A multilayered material system includes at least one of a liner sheet and a cellular core, and a multilayered composite joined to the at least one of a liner sheet and a cellular core. The multilayered composite includes hollow microspheres dispersed within a metallic matrix material.

A system may include a powder source; a powder delivery device; an energy delivery device; and a computing device. The computing device may be configured to: control the powder source to deliver metal powder to the powder delivery device; control the powder delivery device to deliver the metal powder to a surface of an abrasive coating; and control the energy delivery device to deliver energy to at least one of the abrasive coating or the metal powder to cause the metal powder to be joined to the abrasive coating.

In the joined body (10) in which the conductor (12) and the substrate (14) are joined by the joining material (13), the joining material (13) includes a sintered body formed by sintering silver powder. A sintered body having a porosity of 8% to 30% and a surface roughness Ra of a joining surface of 500 nm or more and 3.3 μm or less is adopted.

An aluminum-based composite material includes a plurality of coarse crystalline grains (3) of pure aluminum, and a plurality of fine crystalline grains (4) each having an aluminum matrix (1), and a dispersion material (2) dispersed inside the aluminum matrix and formed by reacting a portion or all of an additive with aluminum in the aluminum matrix. The fine crystalline grains exist among the coarse crystalline grains, and the fine crystalline grains have crystalline grain diameters smaller than crystalline grain diameters of the coarse crystalline grains.

A method for manufacturing a sintered body, the method including heating a mixture that contains a plurality of particles of a metal oxide having a spinel-type structure, and a metal acetylacetonate under pressure at a temperature of from a melting point or higher of the metal acetylacetonate to 600° C. or lower, to form a sintered body that contains the metal oxide having the spinel-type structure.

Provided is a method of producing a metal-plastic multi-layered hybrid structure by using laser three-dimensional (3D) printing, the method including printing a metal structure on a substrate by using a first laser, patterning an upper surface of the metal structure by using the first laser, printing a polymer bonding layer on the patterned metal structure by using the first laser, and printing a polymer structure on the polymer bonding layer by using a second laser having a wavelength longer than a wavelength of the first laser, wherein the printing of the polymer bonding layer includes forming an intermediate phase at an interface between the metal structure and the polymer bonding layer. A layered structure produced using the above method may include the intermediate phase having the effect of an oxygen inclusion connecting a metal and a polymer.

A core-shell particle is provided, including a core particle composed of a non-reactive component, and a coating layer disposed about the core particle, the coating layer composed of reactive component. The reactive component is chemically reactive with water, acid, or base, and the non-reactive component is non-reactive with water, acid, or base. Also provided are a bulk composition composed of the core-shell particle, an article composed of the bulk composition, as well as method and system of making and using the particles, composition, and articles.

A method for producing an additively-manufactured article includes: a step for feeding a powdered material onto a base metal, the powdered material being obtained by mixing a first powder containing a stellite alloy and a second powder containing tungsten carbide; a nd a step for irradiating the fed powdered material with a laser beam while weaving the lase r beam, and depositing a cladding layer, obtained by melting and solidifying at least the pow dered material, on the base metal. The step for depositing the cladding layer is performed such that 20≤A≤35, 2.2≤B≤2.9, and 5 mass%≤R2≤15 mass% are satisfied, where A is a laser heat input index, B is a powder feeding rate index, and R2 is the ratio of the second powder contained in the powdered material.

A manufacturing method of an integrated circuit (IC) packaging structure includes the following steps. One or a plurality of dies is disposed on a packaging substrate. An encapsulation material is formed on the packaging substrate. The encapsulation material is configured to encapsulate the one or the plurality of the dies on the packaging substrate. At least one trench is formed in the encapsulation material. A heat dissipation structure is formed on the encapsulation material, and at least a part of the heat dissipation structure is formed in the at least one trench. The step of forming the heat dissipation structure includes the following steps. A first slurry is formed in the at least one trench, and a first curing process is performed to the first slurry for forming a first portion of the heat dissipation structure.

Disclosed are a method of manufacturing a billet used in plastic working for producing a composite member and a billet manufactured by the method. The method includes (A) ball-milling powders of two more materials to prepare a composite powder and (B) preparing a multi-layered billet containing the composite powder. The multi-layered billet includes a core layer and two or more shell layers. The shell layers except for the outermost shell layer are made of the composite powder. The outermost shell layer is made of a pure metal or metal alloy. The composite powders contained in the core layer and each of the shell layers have different compositions. The method has an advantage of manufacturing a plastic working billet being capable of overcoming the limitation of a single-material billet and enabling production of a characteristic-specific composite member such as a clad member.