite to the first surface. A first supply unit is configured to supply a first fluid from a first supply port in the nozzle plate. A second supply unit is configured to supply a second fluid from a second supply port closer to a outer edge of the nozzle plate than the first supply port.