A method includes: supplying a processing liquid to a center position of a substrate surface; shifting a supply position of the processing liquid from the center position to a first eccentric position; holding the supply position of the processing liquid at the first eccentric position and supplying a substitute liquid to a second eccentric position; shifting the supply position of the processing liquid in a direction away from the center position, and shifting a supply position of the substitute liquid to the center position; and supplying the processing liquid to the first eccentric position at a first flow rate, and reducing the flow rate of the processing liquid to a second flow rate after the supply position of the processing liquid starts to be shifted from the first eccentric position in the direction and until the supply position of the substitute liquid reaches the center position.

Provided is a method for treating a substrate which removes particle within a concave portion on a substrate having a thin film on which a pattern having the concave portion on its upper surface is formed. The substrate treating method according the present invention comprises a penetration step for penetrating a treatment liquid containing supercritical organic chemical solution into the concave portion; and a heating step for heating the substrate after the penetration step.

Provided is a method for treating a substrate which removes particle within a concave portion on a substrate having a thin film on which a pattern having the concave portion on its upper surface is formed. The substrate treating method according the present invention comprises a penetration step for penetrating a treatment liquid containing supercritical organic chemical solution into the concave portion; and a heating step for heating the substrate after the penetration step.

A method for efficiently decontaminating surfaces is provided comprising applying an indicator to a surface wherein the indicator provides an observable or machine readable response when a contamination is present on the surface, wherein the response is located relative to a location of the contamination; and decontaminating the location of the contamination, and optionally rechecking the location of the initial contamination post decontamination to ensure that the surface is free of contamination.

A method for efficiently decontaminating surfaces is provided comprising applying an indicator to a surface wherein the indicator provides an observable or machine readable response when a contamination is present on the surface, wherein the response is located relative to a location of the contamination; and decontaminating the location of the contamination, and optionally rechecking the location of the initial contamination post decontamination to ensure that the surface is free of contamination.

An equipment cleaning apparatus for an extraplanetary environment includes a cleaner vessel positioned at an exterior of an extraplanetary habitat, and an exterior hatch located outside of the extraplanetary habitat and allowing access to an interior of the cleaner vessel. The cleaning apparatus is operable in one or more cleaning cycles to clean equipment located in the cleaner vessel. A method of cleaning equipment in an extraplanetary environment includes providing a cleaner vessel at an extraplanetary habitat, placing one or more articles of equipment into an interior of the cleaner vessel through an exterior hatch located outside of the extraplanetary habitat, closing the exterior hatch, and operating one or more cleaning cycles on the equipment in the cleaner vessel.

An equipment cleaning apparatus for an extraplanetary environment includes a cleaner vessel positioned at an exterior of an extraplanetary habitat, and an exterior hatch located outside of the extraplanetary habitat and allowing access to an interior of the cleaner vessel. The cleaning apparatus is operable in one or more cleaning cycles to clean equipment located in the cleaner vessel. A method of cleaning equipment in an extraplanetary environment includes providing a cleaner vessel at an extraplanetary habitat, placing one or more articles of equipment into an interior of the cleaner vessel through an exterior hatch located outside of the extraplanetary habitat, closing the exterior hatch, and operating one or more cleaning cycles on the equipment in the cleaner vessel.

A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an air stream is utilized to carry the particles off the surface of the wafer.

A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an air stream is utilized to carry the particles off the surface of the wafer.

A wafer handler cleaning tool may include a scraping device positioned near semiconductor equipment (e.g., a cooling plate, a semiconductor processing device, and/or the like) such that the scraping device removes foreign objects, debris, and/or other types of matter from the underside of the wafer handler when the wafer handler loads a wafer into the semiconductor equipment and/or unloads the wafer from the semiconductor equipment. Moreover, the wafer handler cleaning tool may include a negative pressure device to draw the removed foreign objects, debris, and/or other types of matter away from the scraping device and toward a filtration device such that the filtration device captures the removed foreign objects, debris, and/or other types of matter.