Embodiments of the present invention provides an approach for repairing defects in a structure, located in difficult to reach area, by using a self-guiding and self-melting robotic thread. The approach can use an external guidance system to find the target location of the structure and deploy a robotic thread to the defective area. Portion of the robotic thread contains a filler material can have similar materials to the structure. After the system has determined the size, length and volume of the repair, the system calculates the required length of the robotic thread and guides the thread to the defective area. Once the robotic thread is in place, the filler material begins to melt via heat. The filler material, in a melted and pliable state, can flow into the defect area. Once cooled, the filler material can now support the structure.

Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.

A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component. The first and the second refrigerant circuit components are within a common refrigerant circuit that is disposed within a common support structure. The HVAC packaged unit also includes an interconnection conduit having a length formed from aluminum, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length. The first end segment and the second end segment are each formed from copper, and the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component.

Methods of servicing a fuel nozzle are provided. a method of servicing a fuel nozzle includes a step of machining away material from a nozzle tip of the fuel nozzle to form an annular groove within the nozzle tip. The method further includes a step of inserting a replacement coupon into the annular groove. The replacement coupon having a radially outermost that corresponds to the annular groove and a post-removal contact surface. The method further includes a step of fixedly coupling the radially outermost of the replacement coupon to the annular groove.

An article of manufacture comprises a first component having a first mating surface and a second component having a second mating surface. The first component may include an aperture having internal splines or gear teeth, and/or an outer perimeter having external splines or gear teeth. The first and second components are disposed such that a gap is provided between the first and second mating surfaces. Brazing material is disposed between the first and second mating surfaces so as to mechanically couple the first and second components. The first component may be made of a powdered metal or a non-powdered metal, and the second component may be made of the other of such two metals. In one embodiment, the first component may be a planetary carrier plate portion having internal splines and the second component may be a planetary carrier spider portion.

The present disclosure relates to a method of manufacturing a semiconductor device package. The method includes: (a) disposing a support structure on a first substrate; (b) electrically connecting a first electronic component on the first substrate, wherein a portion of the first electronic component is separated from the first substrate by the support structure; (c) heating the semiconductor device package; and (d) removing the support structure.

A first cylindrical member including protrusions on an end face is formed in an axial direction, the end face having projections and recesses in the axial direction so as to correspond to cam profiles of first and second cam grooves, a second cylindrical member having an end face having projections and recesses so as to correspond to the projections and the recesses of the first cylindrical member is formed, and at a position where the projections and the recesses of the first cylindrical member correspond to the projections and the recesses of the second cylindrical member, the protrusions of the first cylindrical member are joined to the end face of the second cylindrical member, to thereby form the first cam groove on an inner side of the protrusions in the circumferential direction and form the second cam groove on an outer side of the protrusions in the circumferential direction.

The disclosure provides a joining process line monitoring system capable of preventing joining quality deterioration and operation delay. A joining process line monitoring system 100 includes a joining phenomenon data acquisition part 111 configured to acquire a joining phenomenon of a joining subject member as phenomenon data; an operation state data acquisition part 112 configured to acquire a joining operation state of the joining subject member as operation state data; an evaluation data calculation unit 120 configured to perform time synchronization of the acquired phenomenon data and the acquired operation state data, and associate the acquired phenomenon data and the acquired operation state data with each joining operation location, so as to calculate evaluation data; a difference data extraction unit 130 configured to extract a difference between the evaluation data and reference data set in advance as difference data; an abnormal location determination unit 140 that determines that a portion having a large difference from the joining phenomenon is an abnormal location; and a presentation unit 150 configured to present the abnormal location of a joining portion of the joining subject member based on the difference data.

A solder alloy, includes: about 3 wt % to about 15 wt % of Sb; about 0.01 wt % to about 1.5 wt % of Te; and about 0.005 wt % to about 1 wt % of at least one element selected from the group consisting of Zn, Co, and Cr; and a balance of Sn.

The disclosure discloses a manufacturing method of tempered vacuum glass, comprising the following steps: (1) manufacturing metalized layers, and performing tempering or thermal enhancement on the glass substrates; (2) placing a metal solder on the metalized layers; (3) superposing the glass substrates to form a tempered glass assembly; (4) heating the tempered glass assembly to 60-230° C.; (5) keeping the tempered glass assembly within the heating temperature range of step (4) in a vacuum chamber, and vacuumizing the vacuum chamber to a preset vacuum degree; and (6) hermetically sealing the metalized layers by adopting a metal brazing process. By adopting the manufacturing method of the disclosure, the stress when the two glass substrates are sealed can be greatly reduced, and the connection strength can be increased; moreover, when gas is exhausted within the temperature range, the exhaust efficiency is high, and the exhaust effect is better, vacuum glass with high vacuum degree can be obtained, and the service life of the vacuum glass is prolonged. The disclosure further discloses a tempered vacuum glass production line based on the above mentioned manufacturing method.