A magnetic-field melting solder that melts by the action of an AC magnetic field is provided. The magnetic-field melting solder includes solder material; and magnetic material composing of ferrite or Ni, a proportion of the magnetic material to the entire magnetic-field melting solder being 0.005% to 5% by weight. A joining method using the magnetic-field melting solder includes providing the magnetic-field melting solder between an electrode on a substrate and an electrode of an electronic component, and joining together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the magnetic-field melting solder.

A method and apparatus for manufacturing a brazed heat exchanger. The method includes the steps of: assembling the heat exchanger components to form at least one unbrazed heat exchanger core in a core builder machine; without removing the at least one heat exchanger core from the core builder machine, enclosing the heat exchanger core with a brazing tool arrangement adapted to form a chamber, optionally, evacuating the chamber and/or filling the chamber with a controlled atmosphere; brazing the heat exchanger core in the chamber to form a brazed heat exchanger.

A method and apparatus for manufacturing a brazed heat exchanger. The method includes the steps of: assembling the heat exchanger components to form at least one unbrazed heat exchanger core in a core builder machine; without removing the at least one heat exchanger core from the core builder machine, enclosing the heat exchanger core with a brazing tool arrangement adapted to form a chamber, optionally, evacuating the chamber and/or filling the chamber with a controlled atmosphere; brazing the heat exchanger core in the chamber to form a brazed heat exchanger.

The present invention relates to a release system (1, 2, 3, 4, 5), that includes a segmented structural element (10) comprising: a first segment (10a) designed to be coupled to a first structure, a second segment (10b) designed to be coupled to a second structure, and a solder joint (11) joining respective ends of said first (10a) and second (10b) segments, thus holding down the first and second structures with respect to one another; wherein said solder joint (11) is electromagnetically heatable and includes a solder alloy having a predefined melting temperature. The release system (1, 2, 3, 4, 5) is characterized by further including magnetic field generating means (13, PW1, PW2, PW3, PW4, PW5) configured to, upon reception of a release command, generate a time-varying magnetic field through the solder joint (11) such that to cause heating thereof up to the predefined melting temperature of the solder alloy, thereby causing melting of said solder alloy; whereby separation of the first (10a) and second (10b) segments is caused, thus enabling release of the first and second structures from one another.

The present invention relates to a release system (1, 2, 3, 4, 5), that includes a segmented structural element (10) comprising: a first segment (10a) designed to be coupled to a first structure, a second segment (10b) designed to be coupled to a second structure, and a solder joint (11) joining respective ends of said first (10a) and second (10b) segments, thus holding down the first and second structures with respect to one another; wherein said solder joint (11) is electromagnetically heatable and includes a solder alloy having a predefined melting temperature. The release system (1, 2, 3, 4, 5) is characterized by further including magnetic field generating means (13, PW1, PW2, PW3, PW4, PW5) configured to, upon reception of a release command, generate a time-varying magnetic field through the solder joint (11) such that to cause heating thereof up to the predefined melting temperature of the solder alloy, thereby causing melting of said solder alloy; whereby separation of the first (10a) and second (10b) segments is caused, thus enabling release of the first and second structures from one another.

A Magnetic-field melting preform solder that melts by action of an AC magnetic field, wherein the preform solder includes a laminated structure made up of two or more layers, at least two layers constituting the laminated structure is made up of solder material, the at least two layers do not contain ferromagnetic material, each of the at least two layers includes a surface facing with each other, and the surfaces facing with each other are in contact with each other. A bonding method using the preform solder includes a providing the preform solder between an electrode on a substrate and an electrode of an electronic component, and bonding together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the preform solder.

The present invention relates to new brazing alloys containing copper, silver, zinc, manganese, and indium, and a method for their production and their use.

The present invention relates to new brazing alloys containing copper, silver, zinc, manganese, and indium, and a method for their production and their use.

A hybrid diffusion-brazing process and hybrid diffusion-brazed article are disclosed. The hybrid diffusion-brazing process includes providing a component having a temperature-tolerant region and a temperature-sensitive region, brazing a braze material to the temperature-tolerant region during a localized brazing cycle, then heating the component in a furnace during a diffusion cycle. The brazing and the heating diffusion-braze the braze material to the component, and the localized brazing cycle is performed independent of the diffusion cycle in the hybrid diffusion-brazing process. The hybrid diffusion-brazed article includes a component, and a braze material diffusion-brazed to the component with a filler material. The filler material has a melting temperature that is above a tolerance temperature of the component.

A hybrid diffusion-brazing process and hybrid diffusion-brazed article are disclosed. The hybrid diffusion-brazing process includes providing a component having a temperature-tolerant region and a temperature-sensitive region, brazing a braze material to the temperature-tolerant region during a localized brazing cycle, then heating the component in a furnace during a diffusion cycle. The brazing and the heating diffusion-braze the braze material to the component, and the localized brazing cycle is performed independent of the diffusion cycle in the hybrid diffusion-brazing process. The hybrid diffusion-brazed article includes a component, and a braze material diffusion-brazed to the component with a filler material. The filler material has a melting temperature that is above a tolerance temperature of the component.