A wear-resistant armored cutting tool may be provided. The wear-resistant armored cutting tool may include a tool body, a bolster, at least one wear-resistant member, and a cutting tip. The bolster may be fixedly attached to the tool body with an end of a surface of the tool body disposed adjacent the bolster. The at least one wear-resistant member may be fixedly attached to the tool body. The at least one wear-resistant member may be disposed adjacent to the end of the surface of the tool body. The cutting tip may be fixedly attached to the bolster. The bolster, the at least one wear-resistant member, and the cutting tip may each have a material hardness which is greater than that of the tool body.

A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

A flux composition includes an aromatic resin including one benzene ring and one or two hydroxyl (—OH) groups, an activator selected from a group consisting of a dicarboxylic acid and a dicarboxylic anhydride, and a solvent.

A brazing sheet may be used for brazing under an atmosphere of an inert gas without flux. The brazing sheet may include at least three layers. The at least three layers may include a core material, a brazing material layer, and an intermediate layer. The at least three layers may be cladded by an outermost layer of the brazing material layer. The intermediate layer may be disposed on a face of the core material. The core material may be composed of a first aluminum alloy including at least one of (i) 0.20 weight % to 1.0 weight % of Cu, (ii) 0.8 weight % to 1.8 weight % of Mn, and (iii) 0.25 weight % to 1.5 weight % of Mg. The intermediate layer may be composed of a second aluminum alloy including 0.20 weight % or less of each of Si and Fe and 0.10 weight % or less of each of Cu, Mn, and Cr.

A method for producing a bonded body includes: a laminating step of forming a laminated body in which a first member and a second member are temporarily bonded to each other by providing a temporary bonding material including an organic material on at least one of a bonding surface of the first member and a bonding surface of the second member; and a bonding step of pressurizing and heating the laminated body in a laminating direction and bonding the first member and the second member to each other. In the bonding step, during a temperature increase process of heating the laminated body up to a predetermined bonding temperature, at least a pressurization load P2 at a decomposition temperature T.sub.D of the organic material included in the temporary bonding material is lower than a pressurization load P1 at the bonding temperature.

A manufacturing method is provided during which a plurality of first apertures are formed in a first plate to provide an apertured first plate. A plurality of second apertures are formed in a second plate to provide an apertured second plate. The apertured first plate and the apertured second plate are bonded to a base sheet to form a structure. The base sheet is bent to form a bend in the structure between the apertured first plate and the apertured second plate.

A manufacturing method is provided during which a plurality of first apertures are formed in a first plate to provide an apertured first plate. A plurality of second apertures are formed in a second plate to provide an apertured second plate. The apertured first plate and the apertured second plate are bonded to a base sheet to form a structure. The base sheet is bent to form a bend in the structure between the apertured first plate and the apertured second plate.

A method includes applying a first flux onto an electrode provided on a substrate and placing a solder material on the electrode, heating the substrate to form a solder bump on the electrode, deforming the solder bump to provide a flat surface or a depressed portion on the solder bump, applying a second flux to the solder bump; placing a core material on the solder bump, the core material including a core portion and a solder layer that covers a surface of the core portion, and heating the substrate to join the core material to the electrode by the solder bump and the solder layer.

A fixture assembly includes a first fixture portion, a second fixture portion that interfaces with the first fixture portion, and a sub-fixture movably mounted to the first fixture portion. A multiple of actuators selectively move the sub-fixture toward the second fixture portion. A method of manufacturing a fan blade includes deploying the sub-fixture from the first fixture portion to effectuate a peripheral diffusion bond to join the blade body and the cover of the fan blade.

A semiconductor device includes: a semiconductor die having a metal region; a substrate having a metal region; and a soldered joint between the metal region of the semiconductor die and the metal region of the substrate. One or more intermetallic phases are present throughout the entire soldered joint, each of the one or more intermetallic phases formed from a solder preform diffused into the metal region of the semiconductor die and the metal region of the substrate. The soldered joint has the same length-to-width aspect ratio as the semiconductor die.