Disclosed is a Ni—Cr-based brazing alloy including, on the basis of mass %: 15%<Cr<30%; 3%<P<12%; 0%≤Si<8%; 0.01%<C<0.06%; 0%≤Ti+Zr<0.1%; 0.01%<V<0.1%; 0%≤Al<0.01%; 0.005%<O<0.025%; 0.001%<N<0.050%; 0%≤Nb<0.1%; and the balance being Ni and incidental impurities. Inequality (1): 0.2≤0.24V %/C %≤1.0 is satisfied if the alloy contains no Nb, and Inequality (2): 0.2≤(0.24V %+0.13Nb %)/C %≤1.0 is satisfied if the alloy contains Nb. Also disclosed is an inexpensive Ni—Cr-based brazing alloy containing a trace amount of V for use in the production of stainless steel heat exchangers and other steel articles. The alloy has a low liquidus temperature and high corrosion resistance, and achieves high brazing strength.

Disclosed is a Ni—Cr-based brazing alloy including, on the basis of mass %: 15%<Cr<30%; 3%<P<12%; 0%≤Si<8%; 0.01%<C<0.06%; 0%≤Ti+Zr<0.1%; 0.01%<V<0.1%; 0%≤Al<0.01%; 0.005%<O<0.025%; 0.001%<N<0.050%; 0%≤Nb<0.1%; and the balance being Ni and incidental impurities. Inequality (1): 0.2≤0.24V %/C %≤1.0 is satisfied if the alloy contains no Nb, and Inequality (2): 0.2≤(0.24V %+0.13Nb %)/C %≤1.0 is satisfied if the alloy contains Nb. Also disclosed is an inexpensive Ni—Cr-based brazing alloy containing a trace amount of V for use in the production of stainless steel heat exchangers and other steel articles. The alloy has a low liquidus temperature and high corrosion resistance, and achieves high brazing strength.

A heat exchanger includes a first manifold, aa second manifold, at least one heat exchange tube segment extending between and fluidly coupling the first manifold and the second manifold, and a fin having a non-linear configuration. A portion of the fin is affixed to an adjacent surface of the at least one heat exchange tube segment via a braze joint. The braze joint has a length, measured parallel to a length of the at least one heat exchange tube segment, less than or equal to 650 micrometers.

An electronic component includes a lead frame; a semiconductor chip arranged above the lead frame; and a connection layer sequence arranged between the lead frame and the semiconductor chip, wherein the connection layer sequence includes a first intermetallic layer including gold and indium or gold, indium and tin, a second intermetallic layer including indium and a titanium compound, indium and nickel, indium and platinum or indium and titanium, and a third intermetallic layer including indium and gold.

The invention relates to a method for producing a metal-ceramic substrate and to a furnace suitable for carrying out the method. With the method, a metal-ceramic substrate with increased thermal and current conductivity can be obtained. The method comprises the steps of providing a stack containing a ceramic body, a metal foil, and a solder material in contact with the ceramic body and the metal foil, the solder material comprising a metal having a melting point of at least 700° C., a metal having a melting point of less than 700° C., and an active metal, and heating the stack, the stack passing through a heating zone for heating.

The present invention relates to a method for producing a metal-ceramic substrate. The method has the following steps: providing a stack containing a ceramic body, a metal foil, and a solder material in contact with the ceramic body and the metal foil, wherein the solder material has: a metal having a melting point of at least 700° C., a metal having a melting point of less than 700° C., and an active metal; and heating the stack, wherein at least one of the following conditions is satisfied: the high temperature heating duration is no more than 60 min; the peak temperature heating duration is no more than 30 min; the heating duration is no more than 60 min.

In a mixed composition coating material for brazing, when a total mass of a solid material, an organic solvent, and water is defined as 100 mass %, the solid material are contained in an amount of 30 mass % or greater and 80 mass % or less with respect to the whole coating material, the organic solvent and the water is contained in a total amount of 20 mass % or greater and 70 mass % or less with respect to the whole coating material, and the water is contained in an amount of 0.4 mass % or greater and 2.5 mass % or less with respect to the whole coating material.

In a mixed composition coating material for brazing, when a total mass of a solid material, an organic solvent, and water is defined as 100 mass %, the solid material are contained in an amount of 30 mass % or greater and 80 mass % or less with respect to the whole coating material, the organic solvent and the water is contained in a total amount of 20 mass % or greater and 70 mass % or less with respect to the whole coating material, and the water is contained in an amount of 0.4 mass % or greater and 2.5 mass % or less with respect to the whole coating material.

A mounting wiring board, containing a base, an electrode portion disposed on the base, and a heat generation pattern disposed on the electrode portion and to be heated by a standing wave of a microwave, in which an occupation area of the heat generation pattern is smaller than an area of an upper surface of the electrode portion; an electronic device mounting board using the mounting wiring board; a method of mounting the electronic device; a microwave heating method, which contains heating an object to be heated provided via the heat generation pattern; and a microwave heating apparatus.

Additive manufacturing techniques are used to achieve customized preforms for repair or manufacture of turbomachinery. A method of modifying a section of a product includes forming, a preform set to fit the section. A base material is selected with properties desired for the modification of the section. A binder is selected that vaporizes at a temperature below a melting point of the base material. The preform set is built by the selective application of the binder to the base material to achieve design dimensions of the section when the preform is joined to the section. The section is prepared for effecting the extent of modification and the preform is positioned on the section. The section and the preform are heated to substantially eliminate the binder from the preform and then thermally processed to harden the preform and to bond the preform to the section.