Patent classifications
B22F5/12
PROCESSING DEVICE FOR METAL MATERIALS
A processing device for a metal material, containing: an airtight container for housing a specimen thereinside; an oxygen pump for extracting oxygen molecules from a gas discharged from the airtight container; a circulation means for returning the gas into the airtight container; and a plasma generation means present inside the airtight container for converting the gas returned from the circulation means into plasma and exposing the specimen thereto.
PROCESSING DEVICE FOR METAL MATERIALS
A processing device for a metal material, containing: an airtight container for housing a specimen thereinside; an oxygen pump for extracting oxygen molecules from a gas discharged from the airtight container; a circulation means for returning the gas into the airtight container; and a plasma generation means present inside the airtight container for converting the gas returned from the circulation means into plasma and exposing the specimen thereto.
METHODS OF MANUFACTURING COMPOSITE MATERIALS, COMPOSITE WIRES, AND WELDING ELECTRODES
The present disclosure provides a method of manufacturing a composite material. The method can include compacting a copper alloy powder into a plurality of substantially uniform compressed sub-assemblies such that the copper alloy powder has a density that is greater than 50%. The plurality of compressed sub-assemblies can be layered relative one another within an aperture of a shell, the plurality of compressed sub-assemblies to form a consecutive assembly of compacted copper alloy. The shell may include one of the following: a precipitation hardened copper alloy, copper alloy, and carbon steel. The consecutive assembly can be sealed within the shell to form a billet. The billet can be hot-extruded to form a rod, and the extruded rod can be further drawn to form a composite wire of a desired diameter. The composite wire may be used to create a composite welding electrode.
Formation of bismuth strontium calcium copper oxide superconductors
A BÏ2212 article may be formed by mixing metallic precursor powders including bismuth, strontium, calcium and copper in an oxygen-free atmosphere, mechanically alloying the metallic precursor powders in an oxygen-free atmosphere, and heating the metallic precursor alloy according to a temperature profile. The profile may include a ramp-up stage during which the alloy is heated to a peak temperature in an oxygen-free atmosphere, a dwell stage during which the alloy is held at the peak temperature for a dwell time, and a ramp-down stage during which the alloy is cooled from the peak temperature. During at least a portion of the dwell stage, the oxygen-free atmosphere is switched to an oxygen-inclusive atmosphere, wherein the alloy is oxidized to form a superconducting oxide, which may be sintered during or after oxidation. The alloy may be formed into a shape, such as a wire, prior to oxidizing.
Formation of bismuth strontium calcium copper oxide superconductors
A BÏ2212 article may be formed by mixing metallic precursor powders including bismuth, strontium, calcium and copper in an oxygen-free atmosphere, mechanically alloying the metallic precursor powders in an oxygen-free atmosphere, and heating the metallic precursor alloy according to a temperature profile. The profile may include a ramp-up stage during which the alloy is heated to a peak temperature in an oxygen-free atmosphere, a dwell stage during which the alloy is held at the peak temperature for a dwell time, and a ramp-down stage during which the alloy is cooled from the peak temperature. During at least a portion of the dwell stage, the oxygen-free atmosphere is switched to an oxygen-inclusive atmosphere, wherein the alloy is oxidized to form a superconducting oxide, which may be sintered during or after oxidation. The alloy may be formed into a shape, such as a wire, prior to oxidizing.
Powered removal for element formed by electron beam melting
A method for forming a part. The method includes: forming a first portion of the part at a first level; forming a second portion of the part at a second level; wherein forming the first and second portions includes exposing the first and second levels to a sintering process and portions of the first and second levels to an electron beam; forming a wire in the passage formed inside the first and second portions by exposing a portion of the passage to the electron beam; applying a signal to the wire to break up sintered material in the passage; and removing the wire.
METHOD FOR FORMING MICRO PATTERN ON SURFACE OF WIRE
A method for producing a micro-pattern on surface of a wire is disclosed. The method includes a step of applying a nanoparticle solution to the wire to form a nanoparticle solution layer on the surface of the wire; and a step of irradiating the nanoparticle solution layer with a Bessel beam laser to induce sintering of nanoparticles, thereby forming a micro-pattern on the surface of the wire. It is possible to form a microelectrode pattern on a level of several to tens of micrometers on the surface of a micro-wire having a diameter on a scale of several tens to several hundreds of micrometers. Since a laser optical system with a long depth of focus is used, a micro-pattern with a uniform thickness can be formed on surface of a wire having a curvature in a simple.
METHOD FOR FORMING MICRO PATTERN ON SURFACE OF WIRE
A method for producing a micro-pattern on surface of a wire is disclosed. The method includes a step of applying a nanoparticle solution to the wire to form a nanoparticle solution layer on the surface of the wire; and a step of irradiating the nanoparticle solution layer with a Bessel beam laser to induce sintering of nanoparticles, thereby forming a micro-pattern on the surface of the wire. It is possible to form a microelectrode pattern on a level of several to tens of micrometers on the surface of a micro-wire having a diameter on a scale of several tens to several hundreds of micrometers. Since a laser optical system with a long depth of focus is used, a micro-pattern with a uniform thickness can be formed on surface of a wire having a curvature in a simple.
Fabrication of high-entropy alloy wire and multi-principal element alloy wire
In various embodiments, metallic wires are fabricated by combining one or more powders of substantially spherical metal particles with one or more powders of non-spherical particles within one or more optional metallic tubes. The metal elements within the powders (and the one or more tubes, if present) collectively define a high entropy alloy of five or more metallic elements or a multi-principal element alloy of four or more metallic elements.
Fabrication of high-entropy alloy wire and multi-principal element alloy wire
In various embodiments, metallic wires are fabricated by combining one or more powders of substantially spherical metal particles with one or more powders of non-spherical particles within one or more optional metallic tubes. The metal elements within the powders (and the one or more tubes, if present) collectively define a high entropy alloy of five or more metallic elements or a multi-principal element alloy of four or more metallic elements.