A soldering device comprising: a first treatment part that sets a component having an electrode; a second treatment part separated by an opening-closing unit, the second treatment part sending the component on to a third treatment part; the third treatment part separated by an opening-closing unit, the third treatment part causing the component to contact an organic fatty-acid-containing solution and move horizontally; a fourth treatment part having a unit for moving the component to a space portion and causing molten solder to adhere to the electrode; and a unit for removing excess molten solder; a fifth treatment part for horizontally moving the component moved downward by the fourth treatment part; a sixth treatment part separated by an opening-closing unit, the sixth treatment part sending the component on to a seventh treatment part; and the seventh treatment part separated by an opening-closing unit, the seventh treatment part taking out the component.

A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

An apparatus for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The physiological sensor is operable to analyze biological fluids such as sweat.

The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The physiological sensor is operable to analyze biological fluids such as sweat.

A guide vane has a devised guide configuration for changing a flow direction of molten solder. The guide vane comprises a half-cylindrical plate 11 having a prescribed inner surface shape and a prescribed height, being stood on a prescribed board and changing a flow direction of fluid; and a half-cylindrical plate 12 having a prescribed inner surface shape and a prescribed height, being stood on the board 13 on which the first member 11 is stood and changing the flow direction of the fluid as shown in FIG. 1. The half-cylindrical plate 11 and the half-cylindrical plate 12 are faced so that an inner surface of the half-cylindrical plate 11 is faced to an edge of the half-cylindrical plate 12 and an inner surface of the half-cylindrical plate 12 is faced to an edge of the half-cylindrical plate 11. This structure allows to jet the molten solder to a target place and uniformize a widthwise distribution of the jetting height of the molten solder.

An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder is applied to the second surface. The solder penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to join a thermal radiator and/or electronic contact of the electronic device to the vias. The solder further remains in the cavity to form a corresponding heat sink.

Solder housed in flow tank 20 is ejected from nozzle 22 by a pump provided inside flow tank 20. Jet motor 26 that drives the pump is provided outside flow tank 20, and cooling device 30 is provided between flow tank 20 and jet motor 26. Cooling device 30 includes cooling pipe 52 that is formed folded back on itself. Nitrogen gas is supplied from an upper end of cooling pipe 52, flows along cooling pipe 52, and flows out of a lower end of cooling pipe 52 so as to be supplied to flow tank 20. The temperature of the nitrogen gas increases due to heat dissipated from jet motor 26, thus lowering the temperature of jet motor 26. Heat is transferred from jet motor 26 to the nitrogen gas, and jet motor 26 is cooled satisfactorily.

A method of applying solder includes providing a first roller and a second roller, where at least one of the first and second rollers has an outer surface comprising a solder wicking material. A metallic article is provided, the metallic article having a first side and a second side, and having an opening extending from the first side to the second side. The metallic article is dipped in solder, where the dipping forms an initial coating of solder on the metallic article. After the dipping, the metallic article is fed between the first and second rollers. The wicking material removes solder from the metallic article, such that a solder thickness of the initial coating on the metallic article is reduced after exiting the first and second rollers.

A method of applying solder includes providing a first roller and a second roller, where at least one of the first and second rollers has an outer surface comprising a solder wicking material. A metallic article is provided, the metallic article having a first side and a second side, and having an opening extending from the first side to the second side. The metallic article is dipped in solder, where the dipping forms an initial coating of solder on the metallic article. After the dipping, the metallic article is fed between the first and second rollers. The wicking material removes solder from the metallic article, such that a solder thickness of the initial coating on the metallic article is reduced after exiting the first and second rollers.