A method includes positioning a braze material along a defect of a component of a turbine system, positioning a cover over the braze material, and focusing a heat source on the cover to melt the braze material along the defect.

A substrate includes a metal component on a surface. A polymeric layer is deposited on the surface using molecular layer deposition. The polymeric layer includes a metalcone and has a thickness from 1 nm to 20 nm. The polymeric layer is stable at room temperature, but will undergo a structural change at high temperatures. The polymeric layer can be annealed to cause a structural change, which can occur during soldering.

The invention relates to a laser brazing system, comprising a braze tool having a laser configured to emit a laser beam along a radiation path, and a braze wire tool being configured to guide a braze wire along a wire path intersecting the laser beam. The system comprises a jig comprising a first alignment surface and a first blocking surface, wherein the first alignment surface is configured to be in contact with the braze wire while the first blocking surface blocks at least a first part of the emitted laser beam, and a detector arranged in the radiation path and configured to detect the emitted light of the laser beam passing the jig.

The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber (74) sealed off from its surroundings by heating and melting solder material (16) which is arranged between the components (12A, 12B) to be connected. It is proposed that the components (12A, 12B) to be connected are provisionally connected with a bonding material (18) to form a solder group (10) in which the components (12A, 12B) are fixed relative to one another in a joining position.

The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber (74) sealed off from its surroundings by heating and melting solder material (16) which is arranged between the components (12A, 12B) to be connected. It is proposed that the components (12A, 12B) to be connected are provisionally connected with a bonding material (18) to form a solder group (10) in which the components (12A, 12B) are fixed relative to one another in a joining position.

A radiating structure assembly system includes a movable conveyor that supports fixtures. Work stations are spaced about the conveyor such that the fixtures are moved sequentially to position the fixtures at the plurality of work stations. A first work station includes a loading assembly for loading the radiating elements on the fixtures. A second work station includes a first automated vertical assembly machine for mounting a first printed circuit board to the radiating element. A third work station includes a second automated vertical assembly machine for mounting a second printed circuit board to the radiating element to create a dipole assembly. A holding device is movable with the conveyor aligns and supports the first and second printed circuit boards relative to the radiating element. A fourth work station includes an unloading assembly for removing the dipole assembly from the conveyor.

A method of pretinning a core wire for a guidewire having an elongate axis, comprising placing a ball of solder within a pocket in a soldering block; melting the ball of solder; holding a core wire over the ball of solder, with the elongate axis in a horizontal orientation; lowering a portion of the core wire into the ball of solder while maintaining the elongate axis in a horizontal orientation; removing the core wire from the ball of solder.

A method of pretinning a core wire for a guidewire having an elongate axis, comprising placing a ball of solder within a pocket in a soldering block; melting the ball of solder; holding a core wire over the ball of solder, with the elongate axis in a horizontal orientation; lowering a portion of the core wire into the ball of solder while maintaining the elongate axis in a horizontal orientation; removing the core wire from the ball of solder.

A component joining apparatus, which can realize positioning between a component and a substrate with high accuracy by avoiding influence of thermal expansion of the substrate at the time of joining the component to the substrate by heating at a high temperature, includes a component supply head holding a component and a heating stage heating and holding a substrate, in which a heating region where the heating stage contacts the substrate includes a joining region of the substrate in which the component is joined, and the substrate is larger than the heating stage and a peripheral part of the substrate does not contact the heating stage.

A component joining apparatus, which can realize positioning between a component and a substrate with high accuracy by avoiding influence of thermal expansion of the substrate at the time of joining the component to the substrate by heating at a high temperature, includes a component supply head holding a component and a heating stage heating and holding a substrate, in which a heating region where the heating stage contacts the substrate includes a joining region of the substrate in which the component is joined, and the substrate is larger than the heating stage and a peripheral part of the substrate does not contact the heating stage.