A PCD cutter formed by a reactive/exothermic bond formed between the diamond table and the substrate. The bond is formed by applying a small pulse of localized energy to a bonding agent containing exothermic reactive materials which is disposed at the interface of the diamond table and the substrate. The bonding agent may be formed by depositing a plurality of alternating layers of exothermic foils at the interface between the polycrystalline diamond table and the substrate. Additional layers may also be deposited between the polycrystalline diamond table and the plurality of layers of exothermic foils and between the foils and the substrate. One or more refractory layers may also be disposed between the layers of exothermic material and a masking or non-wetting material may be applied to one or more sides of the substrate and diamond table.

The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T.sub.1.

A self-heating solder flux material includes a solder flux material and a multi-compartment microcapsule. The solder flux material includes a solvent carrier, and the multi-compartment microcapsule includes a first compartment, a second compartment, and an isolating structure. The first compartment contains a first reactant, and the second compartment contains a second reactant. The isolating structure separates the first compartment from the second compartment. The isolating structure is adapted to rupture in response to a stimulus. Rupture of the isolating structure results in an exothermic reaction between the first reactant and the second reactant. The exothermic reaction generates heat to volatilize the solvent carrier

The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T.sub.1.

A method of forming a weld interface between a first workpiece and a second workpiece includes arranging a reactive braze material at a first joining surface of the first workpiece. The reactive material is selected to react upon being heated to a temperature below the solidus temperature of the first and second workpieces to form a liquid-containing reaction product. Furthermore, an assembly is prepared of the first workpiece and the second workpiece with the first joining surface of the first workpiece and a second joining surface of the second workpiece separated by the reactive material. The second workpiece is then heated with a first laser beam following a first path and with a second laser beam following a second path.

A method for installing a first machine part into a second machine part includes press fitting the first machine part into the second machine part in its intended final position. The method also includes disposing an exothermically reactive substance on or in the first machine part and activating the exothermically reactive substance to cause a thermal structural change, stress relief, for example, in a part of the first machine part.

The invention relates to a method for forming a bonded joint between a structure that is applied to a glass substrate, in particular a printed conductive structure and an electrical connecting component, in particular a solder base by using solder coated or non-solder coated reactive nanometer multilayer foils which are made from at least two exothermally reacting materials. Initially preconfiguring the reactive nanometer multilayer foils according to the opposing joining surfaces of the conductive structure and the electrical closure element is performed. Thereafter arranging a solder preform respectively between the respective joining surface and the nanometer multilayer foil for non-solder coated foils or arranging an additional solder preform for already solder coated nanometer multilayer foils is performed, wherein the solder preform or the additional solder preform includes a larger, in particular double thickness layer compared to another solder preform between the nanometer multilayer foil and the a conductive structure applied to the glass substrate so that a reduction of the temperature introduction into the conductive structure and a leveling of uneven portions is caused. After temporarily applying a pressure force which is applied between the joining surfaces triggering the exothermal reaction of the nanometer multilayer foil is performed by an electrical impulse or a laser impulse.

Micrometer scale components comprise a component body comprising an alloy of a first solder metal and a second solder metal, the alloy having a higher liquidus temperature than the second solder metal; and a base region of the structure body wetted to a substrate, wherein the component body has a molded surface profile.

An article treatment method includes positioning an article having a base material. A weld filler material is applied to the base material by welding to form a treated article. The weld filler material includes at least one temperature depressant element at a concentration sufficient to form potential eutectic-containing zones in the welded article. The potential eutectic-containing zones contain the at least one temperature depressant element. The welded article is heated to a temperature sufficiently high and for a time sufficiently long to form at least partially liquefied eutectic-containing zones. The at least partially liquefied eutectic zones are capable of flow into cracks formed during the welding.

Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melting temperature of the AgX, CuX or NiX alloy is greater than the melting temperature of the basic solder. The invention also relates to a method for forming a laminated composite (10) and to a circuit arrangement containing a laminated composite (10) according to the invention.