Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

A Vacuum Insulating Glazing Unit (VIGU) comprises two or more glass lites (panes) spaced apart from one another and hermetically bonded to an edge seal assembly therebetween. The resulting cavity between the lites is evacuated to create at least one insulating vacuum cavity within which are disposed a plurality of stand-off members to maintain separation between the lites. The edge seal assembly is preferably compliant in the longitudinal (i.e., edgewise) direction to allow longitudinal relative motion between the two lites (e.g., from thermal expansion). The longitudinal compliance may be obtained by imprinting a three-dimensional pattern into the edge seal material. The edge seal assembly is preferably bonded to the lites with a first bond portion that is hermetic and a second bond portion that is load-resistant. Methods for producing VIGUs and/or compliant edge seal assemblies and VIGU and edge seal apparatus are disclosed.

A Vacuum Insulating Glazing Unit (VIGU) comprises two or more glass lites (panes) spaced apart from one another and hermetically bonded to an edge seal assembly therebetween. The resulting cavity between the lites is evacuated to create at least one insulating vacuum cavity within which are disposed a plurality of stand-off members to maintain separation between the lites. The edge seal assembly is preferably compliant in the longitudinal (i.e., edgewise) direction to allow longitudinal relative motion between the two lites (e.g., from thermal expansion). The longitudinal compliance may be obtained by imprinting a three-dimensional pattern into the edge seal material. The edge seal assembly is preferably bonded to the lites with a first bond portion that is hermetic and a second bond portion that is load-resistant. Methods for producing VIGUs and/or compliant edge seal assemblies and VIGU and edge seal apparatus are disclosed.

A vacuum insulated glass unit comprises first and second glass panes, each defining interior and exterior surfaces and lateral edges. The interior surfaces of the panes are opposing and spaced apart to define an inter-pane gap. A band of metal solder extends continuously between the interior surfaces and continuously around the peripheries of the panes but is inset from the lateral edges, thus defining an inter-pane cavity surrounded by the solder band and a channel disposed between the band and the lateral edges. The solder band is attached with hermetic glass-to-metal bonds to the interior surfaces of the panes, whereby the cavity is hermetically sealed with respect to the panes. A plurality of stand-offs is disposed within the cavity and extends between the interior surfaces. An adhesive material is disposed within the channel, extending between the interior surfaces and structurally bonding the panes across the inter-pane gap.

A vacuum insulated glass unit comprises first and second glass panes, each defining interior and exterior surfaces and lateral edges. The interior surfaces of the panes are opposing and spaced apart to define an inter-pane gap. A band of metal solder extends continuously between the interior surfaces and continuously around the peripheries of the panes but is inset from the lateral edges, thus defining an inter-pane cavity surrounded by the solder band and a channel disposed between the band and the lateral edges. The solder band is attached with hermetic glass-to-metal bonds to the interior surfaces of the panes, whereby the cavity is hermetically sealed with respect to the panes. A plurality of stand-offs is disposed within the cavity and extends between the interior surfaces. An adhesive material is disposed within the channel, extending between the interior surfaces and structurally bonding the panes across the inter-pane gap.

A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.

A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.

An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.

An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.

A bonding target member 1 having a solid bonding material 3 with aluminum as a main component is interposed between a metal member 2 and a ceramic member 4 and an elastic member 12 are pressurized by a pressurizing section 13 and a bonding tool section 15 of a resonator 14 in a vertical direction. The bonding tool section 15 of the resonator 14 resonates with sound vibration or ultrasound vibration transmitted from an oscillator 16. An interfacial portion between the metal member 2 and the bonding material 3 with aluminum as a main component and an interfacial portion between the bonding material 3 with aluminum as a main component and the ceramic member 4 each receive pressurization and vibration energy to be bonded together. The metal member 2 and the ceramic member 4 can be bonded together at ordinary temperature in the atmosphere with the bonding material 3 with aluminum as a main component. When the ceramic member 4 has a thickness resistant to pressurization and vibration energy at the time of bonding to resist crack, the elastic member 12 may be disposed on a metal member 2 side, or may not be used.