A method of preparing a cylindrical metal member includes preparing a metallic ingot having at least one surface having a mean width with respect to ruggedness Sm in a range of from 100 μm to 220 μm; imparting a lubricant to the at least one surface of the metallic ingot; and subjecting the metallic ingot to impact pressing while the surface coated with the lubricant with respect to the metallic ingot is set as a bottom surface, to thereby mold a cylindrical metal member.

A method for preparing a copper-based graphene/aluminum composite wire with high electrical conductivity is disclosed. An electrodeposition solution for the wire includes the following components, in mass percentage: 20 wt % of CuSO.sub.4, 0.005 wt % to 0.020 wt % of benzalacetone, 2 wt % to 5 wt % of NaCl, 0.08 wt % to 0.5 wt % of graphene, 0.003 wt % to 0.016 wt % of N,N-dimethylformamide (DMF), and the balance of deionized water. The preparation process of the wire is composed of: electrodeposition, drawing, and annealing. The obtained wire has excellent electrical conductivity and tensile strength, which can effectively improve the electric power transmission efficiency and reduce the electrical power loss. By the above electrodeposition solution and simple preparation method, a utility model wire with high transmission efficiency can be prepared, where the comprehensive performance and microstructure of the composite can be ensured by controlling process parameters.

A device for producing a spring wire includes a wire production apparatus which is designed such that a spring wire can be produced from a raw material, in particular by drawing; a checking unit which is designed such that the spring wire can be checked for flaws, in particular material flaws and surface flaws; and a laser marking unit which is designed such that defective regions of the spring wire, in particular regions of the spring wire having material and surface flaws, can be marked with a laser marking such that part of the surface of the spring wire can be removed or part of the surface of the spring wire can be tempered in such a manner that the color of the surface of the spring wire is changed in this part. The wire production apparatus is designed such that the spring wire can be guided past the checking unit and past the laser marking unit.

An aluminum alloy wire rod includes Mg: 0.1-1.0 mass %, Si: 0.1-1.2 mass %, Fe: 0.10-1.40 mass %, Ti: 0-0.100 mass %, B: 0-0.030 mass %, Cu: 0-1.00 mass %, Ag: 0-0.50 mass %, Au: 0-0.50 mass %, Mn: 0-1.00 mass %, Cr: 0-1.00 mass %, Zr: 0-0.50 mass %, Hf: 0-0.50 mass %, V: 0-0.50 mass %, Sc: 0-0.50 mass %, Co: 0-0.50 mass %, Ni: 0-0.50 mass %, and the balance: Al and inevitable impurities. In a cross section parallel to a wire rod lengthwise direction and including a center line of the wire rod, no void having an area greater than 20 μm.sup.2 is present, or even in a case where at least one void having an area greater than 20 μm.sup.2 is present, a presence ratio of the at least one void per 1000 μm.sup.2 is on average in a range of less than or equal to one void/1000 μm.sup.2.

One aspect relates to a process for preparing a shaped metal product, wherein a monolithic metal precursor surrounded by a sacrificial outer element is formed to smaller dimensions, and the sacrificial material is subsequently removed. One aspect further provides a composite for preparing a shaped metal product, and a shaped metal product. Such shaped metal products can be used to manufacture an active implantable medical device or sensor.

A graphite steel available as a material for mechanical parts of industrial machines or automobiles, and more particularly, a steel wire for graphitization heat treatment and a graphite steel and methods of manufacturing the same. The graphite steel includes, in percent by weight (wt %), 0.6 to 0.9% of carbon (C), 2.0 to 2.5% of silicon (Si), 0.1 to 0.6% of manganese (Mn), 0.015% or less of phosphorus (P), 0.03% or less of sulfur (S), 0.01 to 0.05% of aluminum (Al), 0.01 to 0.02% of titanium (Ti), 0.0005 to 0.002% of boron (B), 0.003 to 0.015% of nitrogen (N), 0.005% or less of oxygen (O), and the remainder of iron (Fe) and inevitable impurities, and satisfying Equation (1) below: wherein graphite grains are distributed in a ferrite base as a microstructure and a graphitization rate is 100%, (1) −0.003<[N]−[Ti]/3.43−[B]/0.77<0.003, wherein in Equation (1), [Ti], [N], and [B] are wt % of titanium, nitrogen, and boron, respectively.

In various embodiments, metallic wires are fabricated by combining one or more powders of substantially spherical metal particles with one or more powders of non-spherical particles within one or more optional metallic tubes. The metal elements within the powders (and the one or more tubes, if present) collectively define a high entropy alloy of five or more metallic elements or a multi-principal element alloy of four or more metallic elements.

A drawing die system that has least two probes to measure various characteristics of components of the die box or the wire being drawn through the die box. The system includes a smart die that in which the multiple probes send information to a data processing unit. The data processing unit takes the information from the various probes and controls the various parameters of the wire drawing process. One smart die has a probe that collects information directly from a drawing die holder. The smart die also includes a force sensor and is configured to allow a die box to be displaced along an axis that is parallel to the direction in which the wire is drawn. The data processing unit controls various wired drawing parameters such as wire drawing speed, coolant pressure and the rate at which the coolant is pumped through the system.

There is provided a metal-coated Al bonding wire which can provide a sufficient bonding reliability of bonded parts of the bonding wire under a high temperature state where a semiconductor device using the metal-coated Al bonding wire is operated. The bonding wire includes a core wire of Al or Al alloy, and a coating layer of Ag, Au or an alloy containing them formed on the outer periphery of the core wire, and the bonding wire is characterized in that when measuring crystal orientations on a cross-section of the core wire in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <111> angled at 15 degrees or less to a wire longitudinal direction has a proportion of 30 to 90% among crystal orientations in the wire longitudinal direction. Preferably, the surface roughness of the wire is 2 μm or less in terms of Rz.

One aspect relates to a process for preparing a shaped metal product, wherein a monolithic metal precursor surrounded by a sacrificial outer element is formed to smaller dimensions, and the sacrificial material is subsequently removed. One aspect further provides a composite for preparing a shaped metal product, and a shaped metal product. Such shaped metal products can be used to manufacture an active implantable medical device or sensor.