An electrical discharge machining device is provided, using a floating capacitance to provide a machining target with improved surface roughness. An electrical discharge machining device 1 includes a current supply circuit 3 that supplies a current to a gap between an electrode 17 and a machining target 19 so as to provide electrical discharge machining. A floating capacitance portion 21 occurs between the electrode 17 and the machining target 19 in the electrical discharge machining. The floating capacitance portion 21 supplies its stored charge to the gap in the electrical discharge machining. A capacitor 11 stores a charge before the floating capacitance portion 21 is discharged. After the floating capacitance portion is discharged, the capacitor 11 charges the floating capacitance portion 21. The floating capacitance portion 21 is discharged again after it is charged. Such an operation generates a pulse current, thereby providing electrical discharge machining.

A wire electrical discharge machine for performing electrical discharge machining on a workpiece to be machined by applying voltage to an electrode gap formed between a wire electrode and the workpiece to generate electrical discharge at the electrode gap under predetermined machining conditions while conveying the wire electrode along a transfer path, includes: a wire breakage detector for detecting a breakage of the wire electrode; a position calculator for calculating the breakage position of the wire electrode in the transfer path; and an adjustment unit for adjusting the machining conditions when the breakage position is in a predetermined section of the transfer path.

A wire electrical discharge machine for performing electrical discharge machining on a workpiece to be machined by applying voltage to an electrode gap formed between a wire electrode and the workpiece to generate electrical discharge at the electrode gap under predetermined machining conditions while conveying the wire electrode along a transfer path, includes: a wire breakage detector for detecting a breakage of the wire electrode; a position calculator for calculating the breakage position of the wire electrode in the transfer path; and an adjustment unit for adjusting the machining conditions when the breakage position is in a predetermined section of the transfer path.

A wire electric discharge machine for machining a workpiece by causing a discharge between a wire electrode delivered from a wire bobbin and the workpiece. The wire electric discharge machine includes: a remaining length calculation unit that calculates a remaining length of the wire electrode based on electrode winding coefficients, bobbin draw-out radius correlation information, and a spool diameter of the wire bobbin. The electrode winding coefficients depend on a winding density of the wire electrode, an inner width of the wire bobbin, a wire diameter of the electrode wire, and a winding tension of the wire electrode. The bobbin draw-out radius correlation information is correlated with a bobbin draw-out radius that is a distance between a position at which the wire electrode wound around the wire bobbin is separated from the wire bobbin and a central axis of rotation of the wire bobbin.

A method of yielding a thinner product wafer from a thicker base SiC wafer cut from a SiC ingot includes: supporting the base SiC wafer with a support substrate: and while the base SiC wafer is supported by the support substrate, cutting through the base SiC wafer in a direction parallel to a first main surface of the base SiC wafer using a wire as part of a wire electrical discharge machining (WEDM) process, to separate the product wafer from the base SiC wafer, the product wafer being attached to the support substrate when cut from the base SiC wafer.

A method of yielding a thinner product wafer from a thicker base SiC wafer cut from a SiC ingot includes: supporting the base SiC wafer with a support substrate: and while the base SiC wafer is supported by the support substrate, cutting through the base SiC wafer in a direction parallel to a first main surface of the base SiC wafer using a wire as part of a wire electrical discharge machining (WEDM) process, to separate the product wafer from the base SiC wafer, the product wafer being attached to the support substrate when cut from the base SiC wafer.

A method for electrical discharge machining (EDM) a workpiece by means of a train of machining pulses. During the machining time the machining pulses are applied to the working gap between workpiece and electrode.

An open voltage is first applied, the ignition delay time t.sub.d is measured, then, at the beginning of the discharge, its fall time t.sub.f is measured, and certain shape features (e.g. the pedestal and ramp) of the pulse are adapted in real time for the very same discharge, as a function of said ignition delay time and/or fall time. Moreover, instead of shaping the very same discharge, one or more subsequent discharges can be shaped as a function of t.sub.d and/or t.sub.f of a single discharge, or of an average of t.sub.d and/or t.sub.f over several discharges.

A method for electrical discharge machining (EDM) a workpiece by means of a train of machining pulses. During the machining time the machining pulses are applied to the working gap between workpiece and electrode.

An open voltage is first applied, the ignition delay time t.sub.d is measured, then, at the beginning of the discharge, its fall time t.sub.f is measured, and certain shape features (e.g. the pedestal and ramp) of the pulse are adapted in real time for the very same discharge, as a function of said ignition delay time and/or fall time. Moreover, instead of shaping the very same discharge, one or more subsequent discharges can be shaped as a function of t.sub.d and/or t.sub.f of a single discharge, or of an average of t.sub.d and/or t.sub.f over several discharges.

A dielectric working fluid processor for processing dielectric working fluid used in a wire electrical discharge machine includes: a dirty liquid tank for storing dielectric working fluid containing machining swarf; a filter for removing machining swarf from the dielectric working fluid in the dirty liquid tank; a clean liquid tank for storing the dielectric working fluid from which the machining swarf has been removed by the filter; a pump for supplying dielectric working fluid from the dirty liquid tank to the filter; an inverter for controlling electric power to be supplied to the pump; a pump controller for controlling the rotation speed of the pump by varying the frequency of electric power supplied from the inverter to the pump; and a feed pressure obtainer for obtaining the feed pressure of the dielectric working fluid supplied from the pump to the filter, based on the frequency of the electric power.

A machining power supply device for an electric discharge machine performs control to turn on a first semiconductor switching element, which is arranged in series between a DC power supply and a capacitor connected in parallel with a machining gap between an electrode and a workpiece, to charge the capacitor, and turn on a second semiconductor switching element, which is arranged in parallel with the capacitor and connected to a rectifier element, within a period in which the first semiconductor switching element is off.