A radiative heat collective bonder or gangbonder for packaging a semiconductor die stack is provided. The bonder generally includes a shroud positioned at least partially around the die stack and a radiative heat source positioned inward of the shroud and configured to emit a radiative heat flux in a direction away from the shroud. The bonder may further include a bondhead configured to contact the backside of the topmost die in the die stack and optionally include another bondhead configured to contact a substrate beneath the die stack. The radiative heat source may be configured to direct the radiative heat flux to at least a portion of the die stack to reduce a vertical temperature gradient in the die stack. One or both of the bondheads may be configured to concurrently direct a conductive heat flux into the die stack.

A method of using an amalgamation preform includes providing mating bonding surfaces and placing a particle-liquid mixture corresponding to the amalgamation preform between the mating bonding surfaces. The particle-liquid mixture contains a plurality of types of solid particles and a base metal in a liquid form, and the plurality of types of solid particles at least includes reactive particles reactable with the base metal and non-reactive magnetic particles. A first magnetic field is applied to the particle-liquid mixture to magnetically disperse the plurality of types of solid particles in the liquid base metal to form a particle-liquid dispersion; and a second magnetic field is applied to cure the particle-liquid dispersion to allow reactions between the reactive particles and the base metal.

A method of using an amalgamation preform includes providing mating bonding surfaces and placing a particle-liquid mixture corresponding to the amalgamation preform between the mating bonding surfaces. The particle-liquid mixture contains a plurality of types of solid particles and a base metal in a liquid form, and the plurality of types of solid particles at least includes reactive particles reactable with the base metal and non-reactive magnetic particles. A first magnetic field is applied to the particle-liquid mixture to magnetically disperse the plurality of types of solid particles in the liquid base metal to form a particle-liquid dispersion; and a second magnetic field is applied to cure the particle-liquid dispersion to allow reactions between the reactive particles and the base metal.

Provided is an apparatus for attaching semiconductor parts. The apparatus includes a substrate loading unit, at least one semiconductor part loader, a first vision examination unit, at least one semiconductor part picker, at least one adhesive hardening unit, and a substrate unloading unit, wherein the substrate loading unit supplies a substrate on which semiconductor units are arranged, the at least one semiconductor part loader supplies semiconductor parts, the first vision examination unit examines arrangement states of the semiconductor units, the at least one semiconductor part picker mounts semiconductor parts in the semiconductor units, the at least one adhesive hardening unit hardens and attaches adhesives interposed between the semiconductor units and the semiconductor parts, and the substrate unloading unit releases the substrate on which semiconductor parts are mounted. The adhesive hardening units restrictively transmit a heat source only to at least one semiconductor unit, which is to be hardened.

A component includes a first part in which a first junction part is configured, a second part in which a second junction part and a cross junction part intersecting the second junction part are configured. The second junction part and the first junction part are welded at a preceding weld. The component also includes a third part in which a third junction part is configured. A part of the third junction part is overlapped with an opposite part of the first junction part, a remaining part of the third junction part is overlapped with the cross junction part, and the first part and the second part are welded to the third part at a following weld at each of the overlapped parts.

A laser processing head can be used for joining (e.g., welding, brazing, soldering, etc.) workpieces. A collimator collimates laser light, which passes to a beam splitter. The beam splitter has anti-reflective and high-reflective coatings on peripheral and inner areas of the beam splitter. The beam splitter splits the collimated light into central or inner light from the inner area and peripheral light from the peripheral area. A main output in communication with the beam splitter directs at least the peripheral light into a main beam toward the workpieces. For example, a cable can feed a brazing wire adjacent the main beam for brazing the workpieces together. Meanwhile, a secondary output in communication with the beam splitter directs at least the central light into a secondary beam, which can be used to pre-heat the workpiece, post-heat the workpiece, or remove any surface coating from the workpiece.

A soldering apparatus that applies a processing light for melting a solder disposed on a circuit board, includes: a light irradiation apparatus that includes a Galvano mirror and that applies the processing light through the Galvano mirror; a detection apparatus that detects a light from the circuit board and that generates at least one of image data and shape data; a robot arm that is provided with the light irradiation apparatus and the detection apparatus and that includes a driver that moves the light irradiation apparatus and the detection apparatus; and a control apparatus that controls a direction of the Galvano mirror such that the processing light from the light irradiation apparatus that is displaced with the detection apparatus is applied to a same position, on the basis of at least one of the data that are changed in accordance with a displacement of the detection apparatus.

A laser soldering device includes a laser source, a lens group, a temperature sensor, and a feedback controller. The laser source emits a laser beam, which is power-adjustable, according to a control signal. The temperature sensor receives infrared rays radiated when the laser beam is irradiated to the soldering point to detect the temperature of the soldering point, and correspondingly outputs a sensing signal according to the detected temperature. When the detected temperature falls into a first temperature range based on a target temperature, the feedback controller executes a PID algorithm to calculate a predicted error value according to an error value between the detected temperature and the target temperature. The feedback controller controls the laser source according to the predicted error value, and adjusts the power of the laser beam accordingly, so that the detected temperature can be substantially equal to the target temperature.

solder connection that connects a contact pad on a first surface to a strip-shaped conductor. The strip-shaped conductor has a widening at one end and a through opening therein. A solder ball is located in the opening and connects the end of the conductor to the contact pad.

Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.