A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.

Method for operating a soldering device and soldering device, wherein a graphic representation of at least part of the soldering device is captured, wherein an instantaneous operating state of the soldering device is determined by means of automated processing of the graphic representation dependent on information about the soldering device from the graphic representation, characterized in that the information about the soldering device is determined dependent on a reference representation of at least part of the soldering device, wherein the reference representation is captured as a graphic representation or wherein the reference representation is read as a graphic representation from a memory, and in that the reference representation characterizes a degree of oxidation of solder (122) when the solder (122) flows out over at least part of a surface (124) of a soldering nozzle (116).

A jet soldering apparatus has a first housing; a first supply port provided on the first housing and configured to provide molten solder; a second housing; and a second supply port provided on the second housing and configured to provide the molten solder. The molten solder supplied from the first supply port and the molten solder supplied from the second supply port are mixed. The mixed molten solder is not separated from a substrate conveyed by a conveyance unit between the first supply port and the second supply port.

Aspects of the technology employ significantly reduce void formation beneath critical components on a printed circuit board (PCB). This is accomplished using advanced fabrication techniques that include employing alignment fixtures and solder standoffs to position duplexers, using nitrogen gas during the reflow process, and maintaining specific temperature and “time above liquideous” (TAL) controls. Certain types of components, such as duplexers used in communication circuit boards, can be highly susceptible to voids. Because such components are relatively large and block x-rays, it is challenging to determine whether voids have been formed beneath them. Thus, in many instances conventional fabrication techniques are insufficient to produce viable circuit boards that minimize void formation within acceptable tolerances. It may be mission critical to minimize voids, such as for PCBs used in communication modules deployed on high altitude platforms intended to operate in the stratosphere for extended periods of time.

The invention relates to a method for operating a soldering system for selective wave soldering comprising at least one solder crucible, the solder crucible comprising a solder reservoir, a solder nozzle and a solder pump, the solder pump being designed to guide the liquid solder out from the solder reservoir through the solder nozzle for generating a standing wave from liquid solder. The invention relates, in particular, to a method for cleaning a solder nozzle comprising the following steps: conveying solder from the solder reservoir at a first pump capacity which is adjusted in such a way that a standing wave of liquid solder is generated at a solder level which is below an upper edge of the nozzle outlet of the solder nozzle; introducing a cleaning agent into the nozzle outlet of the solder nozzle; increasing the pumping capacity of the solder pump to a second pump capacity such that the cleaning agent flows over the upper edge of the nozzle such that the cleaning agent is guided to an outer side of the solder nozzle.

A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.

A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.

A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.

The high-efficiency soldering apparatus for a winding head of a flat-wire motor includes a support base, a solder tray, a solder spot isolation and limit plate, a shaft lever and a movable tray. The solder tray is provided at the center of the support base. The solder spot isolation and limit plate is provided on the solder tray. The shaft lever is provided on the support base. The movable tray is provided on the shaft lever. The movable tray is located above the solder tray. The movable tray moves vertically along the shaft lever. A stator is placed at the center of the movable tray, and a winding head of the stator extends below the movable tray.

The high-efficiency soldering apparatus for a winding head of a flat-wire motor includes a support base, a solder tray, a solder spot isolation and limit plate, a shaft lever and a movable tray. The solder tray is provided at the center of the support base. The solder spot isolation and limit plate is provided on the solder tray. The shaft lever is provided on the support base. The movable tray is provided on the shaft lever. The movable tray is located above the solder tray. The movable tray moves vertically along the shaft lever. A stator is placed at the center of the movable tray, and a winding head of the stator extends below the movable tray.