B22F7/008

PRODUCING POLYCRYSTALLINE DIAMOND COMPACT (PDC) DRILL BITS WITH CATALYST-FREE AND SUBSTRATE-FREE PDC CUTTERS
20230211414 · 2023-07-06 ·

Methods for forming a polycrystalline diamond compact (PDC) drill bit from catalyst-free synthesized polycrystalline diamonds are described. The polycrystalline diamonds are deposited within a mold. In some cases, a matrix body material is deposited within the mold, and an infiltration process is performed to bond the polycrystalline diamonds to the matrix body material to form the PDC drill bit. In some cases, a drill bit body is formed within the mold, and forming the drill bit body within the mold includes depositing a layer of matrix body material particles within the mold, depositing an adhesive ink within the mold, and curing the adhesive ink. In some cases, a sintering process is performed after forming the drill bit body to remove at least a portion of the adhesive ink and increase a density of the drill bit body to form the PDC drill bit.

Sintered friction material

A sintered friction material is formed by pressure sintering mixed powder at 800° C. or above, the mixed powder consisting of, in mass %, Cu and/or Cu alloy: 40.0 to 80.0%, Ni: 0% or more and less than 5.0%, Sn: 0 to 10.0%, Zn: 0 to 10.0%, VC: 0.5 to 5.0%, Fe and/or Fe alloy: 2.0 to 40.0%, lubricant: 5.0 to 30.0%, metal oxide and/or metal nitride: 1.5 to 30.0%, and the balance being impurity.

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY

A copper paste for joining contains metal particles and a dispersion medium, in which the copper paste for joining contains copper particles as the metal particles, and the copper paste for joining contains dihydroterpineol as the dispersion medium. A method for manufacturing a joined body is a method for manufacturing a joined body which includes a first member, a second member, and a joining portion that joins the first member and the second member, the method including: a first step of printing the above-described copper paste for joining to at least one joining surface of the first member and the second member to prepare a laminate having a laminate structure in which the first member, the copper paste for joining, and the second member are laminated in this order; and a second step of sintering the copper paste for joining of the laminate.

Macro-chip reinforced alloy

Described herein are methods of forming a neutron shielding material. Such material may comprise a powder blend comprising a first component comprising a blend of a first metal particle and a first ceramic particle; and a second component comprising a reinforcing chip, the reinforcing chip comprising a second ceramic particle dispersed within a chip metal matrix.

Dissolving metal supports in 3D printed metals and ceramics using sensitization

Systems and methods are disclosed for fabricating a metal or ceramic component using a 3D printer. An entire 3D printed piece, including both the metal or ceramic component and one or more support structures, is created of a first metal or ceramic material. A sensitization layer is applied to all or part of the 3D printed piece to chemically alter portions of the first metal or ceramic material near the surface making those portions of the material more sensitive to the etching process. The etching process causes the affected material to deplete and separates the component from the support structures without requiring mechanical machining.

Dissolving metal supports in 3D printed metals and ceramics using sensitization

Systems and methods are disclosed for fabricating a metal or ceramic component using a 3D printer. An entire 3D printed piece, including both the metal or ceramic component and one or more support structures, is created of a first metal or ceramic material. A sensitization layer is applied to all or part of the 3D printed piece to chemically alter portions of the first metal or ceramic material near the surface making those portions of the material more sensitive to the etching process. The etching process causes the affected material to deplete and separates the component from the support structures without requiring mechanical machining.

Thermally conductive and electrically insulative material

A monolithic substrate including a silica material fused to bulk copper is provided for coupling with electronic components, along with methods for making the same. The method includes arranging a base mixture in a die mold. The base mixture includes a bottom portion with copper micron powder and an upper portion with copper nanoparticles. The method includes arranging a secondary mixture on the upper portion of the base mixture. The secondary mixture includes a bottom portion with silica-coated copper nanoparticles and an upper portion with silica nanoparticles. The method includes heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, pressure, and time sufficient to sinter and fuse the base mixture with the secondary mixture to form a monolithic substrate. The resulting monolithic substrate defines a first major surface providing thermal conductivity, and a second major surface providing an electrically resistive surface.

LIGHTWEIGHT LIQUID METAL EMBEDDED ELASTOMER COMPOSITE
20220363865 · 2022-11-17 ·

A lightweight liquid metal composition and a method for producing a lightweight liquid metal composition. The composition includes: a liquid metal inclusion; a low-density phase including a plurality of particles; and an elastic polymer. The method includes: combining a low-density phase with a liquid metal to produce a multiphase liquid metal (LM), the low-density phase including a material having a density less than a density of the LM; mixing the multiphase LM with an elastomer to produce an emulsion; and curing the emulsion to produce a lightweight LM composition.

Method of manufacturing aluminum alloy clad section, and aluminum alloy clad section produced by same method

Disclosed are a method of manufacturing an aluminum alloy clad section, and an aluminum alloy clad section manufactured by the method. The method includes preparing a composite powder by ball-milling aluminum powder and carbon nanotubes, preparing a billet from the composite powder, and subjecting the billet to direct extrusion using an extrusion die. The method is simple in procedure and uses simple equipment because it is based on direct extrusion which is suitable for mass production. Thus, the method is capable of producing a lightweight high-strength functional aluminum alloy clad section having a competitive advantage in terms of price over conventional aluminum alloy clad sections.

METHOD FOR MANUFACTURING FUNCTIONALLY GRADED COMPOSITE MATERIAL FOR PCB HAVING HIGH HEAT DISSIPATING PROPERTIES AND ELECTRIC INSULATING PROPERTIES, AND FUNCTIONALLY GRADED COMPOSITE MATERIAL MANUFACTURED THEREBY
20220355376 · 2022-11-10 ·

A method for manufacturing a functionally graded composite material for a printed circuit board (PCB) is proposed. The method may include preparing two or more types of mixed powders with different contents of polymer or ceramic powder, each mixed powder comprising (i) a metal powder comprising a powder made of aluminum or an aluminum alloy and a powder of magnesium and (ii) the polymer or ceramic powder. The method may also include laminating the two or more types of mixed powders to form a functionally graded laminate in which a ratio of the content of the polymer or ceramic powder to the content of the metal powder in each of layers stacked in sequence from bottom to the top of the laminate differs. The method may further include preparing a functionally graded composite material by sintering the functionally graded laminate by pressureless sintering or spark plasma sintering.