Solder housed in flow tank 20 is ejected from nozzle 22 by a pump provided inside flow tank 20. Jet motor 26 that drives the pump is provided outside flow tank 20, and cooling device 30 is provided between flow tank 20 and jet motor 26. Cooling device 30 includes cooling pipe 52 that is formed folded back on itself. Nitrogen gas is supplied from an upper end of cooling pipe 52, flows along cooling pipe 52, and flows out of a lower end of cooling pipe 52 so as to be supplied to flow tank 20. The temperature of the nitrogen gas increases due to heat dissipated from jet motor 26, thus lowering the temperature of jet motor 26. Heat is transferred from jet motor 26 to the nitrogen gas, and jet motor 26 is cooled satisfactorily.

A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few m and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG. 1, this apparatus comprises a solder bath 17 of accommodating the molten solder 7; a second conveying section 23 for drawing up a strip member 31 from the solder bath; and a blower section 19 for blowing hot gas on the strip member 31 immediately after being drawn up from the solder bath by a second conveying section 23; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder 7. According to this configuration, the excess molten solder 7 can be trimmed from the strip member 31 corresponding to composition of the molten solder 7. Thus, the film thickness of the molten solder 7 coated on the strip member 31 can be controlled evenly and in increments of a few m.

A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few m and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG. 1, this apparatus comprises a solder bath 17 of accommodating the molten solder 7; a second conveying section 23 for drawing up a strip member 31 from the solder bath; and a blower section 19 for blowing hot gas on the strip member 31 immediately after being drawn up from the solder bath by a second conveying section 23; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder 7. According to this configuration, the excess molten solder 7 can be trimmed from the strip member 31 corresponding to composition of the molten solder 7. Thus, the film thickness of the molten solder 7 coated on the strip member 31 can be controlled evenly and in increments of a few m.

A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and an adjustable wave solder nozzle assembly adapted to create a solder wave. The adjustable wave solder nozzle assembly has a first curve plate and a second curve plate that together define a nozzle. The second curve plate is movable with respect to the first curve plate between a close proximate position in which the second curve plate is proximate the first curve plate and a spaced apart position in which the second curve plate is spaced from the first curve plate to adjust a width of the nozzle.

The embodiments of disclosure disclose a welding tray, which includes a tray frame (18) and a supporting device (16), wherein the supporting device (16) includes a supporting component and an adjustable connecting component, the supporting component includes a supporting surface, the adjustable connecting component connects the supporting component to a side edge of the tray frame (18), and a distance between the supporting surface and a bearing surface of the tray frame (18) is adjustable.

Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

A soldering device, particularly solder pots for selective wave soldering or a fluxer device, having a receiving means configured to store a liquid, particularly a solder reservoir, configured to store a solder, particularly a liquid solder, or having a flux tank configured to store flux, with a nozzle, particularly a solder nozzle or fluxer nozzle, and having a pump, particularly a solder pump or a flux pump, configured to deliver the liquid from the receiving means through the nozzle in the direction of a Z-axis.

A method for the manufacture of insoluble lead anodes, with low segregation of the constituent elements of the anodic alloy for the electrowinning of metals, free of buckling, used in electrolytic processes, which comprises: Obtaining a continuous plate (4) of lead or lead alloy 10 to 30 mm thick by 900 to 1,100 mm wide by means of a continuous casting process; Cut the continuous plate (4) according to a determined length obtaining a pre-plate (6) that will give the length of one or more plates of the anode (8); Roll the lead or lead alloy pre-plate (6) using a cold rolling mill (7) to a thickness of 6 to 12 mm, keeping the cold rolling temperature of the pre-plate under 60 C., obtaining the anode plate(s) (8); Remove the anode plate (8) from the rolling mill (7); Weld (12) a copper bar (10) to the upper end of the anode plate (11).

A method for the manufacture of insoluble lead anodes, with low segregation of the constituent elements of the anodic alloy for the electrowinning of metals, free of buckling, used in electrolytic processes, which comprises: Obtaining a continuous plate (4) of lead or lead alloy 10 to 30 mm thick by 900 to 1,100 mm wide by means of a continuous casting process; Cut the continuous plate (4) according to a determined length obtaining a pre-plate (6) that will give the length of one or more plates of the anode (8); Roll the lead or lead alloy pre-plate (6) using a cold rolling mill (7) to a thickness of 6 to 12 mm, keeping the cold rolling temperature of the pre-plate under 60 C., obtaining the anode plate(s) (8); Remove the anode plate (8) from the rolling mill (7); Weld (12) a copper bar (10) to the upper end of the anode plate (11).

A solder dross recovery module has gears and a waste collection chamber positioned within a solder pot. The gears are configured to draw in solder dross from a surface of molten solder stored in the solder pot. The gears apply pressure to the solder dross so as to separate solder from the solder dross. The recovered solder is returned to the molten solder in the solder pot. A resulting waste material is collected in the waste collection chamber.