A sticker removal kit for removing stickers from application surfaces includes a barrier comprising a panel which has a size and a shape such that the panel is configured for covering a sticker. The panel defines a recess on a rear side of the panel and is removably couplable to an application surface. A pouch is positionable in the recess of the panel, and a solvent is contained in the pouch for dissolving a sticker adhesive of the sticker.

Provided are automatic cleaning devices for a monocrystalline silicon bar, which include a base frame, a sprayer, a scrubber, and an air-jetter. Bottom of an inner side of the base frame is configured to place a monocrystalline silicon bar. A plurality of groups of the sprayers, a plurality of groups of the scrubbers, and a plurality of groups of the air-jetters are all disposed on side walls and a top surface of the base frame whose bottom of an inner side is removed. The sprayer is configured to spray the monocrystalline silicon bar. The scrubber is configured to scrub the monocrystalline silicon bar. The air-jetter is configured to purge the monocrystalline silicon bar.

A system and a method for removing a cap seal from a fastener include a seal remover including fingers outwardly extending from a base. Passages are defined between the fingers. The seal remover is configured to be coupled to a distal end of an operative portion of a tool. The tool is configured to be operated to rotate the seal remover in relation to the cap seal so that the fingers remove the cap seal from the fastener. Removed portions of the cap seal are discharged through and out of the passages.

A curved target substrate cleaning system includes a pressure-type cleaning unit for cleaning a cleaning area of a target substrate having a curved surface by applying pressure to the cleaning area, a support body detachably supporting the pressure cleaning unit at a predetermined height with respect to a cleaning area of the target substrate having the curved portion, a cleaning area flat maintaining unit that clamps one end of a target substrate having a curved portion and adjusts a height of the curved portion to maintain the cleaning area of the target substrate in a predetermined orientation with respect to the pressure-type cleaning unit, and a moving unit that moves the cleaning area flat maintenance unit back and forth in one direction with respect to the pressure-type cleaning unit.

A device for the mechanical removal of wax residues on vehicle bodies, characterized bya wax absorbing tape (1), a supply spindle (2) for storing and for unwinding unused wax absorbing tape (1), a press-on unit (5) for pressing the wax absorbing tape (1) onto a wax-soiled surface of the body of the vehicle, andone or more motors for transporting the wax absorbing tape (1) from the supply spindle (2) via the deflecting reels (4) to the take-up reel (3), anda control unit for controlling the advance of the wax absorbing tape.

Provided are automatic cleaning devices for a monocrystalline silicon bar, which include a base frame, a sprayer, a scrubber, and an air-jetter. Bottom of an inner side of the base frame is configured to place a monocrystalline silicon bar. A plurality of groups of the sprayers, a plurality of groups of the scrubbers, and a plurality of groups of the air-jetters are all disposed on side walls and a top surface of the base frame whose bottom of an inner side is removed. The sprayer is configured to spray the monocrystalline silicon bar. The scrubber is configured to scrub the monocrystalline silicon bar. The air-jetter is configured to purge the monocrystalline silicon bar.

In a cleaning method for removing adhesive residues from surfaces, in particular after separating an adhesive connection between adhesively joined partners, liquid carbon dioxide from a reservoir enters a jet apparatus and is guided there through a first dosing unit into an expansion chamber, wherein a cold-resistant liquid is then supplied to a mixture created in the expansion chamber from gaseous carbon dioxide and carbon dioxide particles and wherein the mixture, to which the cold-resistant liquid has been added, exits the jet apparatus via an outlet opening thereof. Furthermore, a jet apparatus removes adhesive residues from surfaces.

The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (wherein each of L.sup.1 and L.sup.2 represents a C2 to C4 alkyl group, and L.sup.3 represents O or S) in an amount of 80 mass % or more.
L.sup.1-L.sup.3-L.sup.2(L)

A semiconductor substrate cleaning method including removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by any of formulae (L0) to (L4). ##STR00001##

A cleaning device for cleaning a surface of an extension roller of a dough extension apparatus includes a cleaning device body attached to the dough extension apparatus, and a band-like flexible cleaning member attached to the cleaning device body. The cleaning member includes ends and a cleaning portion with a cleaning surface. One end or both ends of the cleaning member is/are secured to the cleaning device body, and the cleaning portion hangs down, so that the cleaning surface of the cleaning portion is configured to contact the surface of the extension roller of the dough extension apparatus to be deformed and bent to correspond to the surface of the extension roller.