In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.

In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.

The present invention relates to a metal powder including 0.1≤C≤0.4 mass %, 0.005≤Si≤1.5 mass %, 0.3≤Mn≤8.0 mass %, 2.0≤Cr≤15.0 mass %, 2.0≤Ni≤10.0 mass %, 0.1≤Mo≤3.0 mass %, 0.1≤V≤2.0 mass %, 0.010≤N≤0.200 mass %, and 0.01≤Al≤4.0 mass %, with the balance being Fe and unavoidable impurities, and satisfying the following expression (1), 10<15[C]+[Mn]+0.5[Cr]+[Ni]<20 (1), in which [C], [Mn], [Cr] and [Ni] respectively represent the contents of C, Mn, Cr and Ni by mass %.

The present invention relates to a metal powder including 0.1≤C≤0.4 mass %, 0.005≤Si≤1.5 mass %, 0.3≤Mn≤8.0 mass %, 2.0≤Cr≤15.0 mass %, 2.0≤Ni≤10.0 mass %, 0.1≤Mo≤3.0 mass %, 0.1≤V≤2.0 mass %, 0.010≤N≤0.200 mass %, and 0.01≤Al≤4.0 mass %, with the balance being Fe and unavoidable impurities, and satisfying the following expression (1), 10<15[C]+[Mn]+0.5[Cr]+[Ni]<20 (1), in which [C], [Mn], [Cr] and [Ni] respectively represent the contents of C, Mn, Cr and Ni by mass %.

A bonded body includes a first bonded member, a second bonded member, and a bonding material. The bonding material is located between the first bonded member and the second bonded member. The bonding material includes fine copper particles having an average particle diameter of 300 nm or less; coarse copper particles having an average particle diameter of 3 μm or more and 11 μm or less; and a reducing agent which reduces the fine copper particles and the coarse copper particles.

A bonded body includes a first bonded member, a second bonded member, and a bonding material. The bonding material is located between the first bonded member and the second bonded member. The bonding material includes fine copper particles having an average particle diameter of 300 nm or less; coarse copper particles having an average particle diameter of 3 μm or more and 11 μm or less; and a reducing agent which reduces the fine copper particles and the coarse copper particles.

A method for producing a bonding material having a plate shape or a sheet shape includes a mixture producing step in which fine copper particles having an average particle diameter of 300 nm or less, coarse copper particles having an average particle diameter of 3 μm or more and 11 μm or less, and a reducing agent which reduces the fine copper particles and the coarse copper particles are mixed to produce a mixture: and a molding step in which the mixture is formed in a plate shape or a sheet shape.

A method for producing a bonding material having a plate shape or a sheet shape includes a mixture producing step in which fine copper particles having an average particle diameter of 300 nm or less, coarse copper particles having an average particle diameter of 3 μm or more and 11 μm or less, and a reducing agent which reduces the fine copper particles and the coarse copper particles are mixed to produce a mixture: and a molding step in which the mixture is formed in a plate shape or a sheet shape.

The method for making carbon-coated copper nanoparticles is a simple, one-step for coating copper nanoparticles with a carbon shell to prevent rapid oxidation of the carbon nanoparticle core. The method involves heating or autoclaving thin sheets of copper hydroxide nitrate (Cu.sub.2(OH).sub.3NO.sub.3) under supercritical conditions (a temperature of 300° C. and a pressure of 120 bar) for two hours. The autoclaving may be performed in the presence of an inert gas, such as argon, which may be used to remove any remaining gases, and the pressure may be released in the presence of the inert gas so that the product may be collected in the presence of air.

A metal magnetic powder is constituted by metal magnetic grains that each include: a metal phase where the percentage of Fe at its center part is 98 percent by mass or higher, while the mass percentage of Fe at its contour part is lower than that at the center part; and an oxide film covering the metal phase, so as to inhibit oxidation of Fe contained in the metal phase, despite the high content percentage of Fe in the metal phase.