An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.

A substrate support and method of forming a substrate support are described herein. In one example, a substrate support includes an aluminum body having an upper surface configured to support a large area substrate, a heater element, and a filler material. The aluminum body has a groove formed therein. The heater element is disposed in the groove. The filler material is in contact with the heater element and fills the groove. The contact between the filler material and the perimeter of the heater element is the only material interface within the groove, and the filler material has a larger grain size than a grain size of the aluminum body.

An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head.

It is an object of the present invention to effectively suppress the overflow of brazing material from each joint of a sinter-brazed component, such as a planetary carrier, obtained by brazing a plurality of members together. According to the present invention, there is provided a sinter-brazed component obtained by mating and joining a first member having a first bonding surface and a second member having a second bonding surface to each other. Brazing material is provided between the first bonding surface and the second bonding surface. The first bonding surface has a first recess, the first recess having an inner peripheral wall and a bottom surface. The inner peripheral wall extends along and on an inner side of a profile line of the first bonding surface.

An assembly is provided. The assembly includes a component, a solder pin arranged on the component, an electrical structural unit, and a soldering point which is arranged on the electrical structural unit and forms an opening, into which the solder pin is insertable along an insertion direction in order to produce a soldered joint. The solder pin has an insertion portion which, on sides of the solder pin that face away from each other, forms insertion walls which are arranged at an acute angle to one another in such a way that the insertion portion tapers in the insertion direction. A part of the insertion portion is arranged outside the opening in such a way that one or more portions of the insertion walls extend inside the opening and one or more portions of the insertion walls extend outside the opening.

The present disclosure relates to components, such as base bodies, for feed-through elements including a metallic base body, at least one through-opening for receiving a functional element in a fixing material, such as an electrically insulating fixing material, and at least one conductor, which is connected electrically conductively to the base body by a soldered connection. The soldered connection includes a metallic solder material that covers a surface region of the base body and thus forms a soldering region on a surface of the base body. The base body has, at least in the soldering region, a microstructuring that includes at least depressions in the surface of the base body. The present disclosure similarly relates to methods for producing such base bodies and to applications thereof.

Processes for forming an electric heater comprise providing a heater element and a power supply, applying a layer of a diffusion solder paste onto the heater element and/or the power supply and drying the applied diffusion solder paste, arranging the heater element and the power supply such that the heater element and the power supply contact each other via the dried diffusion solder paste, and diffusion soldering the arrangement to form a connection between the heater element and the power supply. The diffusion solder paste comprises or consists of 10-30 wt.-% of at least one type of particles selected from the group consisting of copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, 60-80 wt.-% of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and 3-30 wt.-% of a solder flux.

A brazing material is interposed between an aluminum-based material and an iron-based material plated with Ni. The brazing material has a structure in which an Al—Si—Ni based alloy layer and an Al layer are bonded via a flux layer. A structure for brazing is formed such that the Al—Si—Ni based alloy layer is located on the aluminum-based material side and the Al layer is located on the iron-based material side. The structure is heated in a furnace and is thereafter cooled, thereby obtaining a brazed joint body in which the Ni plating that is a barrier layer remains and an Al—Ni layer is formed.

The invention relates to a refractory anchor comprising an elongated mounting pin having a first end and a second end opposite to the first end seen in the longitudinal direction of the elongated mounting pin, wherein the first end is weldable to an object, the refractory anchor further comprises at least one anchor fin having a first side at least partially connected to the elongated mounting pin. The invention further relates to an assembly comprising an object and a refractory anchor welded to the object, and to a method for manufacturing the assembly.

Provided is A metal paste for joints, containing: metal particles; and monovalent carboxylic acid having 1 to 9 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 μm to 0.8 ηm, and a content of the monovalent carboxylic acid having 1 to 9 carbon atoms is 0.015 part by mass to 0.2 part by mass with respect to 100 parts by mass of the metal particles.