A method for cleaning a vacuum chamber, particularly a vacuum chamber used in the manufacture of OLED devices is described. The method includes cleaning at least one of an inside of the vacuum chamber and a component inside the vacuum chamber with active species, a process gas for generating the active species includes at least 90% oxygen and 5 at least 2% argon, particularly, wherein the process gas includes about 95% oxygen and about 5% argon.

An edge ring disposed on a placing table to surround a processing target object placed on a placing surface of the placing table includes a first ring portion having a front surface located at a position lower than the placing surface; and a second ring portion, provided at an outer side than the first ring portion in a diametrical direction thereof, having a front surface located at a position higher than the placing surface. The front surface of the first ring portion has an irregularity.

Embodiments disclosed herein include a cleaning module for the exhaust line of a chamber. In an embodiment, a mobile cleaning module comprises a chamber where the chamber comprises a first opening and a second opening. In an embodiment, the cleaning module further comprises a lid to seal the first opening. In an embodiment, the lid comprises a dielectric plate, a dielectric resonator coupled to the dielectric plate, a monopole antenna positioned in a hole into the dielectric resonator, and a conductive layer surrounding the dielectric resonator.

A changing table comprises a wall assembly and a tray assembly. The wall assembly comprises wall housing, a transparent-to-UV-light panel, and a UV light source. The wall assembly and tray assembly form a changeable angle α in between them. The tray assembly comprises an exterior first surface and an interior second surface. The second surface is configured to receive an infant and at least a portion of UV light generated by the UV light source.

An assembly comprising at least two elements in a movable arrangement relative to each other for performing a first function of the assembly is furthermore equipped with an anti-biofouling system for subjecting at least an area of the assembly that is to be at least partially exposed to water during at least a part of its lifetime to an anti-biofouling action as an additional function of the assembly, different from the first function of the assembly. The anti-biofouling system comprises one or more light sources for emitting anti-biofouling light, and the anti-biofouling system is adapted to realize coverage of the area with the anti-biofouling light on the basis of the movable arrangement of the at least two elements relative to each other for performing the first function of the assembly.

A substrate processing system is disclosed, comprising: a vacuum transfer module; a substrate processing module connected to the vacuum transfer module and configured to process a substrate in a depressurized environment; a load-lock module connected to the vacuum transfer module; at least one substrate cooling stage disposed in the load-lock module; at least one substrate transfer robot disposed the vacuum transfer module and having at least one end effector; and a controller configured to control a particle removal operation. The operation includes: cooling at least one dummy substrate placed on said at least one substrate cooling stage to a first temperature; and holding said at least one end effector in any one of a plurality of positions in the vacuum transfer module or the substrate processing module for a first time period in a state where at least one cooled dummy substrate is placed on said at least one end effector.

Modules, systems and methods that disinfect surfaces using ultraviolet (UV) light are disclosed. In one aspect, a UV light-emitting module comprises an enclosure including a rear wall and a face plate that includes a light-transmitting aperture. At least one sidewall extends between the rear wall and the face plate, and at least one UV light emitter is located within the enclosure. The module includes at least one cooling feature selected from (1) a sidewall ventilation opening in the at least one sidewall and (2) a heat sink feature extending from the rear wall.

The invention provides an apparatus for treating surfaces of a container. The apparatus comprises an openable reaction chamber housing, an exhaust escapement and an electrode assembly. The electrode assembly comprises a probe assembly coupled with a power source, the probe assembly comprising an elongate wand body, and a helically configured primary electrode and a helically configured counter electrode disposed about an outer circumferential surface of the wand body in an alternating helical configuration. The elongate wand body has a fluid passageway defined therewithin, and one or more outlet openings that are formed on an outer circumferential surface of the wand body and that extend inward through said outer circumferential surface and upto the fluid passageway. One or both of the primary electrode and the counter electrode may be energizable by the power source.

A wafer fixing mechanism as disclosed includes a fixing ring, a plurality of fixing members and a plurality of elastic units, wherein each fixing member is respectively connected to the fixing ring through a connecting shaft. The fixing ring includes a containing area for containing a wafer, and the wafer in the containing area is fixed by the fixing members. The two ends of the elastic unit are respectively connected to the fixing ring and the fixing member. When the wafer pushes the fixing members, the fixing members will swing relative to the fixing ring to prevent the fixing members from damaging the wafer. In addition, when the fixing member swings relative to the fixing ring, the elastic unit is deformed, so that the restoring force of the elastic unit is applied to the wafer via the fixing member, thereby fixing the wafer on a support pedestal.

A method for cleaning a reflective photomask is provided. The method includes: disposing the reflective photomask in a chamber; providing hydrogen radicals to the chamber; and exposing the reflective photomask to the hydrogen radicals. A method of manufacturing a semiconductor structure and system for forming a semiconductor structure are also provided.