Patent classifications
B22F1/05
High frequency low loss magnetic core and method of manufacture
A high saturation, low loss magnetic material suitable for high frequency electrical devices, including power converters, transformers, solenoids, motors, and other such devices.
METAL-Si BASED POWDER, METHOD FOR PRODUCING SAME, METAL-Si BASED SINTERED BODY, SPUTTERING TARGET, AND METAL-Si BASED THIN FILM MANUFACTURING METHOD
A metal-Si based powder contains a metal-Si based particle including a plurality of crystal phase grains. The crystal phase grains include a crystal phase containing a compound of a metal and Si. The crystal phase grains have an average grain size of, for example, 20 μm or less. The metal-Si based particle has an average particle size of, for example, 5 to 100 μm.
METAL-Si BASED POWDER, METHOD FOR PRODUCING SAME, METAL-Si BASED SINTERED BODY, SPUTTERING TARGET, AND METAL-Si BASED THIN FILM MANUFACTURING METHOD
A metal-Si based powder contains a metal-Si based particle including a plurality of crystal phase grains. The crystal phase grains include a crystal phase containing a compound of a metal and Si. The crystal phase grains have an average grain size of, for example, 20 μm or less. The metal-Si based particle has an average particle size of, for example, 5 to 100 μm.
ALUMINUM SLURRY
Provided is a VMP aluminum slurry that can satisfy metallic texture achieving high designability and demand characteristics of adhesion level with a base material. It has been found that when a coating material formed using a VMP aluminum slurry containing a specific dicarboxylic acid is made into a coating film, the adhesion with a base material is particularly excellent, and the VMP aluminum slurry of the present invention has been completed. The VMP aluminum slurry contains a dicarboxylic acid having an octanol/water partition coefficient (log Pow) of −1 to 1 and a carbon chain of 2 to 5 carbon atoms between two carboxy groups, a VMP (vacuum metallized pigment) aluminum pigment, and a solvent.
SYSTEMS AND METHODS FOR REJUVENATION OF COPPER ALLOY
The embodiments disclosed herein are directed to systems and methods for manufacturing recycled copper alloy powder particles from used or deficient copper alloy powder particles. In some embodiments, used copper alloy powder particles comprising near-surface oxygen are introduced into a microwave plasma torch. In some embodiments, the used copper alloy powder particles are heated within the microwave plasma torch to at least partially remove the oxygen and form recycled copper alloy powder particles, without melting the used copper alloy powder particles.
SYSTEMS AND METHODS FOR REJUVENATION OF COPPER ALLOY
The embodiments disclosed herein are directed to systems and methods for manufacturing recycled copper alloy powder particles from used or deficient copper alloy powder particles. In some embodiments, used copper alloy powder particles comprising near-surface oxygen are introduced into a microwave plasma torch. In some embodiments, the used copper alloy powder particles are heated within the microwave plasma torch to at least partially remove the oxygen and form recycled copper alloy powder particles, without melting the used copper alloy powder particles.
Spherical silver powder and method for producing same
There are provided a spherical silver powder which has the same diameter as that of a spherical silver powder produced by a conventional wet reduction method and which can sufficiently sinter the silver particles thereof to cause the silver particles to be adhered to each other at a relatively low temperature to form a conductive film having a low volume resistivity when it is used for a baked type conductive paste, and a method for producing the same. A spherical silver powder, which contains a neutral or basic amino acid having a carbon number of not less than 5 in each of particles thereof and which has an average particle diameter D.sub.50 of 0.2 to 5 μm based on a laser diffraction method, is produced by adding the neutral or basic amino acid having the carbon number of not less than 5 (such as proline, tyrosine, tryptophan, phenylalanine, arginine or histidine) to a water reaction system containing silver ions to mix a reducing agent therewith to deposit silver particles by reduction.
Spherical silver powder and method for producing same
There are provided a spherical silver powder which has the same diameter as that of a spherical silver powder produced by a conventional wet reduction method and which can sufficiently sinter the silver particles thereof to cause the silver particles to be adhered to each other at a relatively low temperature to form a conductive film having a low volume resistivity when it is used for a baked type conductive paste, and a method for producing the same. A spherical silver powder, which contains a neutral or basic amino acid having a carbon number of not less than 5 in each of particles thereof and which has an average particle diameter D.sub.50 of 0.2 to 5 μm based on a laser diffraction method, is produced by adding the neutral or basic amino acid having the carbon number of not less than 5 (such as proline, tyrosine, tryptophan, phenylalanine, arginine or histidine) to a water reaction system containing silver ions to mix a reducing agent therewith to deposit silver particles by reduction.
Spherical silver powder and method for producing same
There are provided a spherical silver powder which has the same diameter as that of a spherical silver powder produced by a conventional wet reduction method and which can sufficiently sinter the silver particles thereof to cause the silver particles to be adhered to each other at a relatively low temperature to form a conductive film having a low volume resistivity when it is used for a baked type conductive paste, and a method for producing the same. A spherical silver powder, which contains a neutral or basic amino acid having a carbon number of not less than 5 in each of particles thereof and which has an average particle diameter D.sub.50 of 0.2 to 5 μm based on a laser diffraction method, is produced by adding the neutral or basic amino acid having the carbon number of not less than 5 (such as proline, tyrosine, tryptophan, phenylalanine, arginine or histidine) to a water reaction system containing silver ions to mix a reducing agent therewith to deposit silver particles by reduction.
MATERIAL DEPOSITION METHOD FOR REPAIRING AERONAUTICAL COMPONENTS
A method is disclosed for repairing an aeronautical component comprising a nickel-based alloy. An aeronautical component is disclosed comprising a nickel-based alloy and one or more of the following elements: tungsten, cobalt, chromium, aluminum, molybdenum, tantalum, titanium, hafnium, carbon, boron, and zirconium.