To provide novel low-temperature sinterable copper particles that can be sintered even at a low temperature of, for example, around 100° C. or less, and a method for producing a sintered body by using the same. The low-temperature sinterable copper particles according to the present invention are coated with a carboxylic acid, and a surface of the copper particle is oxidized so as to have a cuprous oxide fraction (Cu.sub.2O/(Cu+Cu.sub.2O)) in the copper particle of 4% by mass or less or so as to have an average coating thickness of cuprous oxide of 10 nm or less. The low-temperature sinterable copper particles are subjected to low-temperature firing in an atmosphere of 0.01 Pa or less.

A monolithic substrate including a silica material fused to bulk copper is provided for coupling with electronic components, along with methods for making the same. The method includes arranging a base mixture in a die mold. The base mixture includes a bottom portion with copper micron powder and an upper portion with copper nanoparticles. The method includes arranging a secondary mixture on the upper portion of the base mixture. The secondary mixture includes a bottom portion with silica-coated copper nanoparticles and an upper portion with silica nanoparticles. The method includes heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, pressure, and time sufficient to sinter and fuse the base mixture with the secondary mixture to form a monolithic substrate. The resulting monolithic substrate defines a first major surface providing thermal conductivity, and a second major surface providing an electrically resistive surface.

Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E-9 Ω*m to about 742.5×E-9 Ω*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.

The present disclosure relates to a method of three-dimensional (3D) printing a 3D printed object. The method comprises: selectively jetting a marking agent onto a first region of build material, wherein the build material comprises at least one meta and/or ceramic; selectively jetting a binding agent onto at least a portion of the build material; and binding the build material to form a layer; such that the marking agent is incorporated in the metal part in a predetermined arrangement that forms a detectable marker in the 3D printed object. The disclosure also relates to a multi-fluid inkjet kit for 3D printing.

Provided is a copper alloy powder which is a metal powder to be used for additive manufacturing by a laser beam system, and which is able to achieve a higher laser absorption rate and additionally suppress heat transfer through necking, and a method for producing this copper alloy powder. A copper alloy powder which contains one or more elements selected from among Cr, Zr and Nb in a total amount of 15 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, and a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less.

Disclosed herein are methods for electrolessly coating copper onto a chromium metal powder, the method comprising adding a nickel-coated chromium powder to an aqueous electroless copper plating bath comprising a source of copper cations, a copper-cation complexing agent, a copper-cation reducing agent, and a first base, thereby forming a copper-coated chromium metal powder. Also disclosed are copper-coated chromium metal powders prepared by a disclosed method.

A pure copper powder with a Si coating formed thereon, wherein a Si adhesion amount is 5 wtppm or more and 200 wtppm or less, a C adhesion amount is 15 wtppm or more, and a weight ratio C/Si is 3 or less. An object of the present invention is to provide a pure copper powder with a Si coating formed thereon and a production method thereof, as well as an additive manufactured object using such pure copper powder capable of suppressing the partial sintering of the pure copper powder caused by the preheating thereof in additive manufacturing based on the electron beam (EB) method, and suppressing the loss of the degree of vacuum caused by carbon (C) during the molding process.

Provided herein are methods of preparing three-dimensional photonic crystals having tunable optical properties and control over stopband location and width, the three-dimensional photonic crystals comprising nanoparticles and spacer groups.

A sintered bearing is made of a sintered compact containing nickel silver (Cu—Ni—Zn) as a base. In the sintered bearing, P is not added in the sintered compact. Alternatively, a content of P in the sintered compact is less than 0.05 mass % in terms of mass ratio to a total mass. Consequently, crystal grains constituting the sintered compact can be micronized. In particular, in the sintered bearing, an average crystal particle diameter of the crystal grains constituting the sintered compact is 20 μm or less. Consequently, the mechanical strength and the vibration resisting properties can be improved, and the rotation shaft can be prevented from being damaged.

An ejector for an additive manufacturing printing system is disclosed, including an ejector body having a nozzle, a heating element to heat a solid printing material in the ejector, causing the solid printing material to change to a liquid printing material, and a piston disposed within the ejector body capable of translational motion. The ejector may include a segmented solenoid coil wrapped at least partially around the ejector body, which may be powered to cause the piston to translate along a longitudinal axis of the ejector thereby causing one or more drops of the liquid printing material to be jetted out of the nozzle. A method of ejecting liquid from an ejector is also disclosed, including melting a printing material within an ejector to form a liquid printing material, and moving a piston towards an ejector nozzle, and ejecting a drop of liquid printing material from the ejector nozzle.