A method of fabricating a semiconductor memory device includes forming a bit line and a bit line capping pattern on the semiconductor substrate, forming a first spacer covering a sidewall of the bit line capping pattern and a sidewall of the bit line, forming a contact plug in contact with a sidewall of the first spacer and having a top surface that is lower than an upper end of the first spacer, removing an upper portion of the first spacer, forming a first sacrificial layer closing at least an entrance of the void, forming a second spacer covering the sidewall of the bit line capping pattern and having a bottom surface in contact with a top surface of the first spacer, and removing the first sacrificial layer. The bit line capping pattern is on the bit line. The contact plug includes a void exposed on the top surface.

A method for removing a foreign substance includes forming a first trapping film between a plate and a first region where a foreign substance should be removed and separating the plate from the first region together with the first trapping film, forming a second trapping film between the plate holding the first trapping film and a second region where a foreign substance should be removed, and separating the plate from the second region together with the first trapping film and the second trapping film. The second region is larger than the first region. A value obtained by dividing a volume of the second trapping film by an area of the second region is larger than a value obtained by dividing a volume of the first trapping film by an area of the first region.

A composition for removing iron deposits, rust, or metallic particles from a surface, the composition including: at least one reducing agent; at least one chelating agent that changes color upon chelation; and at least one solvent.

According to one embodiment, a substrate treatment device includes a placement stand configured to rotate the substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a first liquid supplier configured to supply a first liquid on a surface of the substrate, a second liquid supplier configured to supply a second liquid on the surface, and a controller controlling rotation of the substrate, supply of the cooling gas, the first and second liquids. The controller performs a preliminary process of supplying the second liquid on the surface, and supplying the cooling gas into the space, a liquid film forming process by supplying the first liquid toward the surface after the preliminary process, a supercooling process of the liquid film on the surface, and a freezing process of at least a part of the liquid film on the surface.

A solidified body forming step includes: a first step of landing a processing surface of a cooling member on a liquid film to solidify the liquid to be solidified located in an area sandwiched between an upper surface and the processing surface; and a second step of releasing the processing surface from the solidified area solidified in the first step. The processing surface has a lower temperature than a freezing point of the liquid to be solidified. Adhesion between the solidified area and the processing surface is smaller than that between the solidified area and the upper surface.

A method for cleaning a substrate, includes supplying to a substrate having a hydrophilic surface a film-forming processing liquid which includes a volatile component and forms a film on the substrate, vaporizing the volatile component in the film-forming processing liquid such that the film-forming processing liquid solidifies or cures on the substrate and forms a processing film on the hydrophilic surface of the substrate, and supplying to the substrate having the processing film a strip-processing liquid for stripping the processing film from the substrate.

The present invention describes a method and apparatus for cleaning paint brushes or paint rollers with an encapsulating fluid that can transmit hydraulic force to the paint attached to the fibers of the roller or the bristles of the brush, such that the paint becomes broken into pieces and encapsulated by the encapsulating fluid and then removed from the paint applicator.

An ultrasonic cleaning method of the invention includes: a cleaning liquid coating step (S101), coating a cleaning liquid on a front surface of an electronic component held on a cleaning stage; a pealing step (S103), irradiating the front surface of the electronic component coated with the cleaning liquid with ultrasonic waves from ultrasonic speakers installed to an acoustic head and peeling off a foreign matter attached to the front surface from the front surface; and an attracting step (S104), concentrating the ultrasonic waves generated from the ultrasonic speakers at a gap between a casing and a holding surface of the cleaning stage to form a low pressure region whose pressure is lower than atmospheric pressure at a central lower part of the casing, and attracting the foreign matter peeled off from the front surface of the electronic component and the cleaning liquid coated on the front surface.

The disclosure relates to a cleaning composition that aids in the removal of post-etch residues and aluminum-containing material, e.g., aluminum oxide, in the production of semiconductors that utilize an aluminum-containing etch stop layer. The compositions have a high selectivity for post-etch residue and aluminum-containing materials relative to low-k dielectric materials, cobalt-containing materials and other metals on the microelectronic device.

The invention relates to compositions comprising microbial strains and methods for use of the compositions in removing hydrocarbons from water and/or soil. More particularly, the invention relates to compositions of isolated Bacillus strains selected from the group consisting of isolated Bacillus strains Bacillus licheniformis MDG-1000 (NRRL No. B-67888), Bacillus pumilus MDG-1047 (NRRL No. B-67891), and Bacillus amyloliquefaciens MDG1607 (NRRL No. B-67666), or strains having all of the identifying characteristics of these strains, and combinations thereof, and methods for use of these strains for removing hydrocarbons from water and/or soil. The invention also relates to a method of removing oil in a cleaning application as described herein.