Patent classifications
B23K1/002
INDUCTION HEATING DEVICE, JOINING METHOD, JOINED COMPONENT AND ROTARY ELECTRIC MACHINE INCLUDING THE SAME
A joined component comprises a first heated body, a second heated body, a brazing material, a first heated portion and a second heated portion. The first body comprises an insertion opening and an inserted portion coupled with the insertion opening. The second body comprises an insertion portion inserted into the inserted portion through the insertion opening. The first heated portion is provided at a first position including at least a part of the inserted portion and at least a part of the insertion portion. The second heated portion is provided at a second position separate from the insertion portion where a ratio “L/D” satisfies being 0.4 or more and 0.8 or less, where “L” is a length from the insertion opening to the second portion and “D” is an outer diameter of the second heated body.
METHOD FOR BRAZING AND USE OF A BRAZING FOIL FOR INDUCTION BRAZING
A method for brazing is provided, in which an amorphous or partially amorphous brazing foil, having a composition with a metalloid content of 10 to 30 at. %, is arranged at a joining point of two or more parts. The brazing foil is in the form of a wound ring-shaped strip which has a short-circuited current path between at least two layers lying one on top of the other. The brazing foil inductively heated, melted and a brazed connection of the parts is produced.
METHOD FOR BRAZING AND USE OF A BRAZING FOIL FOR INDUCTION BRAZING
A method for brazing is provided, in which an amorphous or partially amorphous brazing foil, having a composition with a metalloid content of 10 to 30 at. %, is arranged at a joining point of two or more parts. The brazing foil is in the form of a wound ring-shaped strip which has a short-circuited current path between at least two layers lying one on top of the other. The brazing foil inductively heated, melted and a brazed connection of the parts is produced.
Solder processing device
In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5).
Solder processing device
In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5).
SYSTEMS AND METHODS FOR REMOVING AN ADHESIVELY-ATTACHED COMPONENT FROM A CIRCUIT BOARD ASSEMBLY
Apparatus and associated methods relate to removing an adhesively-attached component from a circuit board assembly. A complementary pair of high-permeability members are positioned on opposite sides of the circuit board assembly about the adhesively-attached component. Then, a magnetic field is induced within the complementary pair of high permeability members via a coil driver generating an AC current in an inductive coil circumscribing a central pedestal of the complementary pair of high-permeability members. The magnetic field induced is directed through the adhesively-attached component via a central pedestal located proximate the adhesively-attached component. A return path for the magnetic field is provided about a periphery of the adhesively-attached component via a peripheral pedestal.
SOLDERING COMPONENT AND METHOD OF ASSEMBLING SOLDERING COMPONENT TO OBJECT
The disclosure provides a soldering component and a method of assembling a soldering component to objects, the soldering component comprises a body part and an assembling part, the assembling part is for combining to the object, the body part has a snap-fit part, the snap-fit part has an elastic retracting space, and the elastic retracting space can elastically retract two or more fastening parts, so that each fastening part fastens into another object, and the soldering component has a solderable surface for soldering to an assembling part of the object, the assembling part of the object is preset with a tin soldering layer, which is heated and soldered the soldering component and the assembling part of the object.
SOLDERING COMPONENT AND METHOD OF ASSEMBLING SOLDERING COMPONENT TO OBJECT
The disclosure provides a soldering component and a method of assembling a soldering component to objects, the soldering component comprises a body part and an assembling part, the assembling part is for combining to the object, the body part has a snap-fit part, the snap-fit part has an elastic retracting space, and the elastic retracting space can elastically retract two or more fastening parts, so that each fastening part fastens into another object, and the soldering component has a solderable surface for soldering to an assembling part of the object, the assembling part of the object is preset with a tin soldering layer, which is heated and soldered the soldering component and the assembling part of the object.
BRAZING APPARATUS AND METHOD FOR ANODE TARGET PLATE
A brazing apparatus and method for brazing an anode target plate of an X-ray generator are disclosed. The brazing apparatus comprises: a vacuum part for providing, during brazing, a vacuum environment at least for a target plate main body formed of an alloy, a brazing material, and a substrate; an induction brazing part for applying an induction current to the target plate main body, the brazing material and the substrate in the vacuum part so as to achieve heating to a temperature higher than the melting point of the brazing material, causing the substrate to be welded to the target plate main body through melting of the brazing material and a resulting reaction; and a directional energy welding part for applying a generated directional energy beam to a position of lower temperature determined on the target plate main body to perform heating.
BRAZING APPARATUS AND METHOD FOR ANODE TARGET PLATE
A brazing apparatus and method for brazing an anode target plate of an X-ray generator are disclosed. The brazing apparatus comprises: a vacuum part for providing, during brazing, a vacuum environment at least for a target plate main body formed of an alloy, a brazing material, and a substrate; an induction brazing part for applying an induction current to the target plate main body, the brazing material and the substrate in the vacuum part so as to achieve heating to a temperature higher than the melting point of the brazing material, causing the substrate to be welded to the target plate main body through melting of the brazing material and a resulting reaction; and a directional energy welding part for applying a generated directional energy beam to a position of lower temperature determined on the target plate main body to perform heating.