To provide a solder material capable of performing soldering with high reliability while suppressing materials other than a solder metal to remain inside the solder after the soldering. Coil-shaped carbons are heated by electromagnetic waves by using a solder material in which coil-shaped carbons of 0.5 weight % to 1.5 weight % with respect to a weight of a solder paste are mixed, thereby performing soldering by heating the solder material itself.

To provide a solder material capable of performing soldering with high reliability while suppressing materials other than a solder metal to remain inside the solder after the soldering. Coil-shaped carbons are heated by electromagnetic waves by using a solder material in which coil-shaped carbons of 0.5 weight % to 1.5 weight % with respect to a weight of a solder paste are mixed, thereby performing soldering by heating the solder material itself.

The disclosure provides a soldering component and a method of assembling a soldering component to objects, the soldering component comprises a body part and an assembling part, the assembling part is for combining to the object, the body part has a snap-fit part, the snap-fit part has an elastic retracting space, and the elastic retracting space can elastically retract two or more fastening parts, so that each fastening part fastens into another object, and the soldering component has a solderable surface for soldering to an assembling part of the object, the assembling part of the object is preset with a tin soldering layer, which is heated and soldered the soldering component and the assembling part of the object.

The disclosure provides a soldering component and a method of assembling a soldering component to objects, the soldering component comprises a body part and an assembling part, the assembling part is for combining to the object, the body part has a snap-fit part, the snap-fit part has an elastic retracting space, and the elastic retracting space can elastically retract two or more fastening parts, so that each fastening part fastens into another object, and the soldering component has a solderable surface for soldering to an assembling part of the object, the assembling part of the object is preset with a tin soldering layer, which is heated and soldered the soldering component and the assembling part of the object.

One of a first metallic pipe containing a first metal as a main component and a second metallic pipe containing a second metal as a main component includes an expanded-diameter connecting part which is formed at an end part of the one metallic pipe. An inner diameter of the end part is greater than an inner diameter of an adjacent part that is adjacent to the end part. An intermetallic compound layer of the first and second metal is present at an interface of the first and second metal located between a brazing filler metal and the one or the other of the metallic pipes. A thickness of the intermetallic compound layer is configured such that the thickness of an end portion on the side of a base end is smaller than the thickness of an end portion on the side of an open end.

One of a first metallic pipe containing a first metal as a main component and a second metallic pipe containing a second metal as a main component includes an expanded-diameter connecting part which is formed at an end part of the one metallic pipe. An inner diameter of the end part is greater than an inner diameter of an adjacent part that is adjacent to the end part. An intermetallic compound layer of the first and second metal is present at an interface of the first and second metal located between a brazing filler metal and the one or the other of the metallic pipes. A thickness of the intermetallic compound layer is configured such that the thickness of an end portion on the side of a base end is smaller than the thickness of an end portion on the side of an open end.

A method for reducing a process time for soldering electrical or electronic components by electromagnetic induction heating, in particular soldering electrical contact elements with solder connection surfaces which are applied to a non-metallic substrate, in particular a glass pane, the method comprising the steps providing an electrical contact element configured as a solder base and made from an iron nickel or iron chromium alloy material; applying a lead free connection material to the soldering base, wherein the connection material or the solder is made from a lead free material, in particular Bi.sub.57Sn.sub.42Ag.sub.1, Bi.sub.57Sn.sub.40Ag.sub.3, SAg.sub.3.8Cu.sub.0.7 or Sn.sub.55Bi.sub.44Ag.sub.1; positioning the soldering base on the respective solder contact surface; inductive heating of the solder base by high frequency energy with increased heating of the solder base material and reduced heating of the material of the respective solder connection surface; and completing the soldering step after a time period of less than or equal to 10 seconds, advantageously 4 to 6 seconds. The invention also relates to a contact element configured as a particular soldering base.

A method for reducing a process time for soldering electrical or electronic components by electromagnetic induction heating, in particular soldering electrical contact elements with solder connection surfaces which are applied to a non-metallic substrate, in particular a glass pane, the method comprising the steps providing an electrical contact element configured as a solder base and made from an iron nickel or iron chromium alloy material; applying a lead free connection material to the soldering base, wherein the connection material or the solder is made from a lead free material, in particular Bi.sub.57Sn.sub.42Ag.sub.1, Bi.sub.57Sn.sub.40Ag.sub.3, SAg.sub.3.8Cu.sub.0.7 or Sn.sub.55Bi.sub.44Ag.sub.1; positioning the soldering base on the respective solder contact surface; inductive heating of the solder base by high frequency energy with increased heating of the solder base material and reduced heating of the material of the respective solder connection surface; and completing the soldering step after a time period of less than or equal to 10 seconds, advantageously 4 to 6 seconds. The invention also relates to a contact element configured as a particular soldering base.

The present disclosure provides a plow blade edge device for mounting to a moldboard of a plow comprising at least one adapter blade including a bottom edge having selectively carbide insert(s) along at least a portion of the bottom edge. The disclosure further provides for a method of brazing the carbide insert(s) in a cavity along at least a portion of the bottom edge. The device further includes at least one wear block selectively reversible to present the adapter blade at a first angle or a second angle. The at least one wear block can include a bottom edge having a carbide insert along at least a portion of the bottom edge.

The present disclosure provides a plow blade edge device for mounting to a moldboard of a plow comprising at least one adapter blade including a bottom edge having selectively carbide insert(s) along at least a portion of the bottom edge. The disclosure further provides for a method of brazing the carbide insert(s) in a cavity along at least a portion of the bottom edge. The device further includes at least one wear block selectively reversible to present the adapter blade at a first angle or a second angle. The at least one wear block can include a bottom edge having a carbide insert along at least a portion of the bottom edge.