A lead-free solder composition includes tin, titanium and zinc. Based on 100 parts by weight of the total weight of tin, titanium and zinc, tin is present in an amount ranging from 20 to 40 parts by weight, and titanium is present in an amount ranging from 0.01 to 0.15 parts by weight.

A lead-free solder composition includes tin, titanium and zinc. Based on 100 parts by weight of the total weight of tin, titanium and zinc, tin is present in an amount ranging from 20 to 40 parts by weight, and titanium is present in an amount ranging from 0.01 to 0.15 parts by weight.

A soldering apparatus, that moves a jet nozzle while ensuring that molten solder does not spill to the outside of the jet nozzle, is provided. The soldering apparatus includes a solder tank storing the molten solder, a jetting mechanism including the jet nozzle and a pump, which pumps the molten solder stored in the solder tank, an XY-direction moving mechanism that moves the solder tank, and a control device that controls the acceleration and deceleration of the solder tank according to the height of the molten solder protruding upwards from a tip of the jet nozzle or the height of the molten solder protruding upwards from the tip of the jet nozzle according to the acceleration and deceleration of the solder tank.

There is provided a flux applying apparatus configured to jet and apply a flux to a target. A main tank is configured to accommodate therein the flux. A feed pipe is configured to pass therethrough the flux which is to be pneumatically transported with a gas pressure when an inside of the main tank is at a positive pressure. A nozzle is configured to jet the flux transported via the feed pipe. A sub-tank is configured to trap therein the flux jetted from the nozzle. A return pipe is configured to communicate the sub-tank and the main tank each other and to return the flux to the main tank with a gas pressure when the inside of the main tank is at a negative pressure.

Provided is a jet nozzle that varies a width of a flow of jetted molten solder. The jet nozzle contains a nozzle main body having a channel section at its part and a molten solder flow width varying member that varies a width of the upper opening end of the nozzle main body by a slide of the molten solder flow width varying member within the channel section of the nozzle main body to vary a width of the molten solder flow jetted from the upper opening end of the nozzle main body. The molten solder flow width varying member includes a molten solder flow width varying plate that varies the width of the molten solder flow, a rectangular rectifying piece that extends along a slide direction of the molten solder flow width varying member, and a sliding shaft that slides the rectifying piece.

The invention relates to a soldering module (3) for the, in particular selective, soldering of components to a circuit board (14), having a soldering nozzle (32) for creating a solder wave. It is proposed that the soldering module (3) comprises a linear conveyor (8), in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board (14) by moving the circuit board (14) in a conveying direction over the solder wave, and that the linear conveyor (8) is tiltable, in particular about a first tilting axis (23).

A self-correcting wave soldering machine for soldering a RGB in an SMT manufacturing system. The wave soldering machine includes at least one thermal infrared camera that generates thermal images of the RGB so as to provide thermal imaging processing to monitor, characterize and predict processing temperatures. The wave soldering machine generates a heat map using the thermal images and compares the heat map to a thermal gradient to provide real time profiling by digitally connecting it to heating and other mechanically controlled systems, such as flux dispensing, conveyor speed and parallelism of the wave soldering machine.

A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.

In some examples, the disclosure describes a technique that includes covering a joint surface of a first part including a titanium aluminum (TiAl) alloy with a braze material including aluminum, where covering the joint surface includes at least one of electroplating the braze material on the joint surface, hot dipping the braze material on the joint surface, or positioning a foil of the braze material adjacent to the joint surface, positioning a second part including a titanium alloy in contact with the first part to define a joint region, where the joint region includes the braze material interposed between the second part and the joint surface of the first part, and heating the joint region to at least partially melt the braze material to form a braze joint connecting the first part to the second part.

A soldering device comprising: a first treatment part that sets a component having an electrode; a second treatment part separated by an opening-closing unit, the second treatment part sending the component on to a third treatment part; the third treatment part separated by an opening-closing unit, the third treatment part causing the component to contact an organic fatty-acid-containing solution and move horizontally; a fourth treatment part having a unit for moving the component to a space portion and causing molten solder to adhere to the electrode; and a unit for removing excess molten solder; a fifth treatment part for horizontally moving the component moved downward by the fourth treatment part; a sixth treatment part separated by an opening-closing unit, the sixth treatment part sending the component on to a seventh treatment part; and the seventh treatment part separated by an opening-closing unit, the seventh treatment part taking out the component.