A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.

A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.

An apparatus includes a measurement chamber configured to retain one or more sample substances. The apparatus includes an entrance window mounted on a side of the measurement chamber. The apparatus includes a light source configured to generate an incident light beam. The apparatus includes a Raman sensor configured to collect inelastically scattered light from the chamber, and measure an intensity of a Raman peak of a first substance from the one or more sample substances based on the collected inelastically scattered light. The apparatus further includes a processor configured to (i) calculate a concentration of the first substance based on at least the measured intensity of the Raman peak of the first substance, (ii) determine the end point of a wafer cleaning process based on a calculated concentration of the first substance, and (iii) terminate the wafer cleaning process based on the determined end point.

An apparatus includes a measurement chamber configured to retain one or more sample substances. The apparatus includes an entrance window mounted on a side of the measurement chamber. The apparatus includes a light source configured to generate an incident light beam. The apparatus includes a Raman sensor configured to collect inelastically scattered light from the chamber, and measure an intensity of a Raman peak of a first substance from the one or more sample substances based on the collected inelastically scattered light. The apparatus further includes a processor configured to (i) calculate a concentration of the first substance based on at least the measured intensity of the Raman peak of the first substance, (ii) determine the end point of a wafer cleaning process based on a calculated concentration of the first substance, and (iii) terminate the wafer cleaning process based on the determined end point.

The present invention addresses to a laser blasting pipe for heating a scale removal treatment to be descended by electric cable, and a recirculation system with the objective of heating the scale removal solution, inside the production string during the time the reaction is taking place, in order to guarantee its efficiency. The laser blast pipe is a device similar to a metallic cylinder that can travel through the interior of a production string, being descended by gravity itself, and ascended by the action of the cable, being able to recirculate and heat the fluid. This heating would have the function of compensating the heat loss of the removal solution due to the heat exchange of the riser with the seabed, and maintaining the temperature of the reaction inside the production line in an optimal range of yield, thus aiming at increasing the reaction efficiency and the reduction of the time required for the removal of scale in the production string of the well.

The present invention addresses to a laser blasting pipe for heating a scale removal treatment to be descended by electric cable, and a recirculation system with the objective of heating the scale removal solution, inside the production string during the time the reaction is taking place, in order to guarantee its efficiency. The laser blast pipe is a device similar to a metallic cylinder that can travel through the interior of a production string, being descended by gravity itself, and ascended by the action of the cable, being able to recirculate and heat the fluid. This heating would have the function of compensating the heat loss of the removal solution due to the heat exchange of the riser with the seabed, and maintaining the temperature of the reaction inside the production line in an optimal range of yield, thus aiming at increasing the reaction efficiency and the reduction of the time required for the removal of scale in the production string of the well.

The inventive concept provides a nozzle for dispensing a treatment liquid in which plasma is generated. The nozzle includes a body having an interior space, a liquid supply unit that supplies the treatment liquid into the interior space, and electrodes that generate the plasma in the interior space. The liquid supply unit supplies the treatment liquid in a bubbling state into the interior space, or causes the treatment liquid to bubble in the interior space.

The inventive concept provides a nozzle for dispensing a treatment liquid in which plasma is generated. The nozzle includes a body having an interior space, a liquid supply unit that supplies the treatment liquid into the interior space, and electrodes that generate the plasma in the interior space. The liquid supply unit supplies the treatment liquid in a bubbling state into the interior space, or causes the treatment liquid to bubble in the interior space.

In the disclosed solution sand to be cleaned is thermally cleaned by rotating the sand being cleaned in a large oven (1) by rotating the oven (1). Before cleaning, the sand may be pre-processed by crushing any lumps and cleaning the sand fraction by magnetic separation. Preprocessed sand to be cleaned and heat energy are fed (5) into the rotating oven. The oven (1) is set slightly inclined so that a second end of the oven (1) is lower than a first end. The inclination and rotating speed of the oven (1) as well as the feed amount of sand are adjusted, whereby the advancing speed of the sand may be adjusted, as well as the ratio of the sand being cleaned to the volume of the oven (1) kept as desired. The temperature of the oven (1) is monitored at the coldest area of the oven, which is substantially at the second end of the oven. The temperature of the oven (1) is adjusted by adjusting the amount of heat energy fed in. By means of temperature monitoring and knowing the advancing speed of the sand, it is also possible to determine the average temperature of the sand and adjust it as desired by adjusting the supplied heat energy. Finally, the cleaned sand is let run (12) from the second end of the oven (1).

In the disclosed solution sand to be cleaned is thermally cleaned by rotating the sand being cleaned in a large oven (1) by rotating the oven (1). Before cleaning, the sand may be pre-processed by crushing any lumps and cleaning the sand fraction by magnetic separation. Preprocessed sand to be cleaned and heat energy are fed (5) into the rotating oven. The oven (1) is set slightly inclined so that a second end of the oven (1) is lower than a first end. The inclination and rotating speed of the oven (1) as well as the feed amount of sand are adjusted, whereby the advancing speed of the sand may be adjusted, as well as the ratio of the sand being cleaned to the volume of the oven (1) kept as desired. The temperature of the oven (1) is monitored at the coldest area of the oven, which is substantially at the second end of the oven. The temperature of the oven (1) is adjusted by adjusting the amount of heat energy fed in. By means of temperature monitoring and knowing the advancing speed of the sand, it is also possible to determine the average temperature of the sand and adjust it as desired by adjusting the supplied heat energy. Finally, the cleaned sand is let run (12) from the second end of the oven (1).