A stainless-steel heat-exchanger port with a braze joint interface formed from a brazing filler material by vacuum melting and molding, including: a stainless-steel port, an annular groove provided at a to-be-brazed end face of the stainless-steel port, a brazing filler material correspondingly arranged in the annular groove, and a sealing cover for preventing overflowing of the brazing filler material when melted, wherein the brazing filler material is one of copper, brass, phosphorus copper, and silver brazing filler materials. A processing method for the stainless-steel heat-exchanger port with a braze joint interface formed from the brazing filler material by vacuum melting and molding.

A system includes a gas turbine component having a recessed portion with a recessed surface in a hard-to-weld (HTW) material. The system includes a plate disposed over the recessed portion. The plate has an easy-to-weld (ETW) material. The plate has an outer surface and an inner surface, and the inner surface faces the recessed portion. The system includes a braze material disposed within the recessed portion between the recessed surface and the inner surface of the plate. The braze material is configured to bond the recessed surface of the recessed portion with the inner surface of the plate when the braze material is heated to a brazing temperature. The system includes a filler material disposed on the outer surface of the plate disposed over the recessed portion. Application of the filler material to the outer surface of the plate is configured to heat the braze material to the brazing temperature.

A system includes a gas turbine component having a recessed portion with a recessed surface in a hard-to-weld (HTW) material. The system includes a plate disposed over the recessed portion. The plate has an easy-to-weld (ETW) material. The plate has an outer surface and an inner surface, and the inner surface faces the recessed portion. The system includes a braze material disposed within the recessed portion between the recessed surface and the inner surface of the plate. The braze material is configured to bond the recessed surface of the recessed portion with the inner surface of the plate when the braze material is heated to a brazing temperature. The system includes a filler material disposed on the outer surface of the plate disposed over the recessed portion. Application of the filler material to the outer surface of the plate is configured to heat the braze material to the brazing temperature.

A power transmission device and a method of manufacturing the same capable of shortening a shaft length and improving mountability are provided. A power transmission device according to the present disclosure includes a planetary carrier configured to support a pinion shaft pivotally supporting a pinion gear, rotatably support the pinion gear, and cause the pinion gear to revolve by rotation of the planetary carrier and a planetary carrier plate fixed fo face the planetary carrier on a side where the pinion gear is positioned, and including dog teeth integrally formed with the planetary carrier plate.

Physical vapor deposition target assemblies and methods of manufacturing such target assemblies are disclosed. An exemplary target assembly comprises a flow pattern including a plurality of arcs and bends fluidly connected to an inlet end and an outlet end.

Physical vapor deposition target assemblies and methods of manufacturing such target assemblies are disclosed. An exemplary target assembly comprises a flow pattern including a plurality of arcs and bends fluidly connected to an inlet end and an outlet end.

A method of manufacturing a hard-to-weld material by a beam-assisted additive manufacturing process is presented. The method includes depositing a first layer for the material onto the substrate, the first layer including a major fraction of a base material for the component and a minor fraction of a solder, depositing a second layer of the base material for the component and a thermal treatment of the layer arrangement. The thermal treatment includes a first thermal cycle at a first temperature above 1200° C. for a duration of more than 3 hours, a subsequent second thermal cycle at a second temperature above 1000° C. for more than 2 hours, and a subsequent third thermal cycle and a third temperature above 700° C. for more than 12 hours. A manufactured component is also presented.

A vertical bundle air-cooled heat exchanger, a finned tube assembly for an air cooled condenser and method for forming the same, and a system for removing thermal energy generated by radioactive materials. In one aspect, an air cooled condenser sized for industrial and commercial application includes an inlet steam distribution header for conveying steam, a condensate outlet header for conveying condensate, an array of tube bundles each having a plurality of finned tube assemblies having a bare steel tube with an exposed outer surface and a set of aluminum fins brazed directly onto the tube by a brazing filler metal. The steel tubes may be spaced apart by the aluminum fins and have an inlet end fluidly coupled to the inlet steam distribution header and an outlet end fluidly coupled to the outlet header. A forced draft fan may be arranged to blow air through the tube bundles.

The present invention relates to a method of bonding silicon parts using silicon powder and high-frequency heating device, the method comprising the steps of forming concave and convex coupling surfaces on the bonding surfaces of a lower ring and an upper ring; mounting the lower ring and the upper ring on a silicon part fusion bonding apparatus; injecting single crystal silicon powder into the concave and convex coupling surfaces on the bonding surfaces of the lower ring and the upper ring; and heating and fusing the bonding surfaces of the lower ring and the upper ring.

A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed.