A razor blade lubricating and cleansing system for the maintenance and cleansing of razor blades used for shaving. The razor blade lubricating and cleansing system includes a wax core held inside a tubular housing designed to extrude debris from gaps between a plurality of razor blades upon application, such that waste material is removed, and a coating of wax is formed along the edge and over the surface of each razor blade. The tubular housing includes a removable cap disposed on a top end, and a rotatable base on a bottom end designed to raise the wax core upwards when rotated in a clockwise direction, such that the raised portion is exposed and accessible. The rotatable base is also designed to lower the wax core downwards when rotated in an anticlockwise direction, such that the lowered portion is securely stowed within the tubular housing.

A substrate cleaning method includes a processing liquid supplying step which supplies a processing liquid that contains a solute and a volatile solvent to an upper surface of a substrate, a film forming step in which the solvent is at least partially volatilized from the processing liquid supplied to the upper surface of the substrate, by which the processing liquid is solidified or hardened to form a particle holding layer on the upper surface of the substrate, and a removal step in which a peeling liquid for peeling the particle holding layer is supplied to the upper surface of the substrate, thereby peeling and removing the particle holding layer from the upper surface of the substrate. A solute composition that is the solute contained in the particle holding layer has such properties that it is insoluble in the peeling liquid before being heated at a temperature equal to or higher than a quality-changing temperature and it is also changed in quality by being heated at a temperature equal to or higher than the quality-changing temperature and becomes soluble in the peeling liquid. The film forming step includes a heating step in which the processing liquid supplied to the upper surface of the substrate is heated at a temperature less than the quality-changing temperature, thereby forming the particle holding layer on the upper surface of the substrate, with no change in quality of the solute composition. The substrate cleaning method further includes a residue removal step in which a residue removing liquid which has the property of dissolving the solute composition before being heated at a temperature equal to or higher than the quality-changing temperature is supplied to the upper surface of the substrate after the removal step, thereby removing residues that remain on the upper surface of the substrate after the particle holding layer has been removed.

A monitor wafer is provided. The monitor wafer includes a substrate and a cleaning layer. The cleaning layer is disposed on a bottom surface of the substrate. The cleaning layer is configured to remove particles from the substrate and/or a processing tool.

This application relates to a semiconductor structure processing method, including: providing a semiconductor layer including a pattern, where a trench is located amongst the pattern; cleaning the pattern using a rinse liquid, where the rinse liquid fills the trench after the cleaning; forming a flexible layer, where the flexible layer displaces the rinse liquid and fills the trench, and covers a surface of the semiconductor layer; and hardening the flexible layer and subsequently removing the flexible layer.

Disclosed is a substrate treating method of performing dry processing on a pattern-formed surface of a substrate, the substrate treating method comprising: a supplying step of supplying a process liquid containing a sublimable substance to the pattern-formed surface of the substrate; a temperature adjusting step of adjusting a temperature of the substrate so as to control the process liquid supplied to the pattern-formed surface of the substrate within a temperature range equal to or above a melting point of the sublimable substance and below a boiling point thereof; a solidifying step of solidifying, on the pattern-formed surface, the process liquid whose temperature is adjusted so as to form a solidified body; and a sublimating step of subliming the solidified body so as to remove the solidified body from the pattern-formed surface, wherein the temperature adjusting step is performed so as to overlap at least the supplying step and is completed at least before the solidifying step is started.

A method for cleaning a substrate includes supplying a vapor to a processing chamber to grow a polymer film on a substrate in the processing chamber; adding a solution to the polymer film on the substrate to create a viscoelastic fluid on the substrate; and removing the viscoelastic fluid to remove particle contaminants from the substrate.

An apparatus for protecting an optical device from contamination is disclosed. The apparatus includes a window disposed between the optical device and a contaminating environment, the window being rotatable about a rotational axis and including an outwardly facing surface that is curved in at least one direction about the rotational axis. The apparatus also includes a bezel enclosing a portion of the outwardly facing surface and defining a clear aperture for transmission of electromagnetic radiation to or from the optical device. The bezel includes a seal extending around a periphery of the clear aperture and is configured to cause the seal to conform to the outwardly facing surface when the window and bezel are urged into contact with each other. The apparatus also includes an actuator operable to cause relative rotation between the window and the bezel to cause the outwardly facing surface to move with respect to the bezel. The apparatus further includes a seal configured to dispense a film onto a portion of the outwardly facing surface that enters the clear aperture during the relative rotation, the film being operable to reduce bonding of optical contaminants to the outwardly facing surface within the clear aperture while transmitting the electromagnetic radiation to or from the optical device through the clear aperture. The seal is configured to dislodge contaminants entrained in the film or adhered to a portion of the outwardly facing surface moving out of the clear aperture during the relative rotation.

An ultrasonic cleaning method of the invention includes: a cleaning liquid coating step (S101), coating a cleaning liquid on a front surface of an electronic component held on a cleaning stage; a pealing step (S103), irradiating the front surface of the electronic component coated with the cleaning liquid with ultrasonic waves from ultrasonic speakers installed to an acoustic head and peeling off a foreign matter attached to the front surface from the front surface; and an attracting step (S104), concentrating the ultrasonic waves generated from the ultrasonic speakers at a gap between a casing and a holding surface of the cleaning stage to form a low pressure region whose pressure is lower than atmospheric pressure at a central lower part of the casing, and attracting the foreign matter peeled off from the front surface of the electronic component and the cleaning liquid coated on the front surface.

A solidified body forming step includes: a first step of landing a processing surface of a cooling member on a liquid film to solidify the liquid to be solidified located in an area sandwiched between an upper surface and the processing surface; and a second step of releasing the processing surface from the solidified area solidified in the first step. The processing surface has a lower temperature than a freezing point of the liquid to be solidified. Adhesion between the solidified area and the processing surface is smaller than that between the solidified area and the upper surface.

A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.