A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.

A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.

An article for cleaning or hand-washing an object includes a core substrate comprising a plurality of fibers including a resin. The core substrate has one or more abrasive surfaces and contains an active cleaning formulation. The resin and the core substrate are water-dispersible upon contact with water at a low temperature, such as 40° C. or below, and water-soluble upon contact with water at a higher temperature. Also disclosed are methods for making the article.

An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.

An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.

A method includes: supplying a processing liquid to a center position of a substrate surface; shifting a supply position of the processing liquid from the center position to a first eccentric position; holding the supply position of the processing liquid at the first eccentric position and supplying a substitute liquid to a second eccentric position; shifting the supply position of the processing liquid in a direction away from the center position, and shifting a supply position of the substitute liquid to the center position; and supplying the processing liquid to the first eccentric position at a first flow rate, and reducing the flow rate of the processing liquid to a second flow rate after the supply position of the processing liquid starts to be shifted from the first eccentric position in the direction and until the supply position of the substitute liquid reaches the center position.

A substrate processing apparatus includes a process module including a substrate support unit, an inverting unit and a processing unit, and a transfer module, wherein the inverting unit inverts a substrate so that a second surface faces upward, and provides the inverted substrate to the substrate support unit, wherein the processing unit performs a first processing on the second surface of the substrate seated on the substrate support unit, wherein the inverting unit inverts the first processed substrate so that the first surface faces upward, wherein the transfer module takes the substrate with a first surface facing upward out of the process module, and introduces again the substrate with a first surface facing upward into the process module to seat it on the substrate support unit, wherein the processing unit performs a second processing on the first surface of the substrate seated on the substrate support unit.

A substrate processing apparatus includes a process module including a substrate support unit, an inverting unit and a processing unit, and a transfer module, wherein the inverting unit inverts a substrate so that a second surface faces upward, and provides the inverted substrate to the substrate support unit, wherein the processing unit performs a first processing on the second surface of the substrate seated on the substrate support unit, wherein the inverting unit inverts the first processed substrate so that the first surface faces upward, wherein the transfer module takes the substrate with a first surface facing upward out of the process module, and introduces again the substrate with a first surface facing upward into the process module to seat it on the substrate support unit, wherein the processing unit performs a second processing on the first surface of the substrate seated on the substrate support unit.

A system may be configured to detect an obstruction on sensor at least partially obstructing or distorting a portion of the field of view of the sensor. The system may also be configured to mitigate the effects of the obstruction or at least partially remove the obstruction from the sensor. The system may be configured to receive one or more signals from a sensor configured to generate signals indicative of an environment, which may include one or more objects, in which the sensor is present. The system may be configured to determine, for example, classify, based at least in part on the one or more signals, an obstruction or distortion on a surface of the sensor, and initiate a response, based at least in part on the determination, to mitigate effects of the obstruction and/or at least partially remove the obstruction.

A system may be configured to detect an obstruction on sensor at least partially obstructing or distorting a portion of the field of view of the sensor. The system may also be configured to mitigate the effects of the obstruction or at least partially remove the obstruction from the sensor. The system may be configured to receive one or more signals from a sensor configured to generate signals indicative of an environment, which may include one or more objects, in which the sensor is present. The system may be configured to determine, for example, classify, based at least in part on the one or more signals, an obstruction or distortion on a surface of the sensor, and initiate a response, based at least in part on the determination, to mitigate effects of the obstruction and/or at least partially remove the obstruction.