The method for making carbon-coated copper nanoparticles is a simple, one-step for coating copper nanoparticles with a carbon shell to prevent rapid oxidation of the carbon nanoparticle core. The method involves heating or autoclaving thin sheets of copper hydroxide nitrate (Cu.sub.2(OH).sub.3NO.sub.3) under supercritical conditions (a temperature of 300° C. and a pressure of 120 bar) for two hours. The autoclaving may be performed in the presence of an inert gas, such as argon, which may be used to remove any remaining gases, and the pressure may be released in the presence of the inert gas so that the product may be collected in the presence of air.

A sintered material has 3% by volume or more and 80% by volume or less of cubic boron nitride grains and a binder. The binder contains: one or more types selected from the group consisting of one or more compounds composed of one or more first elements selected from the group consisting of a group 4 element, a group 5 element, a group 6 element, Al and Si and one or more second elements selected from the group consisting of C, N, O and B, and a solid solution of these compounds; and one or more metallic elements selected from the group consisting of Li, Ca, Na, Sr, Ba and Be. The binder contains the one or more metallic elements of 0.001% by mass or more and 0.5% by mass or less in total, and oxygen of 0.1% by mass or more and 10.0% by mass or less.

A Co-based alloy structure includes: a matrix phase (γ phase) having an fcc structure and containing mainly Co; and a precipitated phase (γ′ phase) that contains an intermetallic compound having an L1.sub.2 fcc structure, such as Co.sub.3(Al,W) in terms of an atomic ratio, and that is dispersively precipitated in the matrix phase. The Co-based alloy structure is configured to include the γ′ phase having a grain size of 10 nm to 1 μm, and grains of the γ′ phase uniformly disposed and precipitated, and to have a precipitation amount of 40 vol % to 85 vol %.

The mechanical properties and thermal resistance of a sintered component made from an Al—Cu—Mg—Sn alloy powder metal mixture can be improved by doping the Al—Cu—Mg—Sn alloy powder metal mixture with a silicon addition. Silicon is added as a constituent to the Al—Cu—Mg—Sn alloy powder metal mixture. The Al—Cu—Mg—Sn alloy powder metal mixture is compacted to form a preform and the preform is sintered to form the sintered component.

Disclosed herein are methods of making a plurality of metal particles, the methods comprising: injecting a metal particle precursor, a capping material, and a reducing agent into an inlet of a continuous flow microwave reactor, thereby forming a mixture within the continuous flow microwave reactor, wherein the inlet of the continuous flow microwave reactor is fluidly connected to an outlet of the continuous flow microwave reactor through a reaction vessel; flowing the mixture through the reaction vessel, wherein the metal particle precursor is reduced within the reaction vessel, thereby forming the plurality of metal particles; and collecting the plurality of metal particles from the outlet of the continuous flow microwave reactor.

Exemplary martensitic steel alloys may be particularly suited for additive manufacturing applications. Exemplary atomized alloy powders usable in additive manufacturing may include carbon, nickel, manganese, chromium, and the balance iron and incidental impurities. Exemplary steel alloys can be molybdenum free.

Provided herein is a composition for eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers and at least one organoamine stabilizer. Also provided herein is a process for preparing eutectic metal alloy nanoparticles comprising mixing at least one organic polar solvent, at least one organoamine stabilizer, and a eutectic metal alloy to create a mixture; sonicating the mixture at a temperature above the melting point of the eutectic metal alloy; and collecting a composition comprising a plurality of eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers. Further disclosed herein are hybrid conductive ink compositions comprising a component comprising a plurality of metal nanoparticles and a component comprising a plurality of eutectic metal alloy nanoparticles.

Provided herein is a composition for eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers and at least one organoamine stabilizer. Also provided herein is a process for preparing eutectic metal alloy nanoparticles comprising mixing at least one organic polar solvent, at least one organoamine stabilizer, and a eutectic metal alloy to create a mixture; sonicating the mixture at a temperature above the melting point of the eutectic metal alloy; and collecting a composition comprising a plurality of eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers. Further disclosed herein are hybrid conductive ink compositions comprising a component comprising a plurality of metal nanoparticles and a component comprising a plurality of eutectic metal alloy nanoparticles.

A method for manufacturing a powder-modified magnesium alloy chip for thixomolding includes a drying step of heating a mixture containing an Mg chip containing Mg as a main component, a C powder containing C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.

Provided is a method for preparing gold nanorods using a reducing agent mixture, which includes: a step of preparing a seed solution containing the seed particles of gold nanoparticles; and a step of growing the seeds of the gold nanoparticles into nanorods by adding a growth solution containing ascorbic acid (AA) and hydroquinone (HQ) to the prepared seed solution, wherein the ascorbic acid first reduces the seeds of the gold nanoparticles.