A wafer handler cleaning tool may include a scraping device positioned near semiconductor equipment (e.g., a cooling plate, a semiconductor processing device, and/or the like) such that the scraping device removes foreign objects, debris, and/or other types of matter from the underside of the wafer handler when the wafer handler loads a wafer into the semiconductor equipment and/or unloads the wafer from the semiconductor equipment. Moreover, the wafer handler cleaning tool may include a negative pressure device to draw the removed foreign objects, debris, and/or other types of matter away from the scraping device and toward a filtration device such that the filtration device captures the removed foreign objects, debris, and/or other types of matter.

According to one embodiment, a method for cleaning a substrate includes first cleaning process and second cleaning process. The first cleaning process subjects a substrate to a first cleaning method. The second cleaning process subjects the substrate to a second cleaning method that is different from the first cleaning method and is subsequent to the first cleaning process. The first cleaning method includes at least one of acidic cleaning or alkaline cleaning. The second cleaning method includes freeze cleaning.

According to one embodiment, a method for cleaning a substrate includes first cleaning process and second cleaning process. The first cleaning process subjects a substrate to a first cleaning method. The second cleaning process subjects the substrate to a second cleaning method that is different from the first cleaning method and is subsequent to the first cleaning process. The first cleaning method includes at least one of acidic cleaning or alkaline cleaning. The second cleaning method includes freeze cleaning.

A method of cleaning residual resin from an additively manufactured object, includes: (a) enclosing an additively manufactured object in an inner chamber of a centrifugal separator, the additively manufactured object including a light polymerized resin with a surface coating of viscous, unpolymerized, residual resin; (b) flooding the chamber with a volatile organic solvent vapor without contacting liquid organic solvent to the object, the vapor present in an amount sufficient to reduce the viscosity of the residual resin; and (c) spinning the additively manufactured object in the chamber to centrifugally separate at least a first portion of the residual resin from the object.

A method of cleaning residual resin from an additively manufactured object, includes: (a) enclosing an additively manufactured object in an inner chamber of a centrifugal separator, the additively manufactured object including a light polymerized resin with a surface coating of viscous, unpolymerized, residual resin; (b) flooding the chamber with a volatile organic solvent vapor without contacting liquid organic solvent to the object, the vapor present in an amount sufficient to reduce the viscosity of the residual resin; and (c) spinning the additively manufactured object in the chamber to centrifugally separate at least a first portion of the residual resin from the object.

An aspect of the invention refers to a system for cleaning an external vehicle-mounted sensor surface. The system comprises an air nozzle arranged to discharge air onto a sensor surface; an air pump comprising a fluid inlet, an air outlet, an air-fluid interface and a variable volume compression chamber communicated with the air outlet; an air flow control device communicated with the air nozzle and the air outlet for controlling the flow of air therethrough; and a liquid pump communicated with the fluid inlet to supply a flow of pressurized liquid such that the volume of the compression chamber varies to generate a volume of pressurized air with an absolute pressure below 10 bar.

An aspect of the invention refers to a system for cleaning an external vehicle-mounted sensor surface. The system comprises an air nozzle arranged to discharge air onto a sensor surface; an air pump comprising a fluid inlet, an air outlet, an air-fluid interface and a variable volume compression chamber communicated with the air outlet; an air flow control device communicated with the air nozzle and the air outlet for controlling the flow of air therethrough; and a liquid pump communicated with the fluid inlet to supply a flow of pressurized liquid such that the volume of the compression chamber varies to generate a volume of pressurized air with an absolute pressure below 10 bar.

A dish washer including a sump unit disposed below a wash tub and configured to collect water, and an upper nozzle, a lower nozzle, and a subsidiary nozzle configured to spray water received from the sump unit onto dishes/cutlery contained in at least one rack. The sump unit includes a circulating pump configured to pump water collected in the sump unit, and a distributing element configured to allow water pumped by the circulating pump to be sprayed through any one of the lower nozzle and the subsidiary nozzle, and to be sprayed selectively through the upper nozzle. Accordingly, it is possible to independently perform an intensive wash mode of spraying water only through the subsidiary nozzle.

The invention relates to a treatment system for treating workpieces, in particular for cleaning and/or deburring, comprising at least one treatment device that has at least one treatment unit, which is configured to perform at least one treatment operation on the workpiece, as well as at least one receiving unit for accommodating the workpiece on or in the treatment device, a transport device that comprises at least one transport unit, with which the workpiece is transferable into a transfer position, from which the workpiece is transferable by means of the at least one receiving unit into a treatment position, as well as a control device for controlling the at least one treatment unit, the at least one receiving unit, and the at least one transport unit, wherein the at least one treatment device comprises two or more receiving units for accommodating a respective workpiece for transferring independently of one another into the treatment position, and wherein the control device controls the at least one treatment unit such that the workpieces are treated by said treatment unit in a time-offset manner according to a treatment operation of the same kind. The invention also relates to a method.

The invention relates to a treatment system for treating workpieces, in particular for cleaning and/or deburring, comprising at least one treatment device that has at least one treatment unit, which is configured to perform at least one treatment operation on the workpiece, as well as at least one receiving unit for accommodating the workpiece on or in the treatment device, a transport device that comprises at least one transport unit, with which the workpiece is transferable into a transfer position, from which the workpiece is transferable by means of the at least one receiving unit into a treatment position, as well as a control device for controlling the at least one treatment unit, the at least one receiving unit, and the at least one transport unit, wherein the at least one treatment device comprises two or more receiving units for accommodating a respective workpiece for transferring independently of one another into the treatment position, and wherein the control device controls the at least one treatment unit such that the workpieces are treated by said treatment unit in a time-offset manner according to a treatment operation of the same kind. The invention also relates to a method.