Patent classifications
B23K1/008
STRUCTURE OF ASSEMBLY GRASP FOR PALLADIUM-ALLOY TUBES AND METHOD FOR MANUFACTURING THE SAME
A structure of assembly grasp for palladium-alloy tubes and the manufacturing method thereof are described. The structure of assembly grasp for palladium-alloy tubes includes a grasp with a plurality of holes, a plurality of palladium-alloy tubes inserted into the plurality of holes, and an intermetallic compound layer between the palladium-alloy tubes and the inner sidewalls of the plurality of holes.
Paste dispensing transfer system and method for a stencil printer
A paste dispensing transfer system of a stencil printer is configured to print an assembly material on an electronic substrate. The transfer system includes a paste cartridge mechanism coupled to a print head assembly of the stencil printer, and a rotary indexing mechanism coupled to a frame of the stencil printer. The paste dispensing transfer system is configured to transfer a used paste cartridge from the print head assembly to the rotary indexing mechanism supported by the frame and to transfer a new paste cartridge from the rotary indexing mechanism to the print head assembly.
Electrostatic Chuck For Clamping In High Temperature Semiconductor Processing And Method Of Making Same
An electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C to 750 C. The top surface may be sapphire. The top surface is attached to the lower portion of the electrostatic chuck using a braze layer able to withstand corrosive processing chemistries. A method of manufacturing an electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C to 750 C.
Method of manufacturing electronic device
An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head.
Method of manufacturing electronic device
An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head.
HEAT EXCHANGER
A heat exchanger includes: a header that extends in a first direction; and a plurality of heat transfer tubes that extend in a second direction crossing the first direction, each of which has one end connected to the header, and that are arranged in the first direction at intervals. The header includes: a header body having a tubular shape, a first member through which the one end of each of the heat transfer tubes extends, and a second member positioned between the header body and the first member in the second direction. The second member includes: a base portion that extends in the first direction, and a plurality of protruding portions that extend from the base portion toward the first member in the second direction.
SINTER-BRAZED COMPONENT
It is an object of the present invention to effectively suppress the overflow of brazing material from each joint of a sinter-brazed component, such as a planetary carrier, obtained by brazing a plurality of members together. According to the present invention, there is provided a sinter-brazed component obtained by mating and joining a first member having a first bonding surface and a second member having a second bonding surface to each other. Brazing material is provided between the first bonding surface and the second bonding surface. The first bonding surface has a first recess, the first recess having an inner peripheral wall and a bottom surface. The inner peripheral wall extends along and on an inner side of a profile line of the first bonding surface.
BONDING MATERIAL AND BONDING METHOD USING SAME
There is provided an inexpensive bonding material, which can be easily printed on articles to be bonded to each other and which can suppress the generation of voids in the bonded portions of the articles to be bonded to each other, and a bonding method using the same. In a bonding material of a copper paste which contains a copper powder containing 0.3% by weight or less of carbon and having an average particle diameter of 0.1 to 1 μm, and an alcohol solvent, such as a monoalcohol, a diol, a triol or a terpene alcohol, the content of the copper powder is in the range of from 80% by weight to 95% by weight, and the content of the alcohol solvent is in the range of from 5% by weight to 20% by weight.
ARRANGEMENT FOR FORMING A CONNECTION
An arrangement includes a chamber, a heating element arranged in the chamber, wherein the heating element, when a first connection partner with a pre-connection layer formed thereon is arranged in the chamber, is configured to heat the first connection partner and the pre-connection layer, thereby melting the pre-connection layer, and a cooling trap. During the process of heating the first connection partner with the pre-connection layer formed thereon, the cooling trap has a temperature that is lower than the temperature of all other components of or in the chamber such that liquid evaporating from the pre-connection layer is attracted by and condenses on the cooling trap.
Composite braze liner for low temperature brazing and high strength materials
An apparatus, material and method for forming a brazing sheet has a composite braze liner layer of low melting point aluminum alloy and 4000 series braze liner. The low melting point layer of the composite braze liner facilitates low temperature brazing and decrease of the diffusion of magnesium from the core into the composite braze liner. The reduction of magnesium diffusion also lowers the formation of associated magnesium oxides at the braze joint interface that are resistant to removal by Nocolok flux, thereby facilitating the formation of good brazing joints through the use of low temperature controlled atmosphere brazing (CAB) and Nocolok flux. The apparatus also enables the production of brazing sheet materials with high strength and good corrosion property.