A resistive soldering system, includes a first electrode; a second electrode; a support cylinder; a resistive soldering joint which is adapted to raise or lower the first electrode, the second electrode and the support cylinder; and a power supply unit which is connected with the first and second electrodes and adapted to supply power and a heating current to the first and second electrodes.

A resistive soldering method, assembly of antenna and glass, and resistive soldering system are provided. The method includes providing glass and an antenna component including a base structure and a cylindrical structure having a hole on a front surface of the base structure; forming solder on a surface to be soldered of the glass or a surface to be soldered of the base structure; resistive soldering the surfaces to be soldered of the glass and the base structure to melt the solder, wherein during the resistive soldering process, first and second electrodes are used to apply pressure and heating current to edge portion on the front surface of the base structure, and a support cylinder is inserted into the hole and applies to the antenna component a pressure for attaching the antenna component to the glass.

A device for soldering an electrical conductor with a connection device includes a base plate having a passageway and an anvil mounted on the base plate and at least partially housed in the passageway. The anvil is electrically insulated from the base plate and positioned to allow an electrical current to pass through the electrical conductor and/or the connection device.

A method and a system of balancing a shaft for an axle assembly. The method may include using an electrical resistance welder to weld a balance weight to a shaft proximate an imbalance location using an insert or brazing material. The insert material may have a lower liquidus temperature than a liquidus temperatures of the shaft and balancing weight.

A power delivery system includes a power-input-channel, an AC/DC converter, one or more controller-circuits, a silicon-controlled-rectifier, a transformer, and a pair of output-leads. The power-input-channel receives alternating-current from a power-source. The AC/DC converter converts the alternating-current to a direct-current at a converter-output. The one or more controller-circuits are connected with the converter-output and control a signal indicative of a desired-power-level delivered for a desired-time. The silicon-controlled-rectifier is connected with the power-input-channel and controls an SCR-output-voltage to an SCR-output-channel proportional to the signal. The transformer reduces the SCR-output-voltage from a primary-side to a secondary-voltage on a secondary-side. The pair of output-leads are connected with poles of the secondary-side. A solder-joint is disposed between the pair of output-leads. The one or more controller-circuits determine the signal applied to the silicon-controlled-rectifier required to melt the solder-joint based on the desired-power-level and the desired-time, thereby melting the solder-joint disposed between the pair of output-leads.

A method of forming a brazed joint is described. The method includes pressing a non-molybdenum component, such as a cross pin of a battery case assembly, against a molybdenum component, such as a terminal pin of the battery case assembly, and applying one or more electrical pulses to form an interface liquid layer between the components that cools to form the brazed joint. At least one of the electrical pulses has a constant voltage over a pulse time. A contact resistance between the components can decrease during the pulse time, and thus, the constant voltage can cause an uncontrolled electrical current of the electrical pulse to increase. The increasing electrical current heats the components sufficiently to form the interface liquid layer having a predetermined thickness that provides a required bend strength. Removal of surface oxides provide consistent mechanical strength for this joint. Other embodiments are also described and claimed.

A method for braze repair of tight cracks in a superalloy component is provided. The method includes directing energy, e.g., from an acoustic energy source, towards surfaces of the tight crack to break up one or more contaminants, corrosion products, or oxides at the surface. The directed energy may cause opposed walls of the tight crack to vibrate to break up the oxides, and to generate a modest heat for allowing infiltration of the tight crack with a braze material. The braze material is then melted at a melt temperature of the braze material but below the melt temperature of the component. The braze material is then solidified to repair the tight crack.

A method of forming a brazed joint is described. The method includes pressing a non-molybdenum component, such as a cross pin of a battery case assembly, against a molybdenum component, such as a terminal pin of the battery case assembly, and applying one or more electrical pulses to form an interface liquid layer between the components that cools to form the brazed joint. At least one of the electrical pulses has a constant voltage over a pulse time. A contact resistance between the components can decrease during the pulse time, and thus, the constant voltage can cause an uncontrolled electrical current of the electrical pulse to increase. The increasing electrical current heats the components sufficiently to form the interface liquid layer having a predetermined thickness that provides a required bend strength. Removal of surface oxides provide consistent mechanical strength for this joint. Other embodiments are also described and claimed.

A wire termination system includes a heat applicator device to apply resistive heating to a specific connector pin of an electrical connector for the soldering of a wire to the connector pin. In operation, a wire of a cable is inserted into an interior cavity of the connector pin and resistive heating is applied to the connector pin resulting in the melting of solder contained within the interior cavity. Upon stoppage of the resistive heating by the heat applicator device, the solder within the interior cavity of the connector pin solidifies about the wire to form an electrical connection between the wire and the connector pin. The heat applicator device may then be repositioned to apply resistive heating to each additional connector pin of the electrical connector until all wires of the cable are soldered to their corresponding connector pins on the electrical connector.

A resistance soldering device configured for using with an electrical terminal having a first surface and a second surface opposite the first surface on which a layer of a solder composition is disposed includes an electrode having a first electrical conductor configured to be connected to a positive pole of an electrical power supply, a second electrical conductor configured to be connected to a negative pole of the electrical power supply and an electrically resistive bridge interconnecting the first and second electrical conductors. A method of using such a device is also presented herein.