It is an objective of the invention to provide a conductive joint article exhibiting electrical joinability comparable to that of solder joining of easy-to-solder joinable metals even when a joined member of the conductive joint article is made of a hard-to-solder joinable metal. There is provided a conductive joint article with conductive joined members electrically joined via a joining layer, at least one of the joined members being made of a hard-to-solder joinable metal. The joining layer comprises an oxide glass phase and a conductive metal phase. The oxide glass phase includes vanadium as a major constituent and at least one of phosphorus, barium and tungsten as an accessory constituent, and has a glass transition point of 390 C. or less. And, connection resistance between the joined members exhibits less than 110.sup.5 /mm.sup.2.

A method of resistance spot brazing a workpiece stack-up that includes a first thin-gauge steel workpiece and a second thin-gauge steel workpiece. The method includes several steps. A first step involves applying a filler material to a surface of the first thin-gauge steel workpiece. A second step involves bringing a surface of the second thin-gauge steel workpiece to adjoin the filler material. A third step involves clamping a first welding electrode and a second welding electrode on the first and second thin-gauge steel workpieces and over the filler material. A fourth step involves passing electrical current between the first and second welding electrodes and hence through the filler material. And a fifth step involves terminating passage of the electrical current in order to establish a brazed joint between the first and second thin-gauge steel workpieces.

A method of resistance spot welding a workpiece stack-up that includes a first steel workpiece and a second steel workpiece. The method includes several steps. The first steel workpiece can have a first surface coating. One step involves applying a filler metal to a surface of the first steel workpiece. Another step involves bringing a surface of the second steel workpiece to adjoin the filler metal. Yet another step involves clamping a first welding electrode and a second welding electrode on the first and second steel workpieces. And another step involves passing electrical current between the first and second welding electrodes and hence through the filler metal. And yet another step involves terminating passage of the electrical current in order to establish a weld joint between the first and second steel workpieces.

A resistive soldering method, assembly of antenna and glass, and resistive soldering system are provided. The method includes providing glass and an antenna component including a base structure and a cylindrical structure having a hole on a front surface of the base structure; forming solder on a surface to be soldered of the glass or a surface to be soldered of the base structure; resistive soldering the surfaces to be soldered of the glass and the base structure to melt the solder, wherein during the resistive soldering process, first and second electrodes are used to apply pressure and heating current to edge portion on the front surface of the base structure, and a support cylinder is inserted into the hole and applies to the antenna component a pressure for attaching the antenna component to the glass.

A method of manufacturing a terminal-formed electric wire includes a welding member placing process in which at least one welding member formed of metal having a melting point lower than that of a plurality of metal strands included in a core wire is arranged to the core wire of at least a terminal-forming target portion of the electric wire, and a terminal forming process in which the exposed terminal-forming target portion is interposed between first and second electrodes having a shape corresponding to a desired terminal shape, at least the welding member in the terminal-forming target portion is melted by electrically conducting the first and second electrodes while pressing the terminal-forming target portion with the first and second electrodes, and the melted metal is then solidified, so that the terminal-forming target portion is formed as a terminal portion having a desired terminal shape.

A method of manufacturing a hot gas wall for a gas turbine is described. The method is carried out on a hot gas wall having a wall part with a front side and a back side, the wall part being for exposure to a hot fluid on the front side, and the hot gas wall also having a turbulator structure. In an exemplary embodiment, a turbulator structure is attached to the wall by placing a braze foil on the back side of the wall part, placing a turbulator structure on the braze foil, and brazing to attach the turbulator structure to the wall part. In another embodiment, the turbulator structure is attached by passing a current through the turbulator structure part and the wall part to resistance weld the turbulator structure part to the wall part.

A system may include a current source; a first metal or alloy component with a first major surface electrically coupled to the current source; a second metal or alloy component with a second major surface electrically coupled in series to the first component and the current source via an external electrical conductor, where the first and second major surfaces are positioned adjacent to each other to define a joint region; a metal or alloy powder disposed in at least a portion of the joint region; and a controller. The controller may be configured to cause the current source to output an alternating current that conducts through the first component and the second component to induce magnetic eddy currents, magnetic hysteresis, or both within at least a portion of the metal or alloy powder disposed in at least the first portion of the joint region.

A pane provided with at least one electrical connection element is described. The pane has a substrate, an electroconductive structure on a region of the substrate, a layer of soldering mass on a region of the electroconductive structure, and a connection element on the solder mass. The connection element contains a first and a second base region, a first and a second transition region, and a bridge region between the first and the second transition region, a first and a second contact surface arranged on a lower side of the first and second base regions. The first and the second contact surfaces and surfaces of the first and the second transition regions, facing the substrate are connected to the electroconductive structure by the solder mass. An angle between a surface of the substrate and each tangential plane of the surfaces of the first and the second transition region, facing the substrate, is less than 90.

A system and method of braze resistance spot welding of an aluminum component to a galvanized steel component involve providing an aluminum-side electrode having a first tip defining a rounded shape, providing a galvanized steel-side electrode having a second tip defining a flat shape, depositing a braze filler material between the aluminum and galvanized steel components at a desired location for a spot weld, performing a pre-heat including providing a first current across the electrodes for a first period such that the braze filler melts and removes a portion of a zinc coating from the galvanized steel component, and after performing the pre-heat, performing a spot weld between the aluminum and galvanized steel components by providing a second current across the electrodes for a second period such that the aluminum melts and the galvanized steel does not melt, wherein the second current is greater than the first current.

Provided is a lead-free solder alloy for terminal preliminary plating, by which the separation property when pulling up the terminals from molten solder is improved. The lead-free solder alloy for terminal preliminary plating contains 4 mass % or more and 6 mass % or less of Cu, 0.1 mass % or more and 0.2 mass % or less of Ni, 0.01 mass % or more and 0.04 mass % or less of Ga, 0.004 mass % or more and 0.03 mass % or less of P, and a remainder of Sn, a total amount of Ga and P being 0.05 mass % or less. Its tension in a melted condition by heating in soldering temperature is 200 dyn/cm or less.