An example method of joining a first substrate with a second substrate includes applying a filler material between respective portions of the first substrate and the second substrate, the filler material including an electrically conducting and/or magnetic material, wherein the filler material and the respective portions define a joint; applying an alternating magnetic field to the joint to heat the electrically conducting material to a reaction temperature; in response to heating the electrically conducting material to the reaction temperature, energizing the joint using energy released from the electrically conducting material; cooling the joint to join the first substrate with the second substrate.

An example method of joining a first substrate with a second substrate includes applying a filler material between respective portions of the first substrate and the second substrate, the filler material including an electrically conducting and/or magnetic material, wherein the filler material and the respective portions define a joint; applying an alternating magnetic field to the joint to heat the electrically conducting material to a reaction temperature; in response to heating the electrically conducting material to the reaction temperature, energizing the joint using energy released from the electrically conducting material; cooling the joint to join the first substrate with the second substrate.

Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.

Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.

An electric heating device includes a housing with a partition wall which separates a connection chamber from a heating chamber for emitting heat. At least one heating assembly housing projects from the partition wall in the direction of the heating chamber. The heating assembly housing supports at least one PTC element and strip conductors in an electrically insulated manner A housing wall projecting from the partition wall and delimiting the connection chamber and/or the heating chamber and/or the heating assembly housing is connected to the partition wall by material bonding, which may be by induction soldering. Also disclosed is a method of making an electric heating device.

A method for creating a bonded zinc-coated structure is provided. In another aspect, a sheet metal joining system includes a heated roller contacting a sheet metal workpiece to braze together zinc-based coatings. A further aspect employs a zinc coated metal sandwich including a core having peaks and valleys.

The invention relates to a process for manufacturing a vacuum insulated glazing wherein the glazing is assembled in a single stage by supplying glass panes, metallic spacers and corner and frame metallic seal elements which are brazed onto adhesion layers previously deposited onto the edge region areas of the glass panes.

The invention relates to a process for manufacturing a vacuum insulated glazing wherein the glazing is assembled in a single stage by supplying glass panes, metallic spacers and corner and frame metallic seal elements which are brazed onto adhesion layers previously deposited onto the edge region areas of the glass panes.

The invention relates to a method for producing a mistuning component. The method comprises the following steps: a) producing a container (34) having at least one chamber (36); b) producing a lid (32, 32′); c) inserting at least one impulse element into the chamber (36); d) joining the lid (32, 32′) and the container (36), wherein joining is carried out by soldering/brazing.

The invention relates to a method for producing a mistuning component. The method comprises the following steps: a) producing a container (34) having at least one chamber (36); b) producing a lid (32, 32′); c) inserting at least one impulse element into the chamber (36); d) joining the lid (32, 32′) and the container (36), wherein joining is carried out by soldering/brazing.