Provided are a wiring material for a semiconductor device, the wiring material including a boride-based compound containing boron and at least one metal selected from elements of Groups 2 to 14, a wiring for a semiconductor device including the same, and a semiconductor device including the wiring containing the wiring material.

Methods and apparatuses for in situ synthesis of alloys and/or composites are disclosed, the method comprising: (a) providing an apparatus having: an electromagnetic energy source; an autofocusing scanner; a powder system; a powder delivery system; and computers coupled and configured to control the electromagnetic energy source, the autofocusing scanner, the powder system, and the powder delivery system; (b) programming the computers with structural and material specifications of the sample; (c) using the computers to control electromagnetic radiation, powder mixture, and powder deposition parameters; and (d) focusing and scanning the electromagnetic radiation onto the sample while two or more powders are concurrently deposited onto the sample to deposit layers onto the sample for multiple metal powder synthesis, metal and ceramic synthesis, ceramic synthesis, and/or gradated composition synthesis, wherein the layers comprise at least one new material which differs from the two or more powders. Other embodiments are described and claimed.

An optical mount part having a body that includes a composite of a titanium-zirconium-niobium alloy. The titanium-niobium-zirconium alloy includes titanium, about 13.5 to about 14.5 wt. % zirconium, and about 18 to about 19 weight % (wt. %) niobium. The titanium-niobium-zirconium alloy has a congruent melting temperature of about 1750 to about 1800 Celsius ( C.).

A composite particle of the present invention comprises a soft magnetic iron-based particle, a coating layer disposed on a surface of the soft magnetic iron-based particle, and a spherical nanopowder with at least a part thereof disposed inside of the coating layer. The coating layer is a layer of a compound comprising Fe, Si, O, B and N; and the nanopowder is a powder of a compound comprising O, N and at least one element selected from the group consisting of Fe, Si, Zr, Co, Al, Mg, Mn and Ni.

Molybdenum composites containing silicon and boron for environmental resistance are combined so as to minimize the silicon solid solution in the molybdenum phase. The composites include ratios of molybdenum, silicon, and boron to form three phase mixtures of molybdenum, A15 (Mo.sub.3Si), and T2 (Mo.sub.5SiB.sub.2) or molybdenum, SiO.sub.2, and T2 (Mo.sub.5SiB.sub.2). Beneficial additives, including manganese and strontium aluminosilicate, are included to improve the composite's properties. Manufacturing processes to produce these composites as either powders or solid parts are included.

A method for surface treatment of a metal material in a powder state is provided, the method including obtaining a powder formed from a plurality of particles of the metal material to be treated; and subjecting the powder to an ion implantation process by directing a beam of singly-charged or multi-charged ions towards an outer surface of the particles, the beam being produced by a source of singly-charged or multi-charged ions, whereby the particles have an overall spherical shape with a radius (R). There is also provided a material in a powder state formed from a plurality of particles having a ceramic outer layer and a metal core, the particles having an overall spherical shape.

Provided are a wiring material for a semiconductor device, the wiring material including a boride-based compound containing boron and at least one metal selected from elements of Groups 2 to 14, a wiring for a semiconductor device including the same, and a semiconductor device including the wiring containing the wiring material.

A sinterable magnetic powder composition including: from 50 to 95% of a powder magnet; and from 5 to 50% by weight of at least one thermoplastic polymer; for the total weight of the composition, said powder composition having a D50 comprised within the range of 0.1 to 100 m. And, to the use of the composition in processes used to agglomerate powders, layer by layer, by melting or sintering, for manufacturing three-dimensional magnetic objects.

The disclosure relates to materials and methods for additive manufacturing. For example, the material can comprise nanoparticles deposited on nanostructures to form the decorated nanostructure material; nanoparticles deposited on nanostructures, wherein the nanoparticles are bound together to form a three-dimensional network of the material; or nanoparticles deposited on nanostructures; and additive particles bound to the nanoparticles to form a three-dimensional network of the material. There are also provided methods for additive manufacturing comprising subjecting a material comprising nanoparticles deposited on nanostructures, and additive particles bound to the nanoparticles, to an energy treatment in conditions to form a green, and subjecting the green to a thermal treatment to provide an additive manufacturing item.

A method of making a thin film is provided. The method includes ball milling a suspension including a nanopowder, an additive component, and a solvent to generate a suspension of milled nanopowder, disposing a layer of the suspension of milled nanopowder onto a substrate, drying the layer by removing at least a portion of the solvent to form a green film, compressing the green film to form a compressed green film, debindering the compressed green film to form a debindered film, and sintering the debindered film to generate the thin film. The additive component includes a component selected from the group consisting of a dispersant, a binder, a plasticizer, and combinations thereof.