Patent classifications
B23K1/0004
BRAZED FIFTH WHEEL HITCH ASSEMBLY COMPONENTS AND METHOD OF CONSTRUCTING SAME
A brazing connection includes a first component comprising a first material and including a first connection portion, a second component comprising a second material and including a second connection portion, a heating element that is electrically conductive and electrically resistant positioned between the first connection portion of the first component and the second connection portion of the second component, where the heating element is configured to transmit heat when conducting an electrical current, and a brazing material configured to melt when receiving heat from the heating element, thereby connecting the first component to the second component.
METHOD OF USING RESISTANCE SOLDERING DEVICE
A method of method of resistance soldering may include providing a controllable electrical power supply having a negative pole and a positive pole. The method may include providing an electrical terminal having a first surface and a second surface opposite the first surface on which a solder layer is disposed. The method may include providing a resistance soldering device with an electrode having a first electrical conductor connected to the positive pole of the electrical power supply, a second electrical conductor connected to the negative pole of the electrical power supply, an electrically resistive bridge interconnecting the first and second electrical conductors. The method may include turning the electrical power supply on to provide an electrical current between the positive and negative poles. The method may include contacting the electrode to the first surface of the electrical terminal.
Tubing material, double wall steel tubes and method of manufacturing a double wall steel tube
A double wall steel tube includes an inner tube wall and an outer tube wall. The inner and outer tube walls are formed from a tubing material including an inner layer of iron steel, first and second outer layers of an alloy of aluminum and silicon, a first intermediate layer disposed between the inner layer and the first outer layer, and a second intermediate layer disposed between the inner layer and the second outer layer. The first and second intermediate layers include aluminum, silicon and iron. The inner and outer tube walls are brazed together.
Feed-through
A feed-through, in particular a feed-through which passes through part of a housing, in particular a battery housing, for example made of metal, in particular light metal, for example aluminum, an aluminum alloy, AlSiC, magnesium, an magnesium alloy, titanium, a titanium alloy, steel, stainless steel or high-grade steel. The housing part has at least one opening through which at least one conductor, in particular an essentially pin-shaped conductor, embedded in a glass or glass ceramic material, is guided. The base body is, for example, an essentially annular-shaped base body and is hermetically sealed with the housing part such that the helium leakage rate is smaller than 1*10.sup.8 mbar l/sec.
SYSTEM AND METHOD FOR JOINING STRUCTURES OF DISSIMILAR MATERIAL
A system and method for joining structures includes a method of joining a first panel to a second panel. A first workpiece formed of a first material is positioned adjacent a second workpiece formed of a second material and joined with a joining process. At least one welding insert is formed from the joined first and second workpieces having an upper portion formed of the first material and a lower portion formed of the second material. The at least one welding insert is positioned between a first panel formed of the first material and a second panel formed of the second material and placed between first and second electrodes of a welding device. First and second electrodes of the welding device generate an electric current to join the first panel, at least one welding insert, and the second panel.
JOINING METAL OR ALLOY COMPONENTS USING ELECTRIC CURRENT
A system may include a current source; a first metal or alloy component with a first major surface electrically coupled to the current source; a second metal or alloy component with a second major surface electrically coupled to the current source; a metal or alloy powder disposed in at least a portion of the joint region; and a controller. The first and second major surfaces may be positioned adjacent to each other to define a joint region. The controller may be configured to cause the current source to output an alternating current that passes from the first component, through at least a portion of the metal or alloy powder, into the second component. The frequency of the alternating current may be configured to cause standing electromagnetic waves within at least a portion of the particles of the metal or alloy powder.
JOINING METAL OR ALLOY COMPONENTS USING ELECTRIC CURRENT
A system may include a current source; a first metal or alloy component with a first major surface electrically coupled to the current source; a second metal or alloy component with a second major surface electrically coupled in series to the first component and the current source via an external electrical conductor, where the first and second major surfaces are positioned adjacent to each other to define a joint region; a metal or alloy powder disposed in at least a portion of the joint region; and a controller. The controller may be configured to cause the current source to output an alternating current that conducts through the first component and the second component to induce magnetic eddy currents, magnetic hysteresis, or both within at least a portion of the metal or alloy powder disposed in at least the first portion of the joint region.
Flip chip interconnection with reduced current density
A method and system for electrically connect a semiconductor device with a flip-chip form factor to a printed circuit board. An exemplary embodiment of the method comprises: aligning solder contacts on the device with a first copper contact and a second copper contact of the external circuitry, and, applying a supply current only directly to a buried layer of the first copper and not directly to the layer which is nearest the device, such that no current is sourced to the device through the layer nearest the device.
Method of producing a vehicle glass assembly
A method of producing a vehicle glass assembly, includes (A) providing a connector made of metal plate and comprising a first flat portion, a second flat portion and a bridge portion connecting between the first and the second flat portions, each the flat portion having a respective surface to be soldered, (B) soldering lead-free solder onto the surfaces to form first and second blocks of lead-free solder on the surfaces of the first flat portion and the second flat portion, respectively, (C) providing a glass substrate layer on which an electrically conductive layer comprising a wire pattern and a busbar is formed, and (D) sandwiching the lead-free solder blocks between their respective surfaces and the busbar, and then melting the blocks to form solder connections between the connector and the busbar; wherein the amount of lead-free solder in each of the blocks is between 15 mg and 50 mg.
METHOD FOR BONDING ELECTRICAL CONDUCTORS
A method for bonding electrical conductors is provided that is capable of suppressing a power source capacity when assembling a stator having a specific structure. First, coil pieces 9 are arranged in contact with bonding portions of a slot coil 5 inserted in a slot of a stator iron core 2 via a metal paste. Subsequently, an electrical current is applied using a pair of electrodes 11A and 11B in the axial direction (upward and downward in the figures) of the slot coil 5 while contact portions 15 between the slot coil 5 and the coil pieces 9 are pressed in an axial direction of the slot coil 5. As a result, electricity flows in the axial direction the coil piece 9 (a direction of an arrow X in the figures).