An automotive disk brake assembly installed in an automobile having a wheel. The assembly includes a floating caliper supporting an inner and outer brake pad and a brake rotor having a disk, and a hat, and wherein the hat is bolted to the wheel. A hydraulic cylinder is adapted to push the inner brake pads into the disk surface, causing the floating caliper to move bringing the outer brake pad into contact with the disk. Finally, the rotor is made such that a complete 100 kilometer per hour, 0.9 gross vehicle weight braking causes the disk to expand in thickness by at least 0.15 mm and to cool to shrink in thickness, relative to its expanded thickness, by at least 0.1 mm within 60 seconds of the cessation of braking, in an ambient temperature of less than 30° C.

An automotive disk brake assembly installed in an automobile having a wheel. The assembly includes a floating caliper supporting an inner and outer brake pad and a brake rotor having a disk, and a hat, and wherein the hat is bolted to the wheel. A hydraulic cylinder is adapted to push the inner brake pads into the disk surface, causing the floating caliper to move bringing the outer brake pad into contact with the disk. Finally, the rotor is made such that a complete 100 kilometer per hour, 0.9 gross vehicle weight braking causes the disk to expand in thickness by at least 0.15 mm and to cool to shrink in thickness, relative to its expanded thickness, by at least 0.1 mm within 60 seconds of the cessation of braking, in an ambient temperature of less than 30° C.

A method for integrally forming a non-metal part (50) and a metal part (60). The method comprises the following steps: A, arranging the transparent non-metal part (50) in a mold; B, arranging the metal part (60) on the periphery of the non-metal part (50) in the mold, the metal part being a continuous structure located on the periphery of the non-metal part (50); C, heating the metal part (60) so that the metal part (60) is formed into semi-solid metal defined in a mold cavity; D, extruding the semi-solid metal through the mold, so that the semi-solid metal is combined with the periphery of the non-metal part (50) in a seamless mode; and E, quickly cooling the semi-solid metal located on the periphery of the non-metal part (50), so that the semi-solid metal is formed into amorphous metal combined with the periphery of the non-metal part (50) in a seamless mode. The method is simple and practicable, the rate of finished products is high, the metal part obtained through extrusion has high compactness and strength, and the difficulty in follow-up surface treatment of the metal part is reduced.

A method for integrally forming a non-metal part (50) and a metal part (60). The method comprises the following steps: A, arranging the transparent non-metal part (50) in a mold; B, arranging the metal part (60) on the periphery of the non-metal part (50) in the mold, the metal part being a continuous structure located on the periphery of the non-metal part (50); C, heating the metal part (60) so that the metal part (60) is formed into semi-solid metal defined in a mold cavity; D, extruding the semi-solid metal through the mold, so that the semi-solid metal is combined with the periphery of the non-metal part (50) in a seamless mode; and E, quickly cooling the semi-solid metal located on the periphery of the non-metal part (50), so that the semi-solid metal is formed into amorphous metal combined with the periphery of the non-metal part (50) in a seamless mode. The method is simple and practicable, the rate of finished products is high, the metal part obtained through extrusion has high compactness and strength, and the difficulty in follow-up surface treatment of the metal part is reduced.

An electronic device includes a housing and a base plate. The housing includes a frame. The frame includes a first end portion having a first inner surface and a second end portion connected to the first end portion to form the closed frame. The second end portion has a second inner surface. The base plate is fixedly connected to the frame. One of the first inner surface and the base plate includes a first protrusion, and the other of the first protrusion and the base plate defines a first latching slot; the first protrusion receives in the first latching slot. One of the second inner surface and the base plate includes a second protrusion, and the other of the second inner surface and the base plate defines a second latching slot, the second protrusion receives in the second latching slot.

An electronic device includes a housing and a base plate. The housing includes a frame. The frame includes a first end portion having a first inner surface and a second end portion connected to the first end portion to form the closed frame. The second end portion has a second inner surface. The base plate is fixedly connected to the frame. One of the first inner surface and the base plate includes a first protrusion, and the other of the first protrusion and the base plate defines a first latching slot; the first protrusion receives in the first latching slot. One of the second inner surface and the base plate includes a second protrusion, and the other of the second inner surface and the base plate defines a second latching slot, the second protrusion receives in the second latching slot.

An aluminum-silicon carbide composite including flat-plate-shaped composited portion containing silicon carbide and an aluminum alloy, and aluminum layers containing an aluminum alloy provided on both plate surfaces of composited portion, wherein circuit board is mounted on one plate surface and the other plate surface is used as heat-dissipating surface, wherein: the heat-dissipating-surface-side plate surface of the composited portion has a convex curved shape; the heat-dissipating-surface-side aluminum layer has a convex curved shape; ratio (Ax/B) between the average (Ax) of the thicknesses at the centers on opposing short sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.91≦Ax/B≦1.00; and a ratio (Ay/B) between the average (Ay) of the thicknesses at the centers on opposing long sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.94≦Ay/B≦1.00 and production method therefor.

A method for manufacturing a ground engaging component is disclosed. The method includes providing a mixture of compacted powders including carbon, titanium, and a first alloy, the first alloy having a first composition and heating the mixture to a temperature and for a duration sufficient to combine the mixture to form an insert having a desired shape. The method further includes locating the insert in a desired position in a mold and casting a second alloy having a second composition into the mold, the second alloy forming a ground engaging component with the insert bonded therein.

There are provide a metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing the same. The metal/ceramic bonding substrate is produced by a method including the steps of: arranging a ceramic substrate 10 in a mold 20; putting the mold 20 in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to −45° C. or lower in the furnace; injecting a molten metal of aluminum into the mold 20 so as to allow the molten metal to contact the surface of the ceramic substrate 10; and cooling and solidifying the molten metal to form a metal plate 14 for circuit pattern of aluminum on one side of the ceramic substrate 10 to bond one side of the metal plate 14 for circuit pattern directly to the ceramic substrate 10, while forming a metal base plate 12 of aluminum on the other side of the ceramic substrate 10 to bond the metal base plate 12 directly to the ceramic substrate 10.

A vane assembly (10) having: an airfoil (12) and a shroud (14) held together without metallurgical bonding there between; a channel (22) disposed circumferentially about the airfoil (12), between the airfoil (12) and the shroud (14); and a seal (20) disposed in the channel (22), wherein during operation of a turbine engine having the vane assembly (10) the seal (20) has a sufficient ductility such that a force generated on the seal (20) resulting from relative movement of the airfoil (12) and the shroud (14) is sufficient to plastically deform the seal (20).