A processing device for a metal material, containing: an airtight container for housing a specimen thereinside; an oxygen pump for extracting oxygen molecules from a gas discharged from the airtight container; a circulation means for returning the gas into the airtight container; and a plasma generation means present inside the airtight container for converting the gas returned from the circulation means into plasma and exposing the specimen thereto.

A Cu core ball and a method of manufacturing such a Cu core ball. Purity of the Cu internal ball is at least 99.9% and not greater than 99.995%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than 1 ppm. Its sphericity is at least 0.95. A solder plating film coated on the Cu ball is of Sn solder or a lead free solder alloy whose primary component is Sn. In the solder plating film, a contained amount of U is not more than 5 ppb and that of Th is not more than 5 ppb. A total alpha dose of the Cu ball and the solder plating film is not more than 0./0200 cph/cm2. An arithmetic average roughness of the Cu core ball is equal to or less than 0.3 μm.

A process for producing an electrode material by infiltrating a highly conductive metal such as Cu into a porous object containing heat-resistant elements. Before an infiltration step in which the highly conductive metal is infiltrated, a HIP treatment is given to a powder containing the heat-resistant elements (or to a molded object obtained by molding a powder containing the heat-resistant elements). The composition is controlled so that the HIP treatment yields a porous object which has a degree of filling of 70% or higher, more preferably 75% or higher. The highly conductive metal is infiltrated into the porous object having the controlled composition.

There is provided a silver-coated copper powder, which has excellent storage stability (reliability), and a method for producing the same. A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a gold plating solution, which is a potassium gold cyanide solution (to which at least one of tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid is preferably added), to cause 0.01 wt % or more (with respect to the silver-coated copper powder) of gold to be supported on the surface of the copper powder coated with the silver containing layer.

A sputtering target material contains one kind or two or more kinds selected from the group consisting of Ag, As, Pb, Sb, Bi, Cd, Sn, Ni, and Fe in a range of 5 massppm or more and 50 massppm or less, in terms of a total content; and a balance consisting of Cu and an inevitable impurity. In the sputtering target material, in a case in which an average crystal grain size calculated as an area average without twins is denoted by X1 (μm), and a maximum intensity of pole figure is denoted by X2, upon an observation with an electron backscatter diffraction method, Expression (1): 2500>19×X1+290×X2 is satisfied, a kernel average misorientation (KAM) of a crystal orientation measured by an electron backscatter diffraction method is 2.0° or less, and a relative density is 95% or more.

An optical mount part having a body that includes a composite of a titanium-zirconium-niobium alloy. The titanium-niobium-zirconium alloy includes titanium, about 13.5 to about 14.5 wt. % zirconium, and about 18 to about 19 weight % (wt. %) niobium. The titanium-niobium-zirconium alloy has a congruent melting temperature of about 1750 to about 1800° Celsius (° C.).

Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.

The present disclosure provides a method of manufacturing a composite material. The method can include compacting a copper alloy powder into a plurality of substantially uniform compressed sub-assemblies such that the copper alloy powder has a density that is greater than 50%. The plurality of compressed sub-assemblies can be layered relative one another within an aperture of a shell, the plurality of compressed sub-assemblies to form a consecutive assembly of compacted copper alloy. The shell may include one of the following: a precipitation hardened copper alloy, copper alloy, and carbon steel. The consecutive assembly can be sealed within the shell to form a billet. The billet can be hot-extruded to form a rod, and the extruded rod can be further drawn to form a composite wire of a desired diameter. The composite wire may be used to create a composite welding electrode.

Metal powder particles for use in additive manufacturing are made by removing material from the surface of the particles using wet chemical etching to create a nanoscale texturing of the surface, increasing absorptivity by the metal powder particles of incident laser light and maintaining flowability. The nanoscale texturing has sub-wavelength features at laser wavelengths in the range 800-1100 nm. The particles are substantially spherical and have mean diameters in the range 10-70 μm.

A manufacturing apparatus additively shapes an article by sintering or melting and then solidifying a metal powder through irradiation of a shaping optical beam. The manufacturing apparatus includes: a chamber; a metal powder feeding device that feeds the metal powder to an irradiation area; a shaping optical beam irradiation device that applies the shaping optical beam to the metal powder in the irradiation area; an absorptance enhancement assisting unit that performs a predetermined absorptance enhancement assisting treatment on the metal powder; and a shaping unit that, following implementation of the absorptance enhancement assisting treatment, performs a shaping treatment of additively shaping the article by applying the shaping optical beam and thus heating the metal powder to sinter or melt and then solidify.