Patent classifications
B23K1/0008
GAS DISTRIBUTION PLATE WITH HIGH ASPECT RATIO HOLES AND A HIGH HOLE DENSITY
A gas distribution plate for a showerhead assembly of a processing chamber may include at least a first plate and second plate. The first plate may include a first plurality holes each having a diameter of at least about 100 um. The second plate may include a second plurality of holes each having a diameter of at least about 100 um. Further, each of the first plurality of holes is aligned with a respective one of the second plurality of holes forming a plurality of interconnected holes. Each of the interconnected holes is isolated from each other interconnected holes.
IC chip package with dummy solder structure under corner, and related method
An integrated circuit (IC) chip package includes a substrate and a wafer comprising an IC chip arranged on the substrate. The substrate includes first mounting pads unconnected to electrical connections in the substrate. The wafer includes second mounting pads that are disposed around corners of the IC chip, that extend radially outward relative to circuitry in the IC chip, that are unconnected to circuitry in the IC chip, and that mate with the first mounting pads on the substrate, respectively.
Control of thermal interface material in multi-chip package
An electronic system includes a plurality of heat sources. At least two of the plurality of heat sources vary in height and each of the plurality of heat sources includes a first side and a second side. The electronic system also includes a substrate having a first side and a second side. The second side of each of the plurality of heat sources is positioned adjacent to the first side of the substrate. The electronic system further includes a cover member provided above the plurality of heat sources and a sintering thermal interface material provided between the cover member and the first side of one of the at least two heat sources that vary in height.
APPARATUS, SYSTEMS AND METHODS FOR A BRAZED JOINT
The disclosed apparatus, systems and methods relate to the design principles for forming a welded joint between two sections of tubing or pipe. The material at the end portion of a first section of tubing to is folded inwardly to create a support surface. This support surface improves the ability to weld light gage material with traditional arc welding and it creates conditions to allow brazing to be as strong as traditional arc welding by using A shaped piece of filler material which is located at the intersection between the support surface of the first section of tubing and a side wall section of the second section of tubing. While holding together the first and second sections of tubing with the filler material, heat is applied at the intersection at a temperature and for a duration sufficient to melt the filler material and form the 3t joint.
Method and apparatus for mounting optical components
A method and apparatus for mounting optical components is described. The apparatus (1) is suitable for mounting multiple optical components (2) and comprises a baseplate (3) having opposing first (4) and second (5) surfaces. Recesses or apertures (7) are formed within the baseplate and are located upon the first or second surfaces so as to define thermally activated optic mounting areas. Pillars (13) are then located within the thermally activated optic mounting areas and these provide a means for attaching the optical component to the baseplate (3). The employment of the recesses or apertures act to significantly reduce the thermal conduction throughout the baseplate. As a result preferential heating can be provided to the one or more thermally activated optic mounting areas while maintaining the baseplate with a desired mechanical strength. The optical mounting apparatus exhibits a high thermal stability thus making the apparatus ideally suited for use within commercial optical system.
Low deflection sputtering target assembly and methods of making same
Described is a design and method for producing a sputtering target assembly with low deflection made from target material solder bonded to composite backing plate with coefficient of thermal expansion (CTE) matching the target material. The composite backing plate is composite configuration composed of at least two different materials with different CTE. The composite backing plate, after plastic deformation, if necessary, has a CTE matching the target material and low and desirable deflection in the bonding process, and therefore, resulting in a low deflection and low stress target material bonded to composite backing plate assembly. The method includes manufacturing composite backing plate with a flat bond surface, heat treating of target blank and composite backing plate to achieve desirable shape of bond surfaces, solder bonding target to a backing plate, and slowly cooling the assembly to room temperature. Matching CTE in both target material and backing plate eliminates the problem of CTE mismatch and prevents the assembly from deflection and internal stress.
SURFACE MODIFIED HEATER ASSEMBLY
An air data probe includes a probe head having an interior surface defining a cavity, a component positioned within the cavity of the probe head, a plurality of protrusions defining contact between the interior surface of the probe head and a peripheral surface of the component prior to brazing the component to the probe head, and a braze material located between the interior surface of the probe head and the peripheral surface of the component as a result of brazing the component to the probe head.
Method for producing a pin for a feedthrough of an electromedical implant and a feedthrough
A method for producing a pin for a feedthrough for an electromedical implant. A pin is produced using the following method steps: creating a foil-, sheet- or strip-shaped semi-finished product by joining at least one first layer element including an electrically conducting, preferably biocompatible, material in foil, sheet or strip form and at least one second layer element including a solder and/or an easily soft-solderable material, preferably in wire, sheet or strip form, or by applying the at least one second layer element onto the at least one first layer element; and at least partially detaching a pin, or a set of multiple pins connected to a connecting web 46, from the semi-finished product. A method is also provided for producing a feedthrough and an electromedical implant and to a pin, a feedthrough or an implant produced in the corresponding manner.
NUCLEAR REACTOR FUEL ROD AND FUEL ASSEMBLY HAVING BUNDLED SAME
A nuclear reactor fuel rod is a fuel rod for a light-water reactor. The nuclear reactor fuel rod includes a fuel cladding tube and an end plug, both of which are formed of a silicon carbide material. A bonding portion between the fuel cladding tube and the end plug is formed by brazing with a predetermined metal bonding material interposed, and/or by diffusion bonding. The predetermined metal bonding material has a solidus temperature of 1200° C. or higher. An outer surface of the bonding portion, and a portion of an outer surface of the fuel cladding tube and the end plug, which is adjacent to the outer surface of the bonding portion are covered by bonding-portion coating formed of a predetermined coating metal. The predetermined metal bonding material and the predetermined coating metal have an average linear expansion coefficient which is less than 10 ppm/K.
METHOD FOR BRAZING A METAL PART ONTO A ZIRCONIA COMPONENT, AND BRAZED IMPLANTABLE DEVICE
A method for brazing a metal part onto a surface of a zirconia component. The method involves the steps of altering the surface state of the component to permit the attachment of a first metallization layer, cleaning the component to eliminate the impurities from its surface, depositing a first metallization layer, having mainly titanium, on the surface of the component, depositing a second metallization layer, having mainly niobium, on the first metallization layer, applying the part against the second metallization layer, depositing a gold brazing metal on the part and the second metallization layer, cooling the brazed area in a temperature-controlled manner, and stress-relieving heat treatment being performed under load on the metal part before brazing.